|
JP2962750B2
(ja)
|
1989-12-28 |
1999-10-12 |
株式会社リコー |
レーザｃｖｄ法による光学素子製造におけるレーザビームの照射方法
|
|
JP3259931B2
(ja)
|
1992-04-17 |
2002-02-25 |
シャープ株式会社 |
半導体発光素子および半導体表示装置
|
|
JPH06136553A
(ja)
|
1992-10-26 |
1994-05-17 |
Nippon Steel Corp |
鏡面方向性珪素鋼板の製造方法
|
|
US6122109A
(en)
|
1998-04-16 |
2000-09-19 |
The University Of New Mexico |
Non-planar micro-optical structures
|
|
US6956701B1
(en)
|
2004-04-26 |
2005-10-18 |
Infocus Corporation |
Method and apparatus for combining light paths of multiple colored light sources through a common integration tunnel
|
|
TWI249148B
(en)
|
2004-04-13 |
2006-02-11 |
Epistar Corp |
Light-emitting device array having binding layer
|
|
US6699729B1
(en)
|
2002-10-25 |
2004-03-02 |
Omnivision International Holding Ltd |
Method of forming planar color filters in an image sensor
|
|
US7393469B2
(en)
|
2003-07-31 |
2008-07-01 |
Ramazan Benrashid |
High performance sol-gel spin-on glass materials
|
|
JP4127533B2
(ja)
|
2003-11-26 |
2008-07-30 |
株式会社リコー |
発光素子アレイ、その発光素子アレイを備えた光書込ユニット及び画像形成装置、並びに、その発光素子アレイの作製方法
|
|
US20070090387A1
(en)
|
2004-03-29 |
2007-04-26 |
Articulated Technologies, Llc |
Solid state light sheet and encapsulated bare die semiconductor circuits
|
|
US20070170444A1
(en)
|
2004-07-07 |
2007-07-26 |
Cao Group, Inc. |
Integrated LED Chip to Emit Multiple Colors and Method of Manufacturing the Same
|
|
US7029944B1
(en)
|
2004-09-30 |
2006-04-18 |
Sharp Laboratories Of America, Inc. |
Methods of forming a microlens array over a substrate employing a CMP stop
|
|
JP4837295B2
(ja)
|
2005-03-02 |
2011-12-14 |
株式会社沖データ |
半導体装置、ｌｅｄ装置、ｌｅｄヘッド、及び画像形成装置
|
|
EP1850378A3
(en)
|
2006-04-28 |
2013-08-07 |
Semiconductor Energy Laboratory Co., Ltd. |
Memory device and semicondutor device
|
|
JP2008060344A
(ja)
|
2006-08-31 |
2008-03-13 |
Toshiba Corp |
半導体発光装置
|
|
TW200834962A
(en)
|
2007-02-08 |
2008-08-16 |
Touch Micro System Tech |
LED array package structure having Si-substrate and method of making the same
|
|
US20090020924A1
(en)
|
2007-02-21 |
2009-01-22 |
Iowa State University Research Foundation, Inc. |
Drying-mediated self-assembly of ordered or hierarchically ordered micro- and sub-micro scale structures and their uses as multifunctional materials
|
|
WO2009010762A1
(en)
|
2007-07-19 |
2009-01-22 |
Photonstar Led Limited |
Vertical led with conductive vias
|
|
KR20090061310A
(ko)
|
2007-12-11 |
2009-06-16 |
주식회사 동부하이텍 |
이미지 센서 및 그 제조방법
|
|
US8292480B2
(en)
|
2008-07-10 |
2012-10-23 |
Koito Manufacturing Co., Ltd. |
Lamp including main reflector, sub-reflector and LED assembly
|
|
JP4555880B2
(ja)
*
|
2008-09-04 |
2010-10-06 |
株式会社沖データ |
積層半導体発光装置及び画像形成装置
|
|
JP5429615B2
(ja)
|
2008-12-12 |
2014-02-26 |
Ｎｌｔテクノロジー株式会社 |
レンズシートおよび表示パネル
|
|
US8803171B2
(en)
|
2009-07-22 |
