JP7440047B2 - 基板接合方法および基板接合システム - Google Patents

基板接合方法および基板接合システム Download PDF

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Publication number
JP7440047B2
JP7440047B2 JP2022553755A JP2022553755A JP7440047B2 JP 7440047 B2 JP7440047 B2 JP 7440047B2 JP 2022553755 A JP2022553755 A JP 2022553755A JP 2022553755 A JP2022553755 A JP 2022553755A JP 7440047 B2 JP7440047 B2 JP 7440047B2
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bonding
substrates
substrate
nitrogen
activation
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Japanese (ja)
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JPWO2022070835A5 (enExample
JPWO2022070835A1 (enExample
Inventor
朗 山内
唯知 須賀
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Bondtech Inc
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Bondtech Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04—Time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0875—Treatment by energy or chemical effects by wave energy or particle radiation using particle radiation
    • B32B2310/0881—Treatment by energy or chemical effects by wave energy or particle radiation using particle radiation using ion-radiation, e.g. alpha-rays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/14—Corona, ionisation, electrical discharge, plasma treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
JP2022553755A 2020-09-30 2021-09-10 基板接合方法および基板接合システム Active JP7440047B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023194100A JP2024009082A (ja) 2020-09-30 2023-11-15 基板接合方法および基板接合システム

Applications Claiming Priority (3)

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JP2020164962 2020-09-30
JP2020164962 2020-09-30
PCT/JP2021/033291 WO2022070835A1 (ja) 2020-09-30 2021-09-10 基板接合方法および基板接合システム

Related Child Applications (1)

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JP2023194100A Division JP2024009082A (ja) 2020-09-30 2023-11-15 基板接合方法および基板接合システム

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JPWO2022070835A1 JPWO2022070835A1 (enExample) 2022-04-07
JPWO2022070835A5 JPWO2022070835A5 (enExample) 2023-02-22
JP7440047B2 true JP7440047B2 (ja) 2024-02-28

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JP2022553755A Active JP7440047B2 (ja) 2020-09-30 2021-09-10 基板接合方法および基板接合システム
JP2023194100A Pending JP2024009082A (ja) 2020-09-30 2023-11-15 基板接合方法および基板接合システム

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US (1) US12409644B2 (enExample)
EP (1) EP4224512A1 (enExample)
JP (2) JP7440047B2 (enExample)
TW (1) TW202230457A (enExample)
WO (1) WO2022070835A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN209933070U (zh) 2018-01-07 2020-01-14 苏州杰成医疗科技有限公司 心脏瓣膜假体
JP2025144080A (ja) * 2024-03-19 2025-10-02 株式会社Ｓｃｒｅｅｎホールディングス 基板接合方法および基板接合装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281166A (ja) 2006-04-06 2007-10-25 Matsushita Electric Ind Co Ltd 接合方法および接合装置ならびに接合基板
JP2008311596A (ja) 2007-06-18 2008-12-25 Seiko Epson Corp シリコン基材の接合方法、液滴吐出ヘッド、液滴吐出装置および電子デバイス
JP2009118034A (ja) 2007-11-05 2009-05-28 Epson Toyocom Corp 直接接合用ウェハ
WO2015163461A1 (ja) 2014-04-25 2015-10-29 須賀　唯知 基板接合装置および基板接合方法
WO2018084285A1 (ja) 2016-11-07 2018-05-11 ボンドテック株式会社 基板接合方法、基板接合システムおよび親水化処理装置の制御方法
WO2020044579A1 (ja) 2018-08-31 2020-03-05 ボンドテック株式会社 接合システムおよび接合方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2888258B2 (ja) 1990-11-30 1999-05-10 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2701709B2 (ja) * 1993-02-16 1998-01-21 株式会社デンソー ２つの材料の直接接合方法及び材料直接接合装置
US6780759B2 (en) * 2001-05-09 2004-08-24 Silicon Genesis Corporation Method for multi-frequency bonding
JP3980539B2 (ja) 2003-08-29 2007-09-26 唯知 須賀 基板接合方法、照射方法、および基板接合装置
JP3790995B2 (ja) 2004-01-22 2006-06-28 有限会社ボンドテック 接合方法及びこの方法により作成されるデバイス並びに接合装置
JP2006080314A (ja) * 2004-09-09 2006-03-23 Canon Inc 結合基板の製造方法
JP2006339363A (ja) * 2005-06-01 2006-12-14 Bondtech Inc 表面活性化方法および表面活性化装置
JP2008202114A (ja) 2007-02-21 2008-09-04 Canon Anelva Corp 薄膜作成装置
IN2015DN03311A (enExample) * 2012-09-28 2015-10-09 Dainippon Printing Co Ltd
JP6967032B2 (ja) 2019-03-29 2021-11-17 Ｊｘ金属株式会社 電解装置及び電解方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281166A (ja) 2006-04-06 2007-10-25 Matsushita Electric Ind Co Ltd 接合方法および接合装置ならびに接合基板
JP2008311596A (ja) 2007-06-18 2008-12-25 Seiko Epson Corp シリコン基材の接合方法、液滴吐出ヘッド、液滴吐出装置および電子デバイス
JP2009118034A (ja) 2007-11-05 2009-05-28 Epson Toyocom Corp 直接接合用ウェハ
WO2015163461A1 (ja) 2014-04-25 2015-10-29 須賀　唯知 基板接合装置および基板接合方法
WO2018084285A1 (ja) 2016-11-07 2018-05-11 ボンドテック株式会社 基板接合方法、基板接合システムおよび親水化処理装置の制御方法
WO2020044579A1 (ja) 2018-08-31 2020-03-05 ボンドテック株式会社 接合システムおよび接合方法

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WO2022070835A1 (ja) 2022-04-07
US12409644B2 (en) 2025-09-09
JP2024009082A (ja) 2024-01-19
US20240009984A1 (en) 2024-01-11
TW202230457A (zh) 2022-08-01
EP4224512A1 (en) 2023-08-09
JPWO2022070835A1 (enExample) 2022-04-07

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