JP2024009082A5 - - Google Patents
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- Publication number
- JP2024009082A5 JP2024009082A5 JP2023194100A JP2023194100A JP2024009082A5 JP 2024009082 A5 JP2024009082 A5 JP 2024009082A5 JP 2023194100 A JP2023194100 A JP 2023194100A JP 2023194100 A JP2023194100 A JP 2023194100A JP 2024009082 A5 JP2024009082 A5 JP 2024009082A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- substrates
- substrate
- activation
- nitrogen gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 112
- 238000001994 activation Methods 0.000 claims 46
- 230000004913 activation Effects 0.000 claims 43
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 29
- 229910001873 dinitrogen Inorganic materials 0.000 claims 29
- 238000000034 method Methods 0.000 claims 23
- 239000007789 gas Substances 0.000 claims 12
- 150000003254 radicals Chemical class 0.000 claims 12
- 150000002831 nitrogen free-radicals Chemical class 0.000 claims 11
- 230000032258 transport Effects 0.000 claims 11
- 238000005530 etching Methods 0.000 claims 9
- 229910052751 metal Inorganic materials 0.000 claims 8
- 238000001020 plasma etching Methods 0.000 claims 8
- 230000003213 activating effect Effects 0.000 claims 7
- 238000004140 cleaning Methods 0.000 claims 7
- 239000011810 insulating material Substances 0.000 claims 7
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 6
- 229910001882 dioxygen Inorganic materials 0.000 claims 6
- 230000001678 irradiating effect Effects 0.000 claims 5
- 239000002245 particle Substances 0.000 claims 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 4
- 150000002500 ions Chemical class 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 238000005507 spraying Methods 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- 238000000992 sputter etching Methods 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020164962 | 2020-09-30 | ||
| JP2020164962 | 2020-09-30 | ||
| PCT/JP2021/033291 WO2022070835A1 (ja) | 2020-09-30 | 2021-09-10 | 基板接合方法および基板接合システム |
| JP2022553755A JP7440047B2 (ja) | 2020-09-30 | 2021-09-10 | 基板接合方法および基板接合システム |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022553755A Division JP7440047B2 (ja) | 2020-09-30 | 2021-09-10 | 基板接合方法および基板接合システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024009082A JP2024009082A (ja) | 2024-01-19 |
| JP2024009082A5 true JP2024009082A5 (enExample) | 2024-02-26 |
Family
ID=80950377
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022553755A Active JP7440047B2 (ja) | 2020-09-30 | 2021-09-10 | 基板接合方法および基板接合システム |
| JP2023194100A Pending JP2024009082A (ja) | 2020-09-30 | 2023-11-15 | 基板接合方法および基板接合システム |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022553755A Active JP7440047B2 (ja) | 2020-09-30 | 2021-09-10 | 基板接合方法および基板接合システム |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12409644B2 (enExample) |
| EP (1) | EP4224512A1 (enExample) |
| JP (2) | JP7440047B2 (enExample) |
| TW (1) | TW202230457A (enExample) |
| WO (1) | WO2022070835A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209933070U (zh) | 2018-01-07 | 2020-01-14 | 苏州杰成医疗科技有限公司 | 心脏瓣膜假体 |
| JP2025144080A (ja) * | 2024-03-19 | 2025-10-02 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板接合方法および基板接合装置 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2888258B2 (ja) | 1990-11-30 | 1999-05-10 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| JP2701709B2 (ja) * | 1993-02-16 | 1998-01-21 | 株式会社デンソー | ２つの材料の直接接合方法及び材料直接接合装置 |
| US6780759B2 (en) * | 2001-05-09 | 2004-08-24 | Silicon Genesis Corporation | Method for multi-frequency bonding |
| JP3980539B2 (ja) | 2003-08-29 | 2007-09-26 | 唯知 須賀 | 基板接合方法、照射方法、および基板接合装置 |
| JP3790995B2 (ja) | 2004-01-22 | 2006-06-28 | 有限会社ボンドテック | 接合方法及びこの方法により作成されるデバイス並びに接合装置 |
| JP2006080314A (ja) * | 2004-09-09 | 2006-03-23 | Canon Inc | 結合基板の製造方法 |
| JP2006339363A (ja) * | 2005-06-01 | 2006-12-14 | Bondtech Inc | 表面活性化方法および表面活性化装置 |
| JP4671900B2 (ja) * | 2006-04-06 | 2011-04-20 | パナソニック株式会社 | 接合方法および接合装置 |
| JP2008202114A (ja) | 2007-02-21 | 2008-09-04 | Canon Anelva Corp | 薄膜作成装置 |
| JP4967842B2 (ja) | 2007-06-18 | 2012-07-04 | セイコーエプソン株式会社 | シリコン基材の接合方法、液滴吐出ヘッド、液滴吐出装置および電子デバイス |
| JP5282392B2 (ja) | 2007-11-05 | 2013-09-04 | セイコーエプソン株式会社 | 直接接合用ウェハ |
| IN2015DN03311A (enExample) * | 2012-09-28 | 2015-10-09 | Dainippon Printing Co Ltd | |
| JP6395333B2 (ja) | 2014-04-25 | 2018-09-26 | 須賀 唯知 | 基板接合装置および基板接合方法 |
| US11837444B2 (en) | 2016-11-07 | 2023-12-05 | Tadatomo Suga | Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device |
| US20210265300A1 (en) | 2018-08-31 | 2021-08-26 | Bondtech Co., Ltd. | Bonding system and bonding method |
| JP6967032B2 (ja) | 2019-03-29 | 2021-11-17 | Ｊｘ金属株式会社 | 電解装置及び電解方法 |
-
2021
- 2021-09-10 JP JP2022553755A patent/JP7440047B2/ja active Active
- 2021-09-10 WO PCT/JP2021/033291 patent/WO2022070835A1/ja not_active Ceased
- 2021-09-10 US US18/245,895 patent/US12409644B2/en active Active
- 2021-09-10 EP EP21875137.8A patent/EP4224512A1/en not_active Withdrawn
- 2021-09-14 TW TW110134185A patent/TW202230457A/zh unknown
-
2023
- 2023-11-15 JP JP2023194100A patent/JP2024009082A/ja active Pending
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