2014-08-12 |
Koninklijke Philips N.V. |
Reduced color over angle variation LEDs
|
|
EP2375452A1
(en)
|
2010-04-06 |
2011-10-12 |
FOM Institute for Atomic and Moleculair Physics |
Nanoparticle antireflection layer
|
|
KR101662010B1
(ko)
|
2010-05-20 |
2016-10-05 |
엘지이노텍 주식회사 |
발광 소자
|
|
US20110284887A1
(en)
|
2010-05-21 |
2011-11-24 |
Shang-Yi Wu |
Light emitting chip package and method for forming the same
|
|
CN101872824A
(zh)
|
2010-06-07 |
2010-10-27 |
厦门市三安光电科技有限公司 |
侧面具有双反射层的氮化镓基倒装发光二极管及其制备方法
|
|
JP5877992B2
(ja)
*
|
2010-10-25 |
2016-03-08 |
株式会社半導体エネルギー研究所 |
表示装置
|
|
JP2012134128A
(ja)
*
|
2010-11-30 |
2012-07-12 |
Canon Inc |
表示装置
|
|
TWI436458B
(zh)
|
2011-07-29 |
2014-05-01 |
鴻海精密工業股份有限公司 |
晶圓級封裝結構及其製作方法
|
|
US9494294B2
(en)
|
2012-03-23 |
2016-11-15 |
Cree, Inc. |
Modular indirect troffer
|
|
US9178123B2
(en)
|
2012-12-10 |
2015-11-03 |
LuxVue Technology Corporation |
Light emitting device reflective bank structure
|
|
US9196606B2
(en)
|
2013-01-09 |
2015-11-24 |
Nthdegree Technologies Worldwide Inc. |
Bonding transistor wafer to LED wafer to form active LED modules
|
|
US9484504B2
(en)
|
2013-05-14 |
2016-11-01 |
Apple Inc. |
Micro LED with wavelength conversion layer
|
|
CN110061018B
(zh)
|
2013-05-21 |
2023-11-28 |
弗托斯传感与算法公司 |
全光透镜在光传感器衬底上的单片集成
|
|
US9111464B2
(en)
|
2013-06-18 |
2015-08-18 |
LuxVue Technology Corporation |
LED display with wavelength conversion layer
|
|
TWI467528B
(zh)
|
2013-10-30 |
2015-01-01 |
友達光電股份有限公司 |
發光二極體顯示面板及其製作方法
|
|
KR102285786B1
(ko)
|
2014-01-20 |
2021-08-04 |
삼성전자 주식회사 |
반도체 발광 소자
|
|
US9318475B2
(en)
|
2014-05-15 |
2016-04-19 |
LuxVue Technology Corporation |
Flexible display and method of formation with sacrificial release layer
|
|
WO2016043113A1
(ja)
|
2014-09-16 |
2016-03-24 |
シャープ株式会社 |
有機エレクトロルミネッセンス装置および有機エレクトロルミネッセンス装置の製造方法
|
|
JP6450965B2
(ja)
|
2014-10-07 |
2019-01-16 |
セイコーエプソン株式会社 |
マイクロレンズアレイ基板、マイクロレンズアレイ基板を備えた電気光学装置、及び投写型表示装置
|
|
US20160163940A1
(en)
*
|
2014-12-05 |
2016-06-09 |
Industrial Technology Research Institute |
Package structure for light emitting device
|
|
FR3033939B1
(fr)
*
|
2015-03-20 |
2018-04-27 |
Commissariat A L'energie Atomique Et Aux Energies Alternatives |
Dispositif optoelectronique a diode electroluminescente
|
|
CN106356441A
(zh)
*
|
2015-07-16 |
2017-01-25 |
展晶科技(深圳)有限公司 |
发光二极管封装结构
|
|
DE102016116119B4
(de)
|
2015-08-31 |
2021-03-18 |
Lg Display Co., Ltd. |
Organische Licht emittierende Dioden-Anzeigevorrichtung
|
|
KR102520955B1
(ko)
|
2015-08-31 |
2023-04-13 |
엘지디스플레이 주식회사 |
유기발광 표시장치
|
|
US10304811B2
(en)
|
2015-09-04 |
2019-05-28 |
Hong Kong Beida Jade Bird Display Limited |
Light-emitting diode display panel with micro lens array
|
|
US10304813B2
(en)
|
2015-11-05 |
2019-05-28 |
Innolux Corporation |
