JP2024508408A5 - - Google Patents

Info

Publication number
JP2024508408A5
JP2024508408A5 JP2023548785A JP2023548785A JP2024508408A5 JP 2024508408 A5 JP2024508408 A5 JP 2024508408A5 JP 2023548785 A JP2023548785 A JP 2023548785A JP 2023548785 A JP2023548785 A JP 2023548785A JP 2024508408 A5 JP2024508408 A5 JP 2024508408A5
Authority
JP
Japan
Prior art keywords
substrate
encapsulation layer
integrated device
package
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023548785A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024508408A (ja
Filing date
Publication date
Priority claimed from US17/191,550 external-priority patent/US12142577B2/en
Application filed filed Critical
Publication of JP2024508408A publication Critical patent/JP2024508408A/ja
Publication of JP2024508408A5 publication Critical patent/JP2024508408A5/ja
Pending legal-status Critical Current

Links

JP2023548785A 2021-03-03 2022-02-07 電磁干渉シールドおよび放熱のために構成された金属層を含むパッケージ Pending JP2024508408A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/191,550 US12142577B2 (en) 2021-03-03 2021-03-03 Package comprising metal layer configured for electromagnetic interference shield and heat dissipation
US17/191,550 2021-03-03
PCT/US2022/015521 WO2022186953A2 (en) 2021-03-03 2022-02-07 Package comprising metal layer configured for electromagnetic interference shield and heat dissipation

Publications (2)

Publication Number Publication Date
JP2024508408A JP2024508408A (ja) 2024-02-27
JP2024508408A5 true JP2024508408A5 (cg-RX-API-DMAC10.html) 2025-07-11

Family

ID=80623490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023548785A Pending JP2024508408A (ja) 2021-03-03 2022-02-07 電磁干渉シールドおよび放熱のために構成された金属層を含むパッケージ

Country Status (8)

Country Link
US (1) US12142577B2 (cg-RX-API-DMAC10.html)
EP (1) EP4302331A2 (cg-RX-API-DMAC10.html)
JP (1) JP2024508408A (cg-RX-API-DMAC10.html)
KR (1) KR20230153374A (cg-RX-API-DMAC10.html)
CN (1) CN116964729A (cg-RX-API-DMAC10.html)
PH (1) PH12023551687A1 (cg-RX-API-DMAC10.html)
TW (1) TW202236447A (cg-RX-API-DMAC10.html)
WO (1) WO2022186953A2 (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230245978A1 (en) * 2022-02-01 2023-08-03 Skyworks Solutions, Inc. Shielded wafer level chip scale package with shield connected to ground with vias through die
TWI840075B (zh) * 2023-01-05 2024-04-21 矽品精密工業股份有限公司 電子封裝件及其製法
TWI865147B (zh) * 2023-01-05 2024-12-01 矽品精密工業股份有限公司 電子封裝件及其製法
TWI883373B (zh) * 2023-01-17 2025-05-11 華東科技股份有限公司 具散熱功能及電磁防護功能的晶片封裝結構的製造方法
US20240371774A1 (en) * 2023-05-01 2024-11-07 Taiwan Semiconductor Manufacturing Company Limited Package module including a recessed upper surface and methods of forming the package module
KR20250017699A (ko) * 2023-07-26 2025-02-04 양쯔 메모리 테크놀로지스 씨오., 엘티디. 칩 패키징 구조, 반도체 구조 및 그 제조 방법
CN119232106B (zh) * 2024-09-20 2025-12-05 泉州市三安集成电路有限公司 声表面波器件及其制备方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100703090B1 (ko) * 2005-08-30 2007-04-06 삼성전기주식회사 후면 접지형 플립칩 반도체 패키지
JP2009277910A (ja) * 2008-05-15 2009-11-26 Sharp Corp 半導体モジュールおよび半導体モジュールの製造方法
KR101533866B1 (ko) * 2008-07-31 2015-07-03 스카이워크스 솔루션즈, 인코포레이티드 통합된 간섭 차폐물을 갖는 반도체 패키지 및 그 제조 방법
US8373264B2 (en) * 2008-07-31 2013-02-12 Skyworks Solutions, Inc. Semiconductor package with integrated interference shielding and method of manufacture thereof
CN104410373B (zh) 2012-06-14 2016-03-09 西凯渥资讯处理科技公司 包含相关系统、装置及方法的功率放大器模块
KR20140057979A (ko) * 2012-11-05 2014-05-14 삼성전자주식회사 반도체 패키지 및 반도체 패키지의 제조 방법
JP5767268B2 (ja) * 2013-04-02 2015-08-19 太陽誘電株式会社 回路モジュール及びその製造方法
JP6484019B2 (ja) * 2014-12-11 2019-03-13 アピックヤマダ株式会社 半導体製造装置
JP6837432B2 (ja) * 2015-05-11 2021-03-03 株式会社村田製作所 高周波モジュール
TWI590392B (zh) * 2015-08-03 2017-07-01 矽品精密工業股份有限公司 電子封裝件及其製法
US10163808B2 (en) * 2015-10-22 2018-12-25 Avago Technologies International Sales Pte. Limited Module with embedded side shield structures and method of fabricating the same
US10872879B2 (en) 2015-11-12 2020-12-22 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor package and manufacturing method thereof
JP2017103282A (ja) * 2015-11-30 2017-06-08 イビデン株式会社 プリント配線板
US10147685B2 (en) * 2016-03-10 2018-12-04 Apple Inc. System-in-package devices with magnetic shielding
JP6173611B1 (ja) * 2016-04-27 2017-08-02 三菱電機株式会社 高周波回路
JP6500859B2 (ja) * 2016-08-22 2019-04-17 株式会社村田製作所 無線モジュール
US10178757B2 (en) * 2016-09-30 2019-01-08 Avago Technologies International Sales Pte. Limited Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages
TWI603456B (zh) 2016-09-30 2017-10-21 矽品精密工業股份有限公司 電子封裝結構及其製法
US20180374798A1 (en) * 2017-06-24 2018-12-27 Amkor Technology, Inc. Semiconductor device having emi shielding structure and related methods
KR102442623B1 (ko) * 2017-08-08 2022-09-13 삼성전자주식회사 반도체 패키지
WO2019066997A1 (en) * 2017-09-30 2019-04-04 Intel Corporation SHIELD AGAINST ELECTROMAGNETIC INTERFERENCE CREATED ON HIGH-PERFORMANCE ADDITIVE MANUFACTURING HOUSING
JP7130958B2 (ja) * 2017-12-27 2022-09-06 株式会社村田製作所 モジュール
US10790238B2 (en) * 2018-05-10 2020-09-29 Samsung Electro-Mechanics Co., Ltd. Electronic device module and method of manufacturing the same
US20200098698A1 (en) 2018-09-26 2020-03-26 Intel Corporation Novel wafer level chip scale package (wlcsp), flip-chip chip scale package (fccsp), and fan out shielding concepts
KR102586888B1 (ko) * 2018-11-27 2023-10-06 삼성전기주식회사 반도체 패키지
DE102019100896A1 (de) * 2019-01-15 2020-07-16 Infineon Technologies Ag Halbleitervorrichtungen mit haftvermittelnden Strukturen und Verfahren zu ihrer Herstellung
US11310907B2 (en) * 2019-11-27 2022-04-19 Intel Corporation Microelectronic package with substrate-integrated components
US11605571B2 (en) 2020-05-29 2023-03-14 Qualcomm Incorporated Package comprising a substrate, an integrated device, and an encapsulation layer with undercut
US11495531B2 (en) * 2020-07-09 2022-11-08 Advanced Semiconductore Engineering Korea, Inc. Semiconductor device package and method of manufacturing the same

