TW202230457A - 基板接合方法及基板接合系統 - Google Patents

基板接合方法及基板接合系統 Download PDF

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Publication number
TW202230457A
TW202230457A TW110134185A TW110134185A TW202230457A TW 202230457 A TW202230457 A TW 202230457A TW 110134185 A TW110134185 A TW 110134185A TW 110134185 A TW110134185 A TW 110134185A TW 202230457 A TW202230457 A TW 202230457A
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TW
Taiwan
Prior art keywords
substrates
bonding
substrate
mentioned
treatment
Prior art date
Application number
TW110134185A
Other languages
English (en)
Chinese (zh)
Inventor
山內朗
須賀唯知
Original Assignee
日商邦德科技股份有限公司
須賀唯知
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商邦德科技股份有限公司, 須賀唯知 filed Critical 日商邦德科技股份有限公司
Publication of TW202230457A publication Critical patent/TW202230457A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04—Time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0875—Treatment by energy or chemical effects by wave energy or particle radiation using particle radiation
    • B32B2310/0881—Treatment by energy or chemical effects by wave energy or particle radiation using particle radiation using ion-radiation, e.g. alpha-rays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/14—Corona, ionisation, electrical discharge, plasma treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
TW110134185A 2020-09-30 2021-09-14 基板接合方法及基板接合系統 TW202230457A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020164962 2020-09-30
JP2020-164962 2020-09-30
PCT/JP2021/033291 WO2022070835A1 (ja) 2020-09-30 2021-09-10 基板接合方法および基板接合システム
JPPCT/JP2021/033291 2021-09-10

Publications (1)

Publication Number Publication Date
TW202230457A true TW202230457A (zh) 2022-08-01

Family

ID=80950377

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110134185A TW202230457A (zh) 2020-09-30 2021-09-14 基板接合方法及基板接合系統

Country Status (5)

Country Link
US (1) US12409644B2 (enExample)
EP (1) EP4224512A1 (enExample)
JP (2) JP7440047B2 (enExample)
TW (1) TW202230457A (enExample)
WO (1) WO2022070835A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN209933070U (zh) 2018-01-07 2020-01-14 苏州杰成医疗科技有限公司 心脏瓣膜假体
JP2025144080A (ja) * 2024-03-19 2025-10-02 株式会社Ｓｃｒｅｅｎホールディングス 基板接合方法および基板接合装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2888258B2 (ja) 1990-11-30 1999-05-10 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2701709B2 (ja) * 1993-02-16 1998-01-21 株式会社デンソー ２つの材料の直接接合方法及び材料直接接合装置
US6780759B2 (en) * 2001-05-09 2004-08-24 Silicon Genesis Corporation Method for multi-frequency bonding
JP3980539B2 (ja) 2003-08-29 2007-09-26 唯知 須賀 基板接合方法、照射方法、および基板接合装置
JP3790995B2 (ja) 2004-01-22 2006-06-28 有限会社ボンドテック 接合方法及びこの方法により作成されるデバイス並びに接合装置
JP2006080314A (ja) * 2004-09-09 2006-03-23 Canon Inc 結合基板の製造方法
JP2006339363A (ja) * 2005-06-01 2006-12-14 Bondtech Inc 表面活性化方法および表面活性化装置
JP4671900B2 (ja) * 2006-04-06 2011-04-20 パナソニック株式会社 接合方法および接合装置
JP2008202114A (ja) 2007-02-21 2008-09-04 Canon Anelva Corp 薄膜作成装置
JP4967842B2 (ja) 2007-06-18 2012-07-04 セイコーエプソン株式会社 シリコン基材の接合方法、液滴吐出ヘッド、液滴吐出装置および電子デバイス
JP5282392B2 (ja) 2007-11-05 2013-09-04 セイコーエプソン株式会社 直接接合用ウェハ
IN2015DN03311A (enExample) * 2012-09-28 2015-10-09 Dainippon Printing Co Ltd
JP6395333B2 (ja) 2014-04-25 2018-09-26 須賀　唯知 基板接合装置および基板接合方法
US11837444B2 (en) 2016-11-07 2023-12-05 Tadatomo Suga Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device
US20210265300A1 (en) 2018-08-31 2021-08-26 Bondtech Co., Ltd. Bonding system and bonding method
JP6967032B2 (ja) 2019-03-29 2021-11-17 Ｊｘ金属株式会社 電解装置及び電解方法

Also Published As

Publication number Publication date
JP7440047B2 (ja) 2024-02-28
WO2022070835A1 (ja) 2022-04-07
US12409644B2 (en) 2025-09-09
JP2024009082A (ja) 2024-01-19
US20240009984A1 (en) 2024-01-11
EP4224512A1 (en) 2023-08-09
JPWO2022070835A1 (enExample) 2022-04-07

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