Display device having a plurality of bank structures
|
|
KR101739771B1
(ko)
|
2015-11-30 |
2017-05-26 |
엘지디스플레이 주식회사 |
유기발광 표시장치 및 그 제조방법
|
|
KR102546307B1
(ko)
|
2015-12-02 |
2023-06-21 |
삼성전자주식회사 |
발광 소자 및 이를 포함하는 표시 장치
|
|
US10068888B2
(en)
|
2015-12-21 |
2018-09-04 |
Hong Kong Beida Jade Bird Display Limited |
Making semiconductor devices with alignment bonding and substrate removal
|
|
CN105399960A
(zh)
|
2015-12-28 |
2016-03-16 |
常州思宇环保材料科技有限公司 |
一种壳聚糖等离子接枝透明质酸生物止血材料的制备方法
|
|
US10388691B2
(en)
|
2016-05-18 |
2019-08-20 |
Globalfoundries Inc. |
Light emitting diodes (LEDs) with stacked multi-color pixels for displays
|
|
US10037981B2
(en)
|
2016-05-18 |
2018-07-31 |
Globalfoundries Inc. |
Integrated display system with multi-color light emitting diodes (LEDs)
|
|
US10304375B2
(en)
|
2016-09-23 |
2019-05-28 |
Hong Kong Beida Jade Bird Display Limited |
Micro display panels with integrated micro-reflectors
|
|
WO2018064805A1
(en)
|
2016-10-08 |
2018-04-12 |
Goertek. Inc |
Display device and electronics apparatus
|
|
US10412806B2
(en)
*
|
2016-11-10 |
2019-09-10 |
Hong Kong Beida Jade Bird Display Limited |
Multi-color micro-LED array light source
|
|
CN106449659B
(zh)
|
2016-11-11 |
2019-06-07 |
京东方科技集团股份有限公司 |
阵列基板及其制造方法、显示器
|
|
US10325893B2
(en)
|
2016-12-13 |
2019-06-18 |
Hong Kong Beida Jade Bird Display Limited |
Mass transfer of micro structures using adhesives
|
|
US10998465B2
(en)
|
2017-01-09 |
2021-05-04 |
Glo Ab |
Light emitting diodes with integrated reflector for a direct view display and method of making thereof
|
|
WO2018162076A1
(en)
|
2017-03-10 |
2018-09-13 |
Osram Opto Semiconductors Gmbh |
Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
|
|
CN110462850B
(zh)
|
2017-03-20 |
2024-04-16 |
上海显耀显示科技有限公司 |
通过堆叠微型led的层来制造半导体器件
|
|
US9799810B1
(en)
|
2017-03-30 |
2017-10-24 |
Harvatek Corporation |
Light emitting device
|
|
JP7233859B2
(ja)
*
|
2017-06-20 |
2023-03-07 |
旭化成エレクトロニクス株式会社 |
赤外線発光ダイオード
|
|
FR3069106B1
(fr)
|
2017-07-17 |
2019-10-18 |
Commissariat A L'energie Atomique Et Aux Energies Alternatives |
Diode electroluminescente comportant un empilement a partie amincie et procede d'elaboration de la diode electroluminescente
|
|
US10733930B2
(en)
|
2017-08-23 |
2020-08-04 |
Facebook Technologies, Llc |
Interposer for multi-layer display architecture
|
|
US10361349B2
(en)
|
2017-09-01 |
2019-07-23 |
Cree, Inc. |
Light emitting diodes, components and related methods
|
|
US10892297B2
(en)
|
2017-11-27 |
2021-01-12 |
Seoul Viosys Co., Ltd. |
Light emitting diode (LED) stack for a display
|
|
US10892296B2
(en)
*
|
2017-11-27 |
2021-01-12 |
Seoul Viosys Co., Ltd. |
Light emitting device having commonly connected LED sub-units
|
|
US11282981B2
(en)
|
2017-11-27 |
2022-03-22 |
Seoul Viosys Co., Ltd. |
