JP2023520120A5 - - Google Patents

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Publication number
JP2023520120A5
JP2023520120A5 JP2022549111A JP2022549111A JP2023520120A5 JP 2023520120 A5 JP2023520120 A5 JP 2023520120A5 JP 2022549111 A JP2022549111 A JP 2022549111A JP 2022549111 A JP2022549111 A JP 2022549111A JP 2023520120 A5 JP2023520120 A5 JP 2023520120A5
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JP
Japan
Prior art keywords
light
layer
emitting layer
led
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022549111A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023520120A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2021/024873 external-priority patent/WO2021202521A1/en
Publication of JP2023520120A publication Critical patent/JP2023520120A/ja
Publication of JP2023520120A5 publication Critical patent/JP2023520120A5/ja
Pending legal-status Critical Current

Links

JP2022549111A 2020-03-30 2021-03-30 接合構造が積層されたマルチカラーｌｅｄのシステム及び方法 Pending JP2023520120A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063002092P 2020-03-30 2020-03-30
US63/002,092 2020-03-30
PCT/US2021/024873 WO2021202521A1 (en) 2020-03-30 2021-03-30 Systems and methods for multi-color led with stacked bonding structures

Publications (2)

Publication Number Publication Date
JP2023520120A JP2023520120A (ja) 2023-05-16
JP2023520120A5 true JP2023520120A5 (https=) 2024-03-21

Family

ID=77857109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022549111A Pending JP2023520120A (ja) 2020-03-30 2021-03-30 接合構造が積層されたマルチカラーｌｅｄのシステム及び方法

Country Status (9)

Country Link
US (4) US12255185B2 (https=)
EP (1) EP4128206A4 (https=)
JP (1) JP2023520120A (https=)
KR (1) KR20220162161A (https=)
CN (2) CN115335889B (https=)
AU (1) AU2021246026A1 (https=)
DE (1) DE21780070T1 (https=)
TW (1) TWI912299B (https=)
WO (1) WO2021202521A1 (https=)

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US20230369304A1 (en) * 2022-05-11 2023-11-16 Seoul Viosys Co., Ltd. Pixel device and display apparatus having the same
CN115000118B (zh) * 2022-06-28 2024-12-31 安徽熙泰智能科技有限公司 有源寻址的micro LED元胞结构、其制备方法及micro LED器件
EP4542651A4 (en) * 2022-07-15 2025-11-26 Lg Electronics Inc Semiconductor Light Emitting Device Housing and Display Device
JP2025526685A (ja) * 2022-08-12 2025-08-15 ジェイド バード ディスプレイ（シャンハイ） リミテッド 多色ｌｅｄ画素ユニットおよびマイクロｌｅｄディスプレイパネル
CN116247143A (zh) * 2022-09-08 2023-06-09 华灿光电（浙江）有限公司 三基色发光二极管、发光模块及其制备方法
TWI854577B (zh) * 2023-04-06 2024-09-01 國立清華大學 紅外光發光元件
US20240395849A1 (en) * 2023-05-23 2024-11-28 Rayleigh Vision Limited Micro light-emitting diode panel structure
CN119604105B (zh) * 2023-09-07 2026-04-14 武汉华星光电半导体显示技术有限公司 显示面板
CN119630158B (zh) * 2023-09-12 2025-11-21 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN117012865B (zh) * 2023-09-27 2023-12-29 季华实验室 全彩Micro LED显示芯片及其制备方法
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CN119907389B (zh) * 2023-10-24 2025-11-25 武汉华星光电半导体显示技术有限公司 显示面板
WO2025097378A1 (en) * 2023-11-09 2025-05-15 Jade Bird Display (shanghai) Limited Micro led, micro led display panel and epitaxial structure
KR20250081955A (ko) * 2023-11-27 2025-06-09 삼성디스플레이 주식회사 표시 패널, 이를 포함하는 스마트 글라스, 및 이의 제조 방법

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FR3019380B1 (fr) * 2014-04-01 2017-09-01 Centre Nat Rech Scient Pixel semiconducteur, matrice de tels pixels, structure semiconductrice pour la realisation de tels pixels et leurs procedes de fabrication
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