Similar Documents

Publication Publication Date Title
TWI705525B (zh) 半導體裝置以及其製造方法
US8987872B2 (en) Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages
US9368566B2 (en) Package on package (PoP) integrated device comprising a capacitor in a substrate
TW202139379A (zh) 包括虛設互連的封裝
TWI514486B (zh) 致能無凸塊增層式（ｂｂｕｌ）封裝體上之封裝體疊加（ｐｏｐ）墊表面修整層之技術
US9635763B2 (en) Component built-in board mounting body and method of manufacturing the same, and component built-in board
JP2022017148A (ja) パッケージ基板及びその製造方法
JP2024521546A5 (cg-RX-API-DMAC10.html)
CN114616663B (zh) 包括具有内部互连、介电层和导电层的互连结构的集成器件
JP2024523238A5 (cg-RX-API-DMAC10.html)
US9184112B1 (en) Cooling apparatus for an integrated circuit
US12142577B2 (en) Package comprising metal layer configured for electromagnetic interference shield and heat dissipation
CN104321864A (zh) 具有非共面的、包封的微电子器件和无焊内建层的微电子封装
KR20100077062A (ko) 금속 및 입자가 충진된 스루 실리콘 비아들을 포함하는 집적 회로 다이
CN113764383B (zh) 具有emi屏蔽的微电子装置封装、制造方法和相关电子系统
US9466554B2 (en) Integrated device comprising via with side barrier layer traversing encapsulation layer
JP2025515593A5 (cg-RX-API-DMAC10.html)
KR20200131352A (ko) 전도성 커넥터들의 형성에서의 귀금속들의 이용
CN104779176A (zh) 嵌埋有晶片的封装结构的制法
JP2025515626A5 (cg-RX-API-DMAC10.html)
CN108369944B (zh) 混合微电子衬底及用于制造其的方法
JP6956095B2 (ja) 集積回路（ｉｃ）パッケージ間にフレキシブルコネクタを備える集積デバイス
WO2021174395A1 (zh) 封装结构及封装结构的制作方法
JP6712051B2 (ja) 半導体装置、半導体装置の製造方法及び電子装置
JP2024526596A5 (cg-RX-API-DMAC10.html)