Passivation covered light emitting unit stack
|
|
US10325791B1
(en)
|
2017-12-13 |
2019-06-18 |
Facebook Technologies, Llc |
Formation of elastomeric layer on selective regions of light emitting device
|
|
US10886327B2
(en)
|
2017-12-14 |
2021-01-05 |
Seoul Viosys Co., Ltd. |
Light emitting stacked structure and display device having the same
|
|
US11552057B2
(en)
|
2017-12-20 |
2023-01-10 |
Seoul Viosys Co., Ltd. |
LED unit for display and display apparatus having the same
|
|
US10804429B2
(en)
|
2017-12-22 |
2020-10-13 |
Lumileds Llc |
III-nitride multi-wavelength LED for visible light communication
|
|
US11114499B2
(en)
|
2018-01-02 |
2021-09-07 |
Seoul Viosys Co., Ltd. |
Display device having light emitting stacked structure
|
|
JP2019134025A
(ja)
*
|
2018-01-30 |
2019-08-08 |
大日本印刷株式会社 |
発光ダイオード表示装置および発光ダイオード表示装置用基板
|
|
WO2019149555A1
(en)
|
2018-02-01 |
2019-08-08 |
Signify Holding B.V. |
Polarized lighting device containing polarization preserving reflector
|
|
US10325894B1
(en)
|
2018-04-17 |
2019-06-18 |
Shaoher Pan |
Integrated multi-color light-emitting pixel arrays based devices by bonding
|
|
KR102299992B1
(ko)
|
2018-04-25 |
2021-09-10 |
삼성디스플레이 주식회사 |
발광 장치, 이를 구비한 표시 장치, 및 그의 제조 방법
|
|
KR102600928B1
(ko)
|
2018-07-05 |
2023-11-14 |
삼성디스플레이 주식회사 |
발광 표시 장치 및 그의 제조 방법
|
|
TWI688933B
(zh)
|
2018-07-16 |
2020-03-21 |
友達光電股份有限公司 |
顯示裝置
|
|
KR102136579B1
(ko)
*
|
2018-07-27 |
2020-07-22 |
서울대학교산학협력단 |
표시 장치
|
|
KR102652645B1
(ko)
|
2018-09-03 |
2024-04-02 |
삼성디스플레이 주식회사 |
발광 장치 및 이를 구비하는 표시 장치
|
|
CN109256455B
(zh)
|
2018-09-19 |
2020-06-12 |
福州大学 |
一种光效提取和无像素干扰的全彩化Micro-LED显示结构及其制造方法
|
|
CN109256456B
(zh)
*
|
2018-09-19 |
2020-04-10 |
福州大学 |
一种实现Micro-LED显示出光效率提升和窜扰降低的微结构及其制造方法
|
|
KR102516131B1
(ko)
|
2018-09-21 |
2023-04-03 |
삼성디스플레이 주식회사 |
표시 장치 및 그의 제조 방법
|
|
KR102742044B1
(ko)
*
|
2018-11-05 |
2024-12-13 |
삼성전자주식회사 |
발광 소자
|
|
JP7237536B2
(ja)
*
|
2018-11-12 |
2023-03-13 |
株式会社ジャパンディスプレイ |
表示装置
|
|
CN109920826A
(zh)
|
2019-03-15 |
2019-06-21 |
京东方科技集团股份有限公司 |
显示背板及其制作方法、显示装置
|
|
US11450648B2
(en)
|
2019-03-19 |
2022-09-20 |
Seoul Viosys Co., Ltd. |
Light emitting device package and application thereof
|
|
KR102871479B1
(ko)
*
|
2019-05-14 |
2025-10-16 |
서울바이오시스 주식회사 |
Led 칩 및 그것을 제조하는 방법
|
|
CN114766065B
(zh)
*
|
2019-06-19 |
2025-06-24 |
上海显耀显示科技有限公司 |
用于多色led像素单元的系统和方法
|
|
KR102852286B1
(ko)
|
2019-09-24 |
2025-08-28 |
삼성전자주식회사 |
디스플레이 장치
|
|
US11817435B2
(en)
|
2019-10-28 |
2023-11-14 |
Seoul Viosys Co., Ltd. |
Light emitting device for display and LED display apparatus having the same
|
|
FR3109018A1
(fr)
*
|
2020-04-06 |
2021-10-08 |
Commissariat A L'energie Atomique Et Aux Energies Alternatives |
Dispositif a matrice de diodes photo-emettrices et/ou photo-receptrices
|