DE21780070T1 - Systeme und verfahren für mehrfarbige led mit gestapelten verbindungsstrukturen - Google Patents
Systeme und verfahren für mehrfarbige led mit gestapelten verbindungsstrukturen Download PDFInfo
- Publication number
- DE21780070T1 DE21780070T1 DE21780070.5T DE21780070T DE21780070T1 DE 21780070 T1 DE21780070 T1 DE 21780070T1 DE 21780070 T DE21780070 T DE 21780070T DE 21780070 T1 DE21780070 T1 DE 21780070T1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- emitting layer
- led
- light
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/032—Manufacture or treatment of electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8316—Multi-layer electrodes comprising at least one discontinuous layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/833—Transparent materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063002092P | 2020-03-30 | 2020-03-30 | |
| US202063002092P | 2020-03-30 | ||
| EP21780070.5A EP4128206A4 (en) | 2020-03-30 | 2021-03-30 | Systems and methods for multi-color led with stacked bonding structures |
| PCT/US2021/024873 WO2021202521A1 (en) | 2020-03-30 | 2021-03-30 | Systems and methods for multi-color led with stacked bonding structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE21780070T1 true DE21780070T1 (de) | 2023-05-25 |
Family
ID=77857109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE21780070.5T Pending DE21780070T1 (de) | 2020-03-30 | 2021-03-30 | Systeme und verfahren für mehrfarbige led mit gestapelten verbindungsstrukturen |
Country Status (9)
| Country | Link |
|---|---|
| US (4) | US12255185B2 (https=) |
| EP (1) | EP4128206A4 (https=) |
| JP (1) | JP2023520120A (https=) |
| KR (1) | KR20220162161A (https=) |
| CN (2) | CN115335889B (https=) |
| AU (1) | AU2021246026A1 (https=) |
| DE (1) | DE21780070T1 (https=) |
| TW (1) | TWI912299B (https=) |
| WO (1) | WO2021202521A1 (https=) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11476299B2 (en) * | 2020-08-31 | 2022-10-18 | Hong Kong Beida Jade Bird Display Limited | Double color micro LED display panel |
| WO2023181246A1 (ja) * | 2022-03-24 | 2023-09-28 | アルディーテック株式会社 | 半導体発光素子チップ集積装置およびその製造方法 |
| US20230369304A1 (en) * | 2022-05-11 | 2023-11-16 | Seoul Viosys Co., Ltd. | Pixel device and display apparatus having the same |
| CN115000118B (zh) * | 2022-06-28 | 2024-12-31 | 安徽熙泰智能科技有限公司 | 有源寻址的micro LED元胞结构、其制备方法及micro LED器件 |
| EP4542651A4 (en) * | 2022-07-15 | 2025-11-26 | Lg Electronics Inc | Semiconductor Light Emitting Device Housing and Display Device |
| JP2025526685A (ja) * | 2022-08-12 | 2025-08-15 | ジェイド バード ディスプレイ（シャンハイ） リミテッド | 多色ｌｅｄ画素ユニットおよびマイクロｌｅｄディスプレイパネル |
| CN116247143A (zh) * | 2022-09-08 | 2023-06-09 | 华灿光电（浙江）有限公司 | 三基色发光二极管、发光模块及其制备方法 |
| TWI854577B (zh) * | 2023-04-06 | 2024-09-01 | 國立清華大學 | 紅外光發光元件 |
| US20240395849A1 (en) * | 2023-05-23 | 2024-11-28 | Rayleigh Vision Limited | Micro light-emitting diode panel structure |
| CN119604105B (zh) * | 2023-09-07 | 2026-04-14 | 武汉华星光电半导体显示技术有限公司 | 显示面板 |
| CN119630158B (zh) * | 2023-09-12 | 2025-11-21 | 武汉华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
| CN117012865B (zh) * | 2023-09-27 | 2023-12-29 | 季华实验室 | 全彩Micro LED显示芯片及其制备方法 |
| WO2025081418A1 (en) * | 2023-10-19 | 2025-04-24 | Jade Bird Display (shanghai) Limited | A micro led display panel |
| CN119907388A (zh) * | 2023-10-24 | 2025-04-29 | 京东方科技集团股份有限公司 | 发光芯片、显示装置和制造方法 |
| CN119907389B (zh) * | 2023-10-24 | 2025-11-25 | 武汉华星光电半导体显示技术有限公司 | 显示面板 |
| WO2025097378A1 (en) * | 2023-11-09 | 2025-05-15 | Jade Bird Display (shanghai) Limited | Micro led, micro led display panel and epitaxial structure |
| KR20250081955A (ko) * | 2023-11-27 | 2025-06-09 | 삼성디스플레이 주식회사 | 표시 패널, 이를 포함하는 스마트 글라스, 및 이의 제조 방법 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4868709B2 (ja) * | 2004-03-09 | 2012-02-01 | 三洋電機株式会社 | 発光素子 |
| JP2008147608A (ja) * | 2006-10-27 | 2008-06-26 | Canon Inc | Ｌｅｄアレイの製造方法とｌｅｄアレイ、及びｌｅｄプリンタ |
| JP5330953B2 (ja) * | 2009-10-01 | 2013-10-30 | 株式会社沖データ | 発光装置 |
| FR3019380B1 (fr) * | 2014-04-01 | 2017-09-01 | Centre Nat Rech Scient | Pixel semiconducteur, matrice de tels pixels, structure semiconductrice pour la realisation de tels pixels et leurs procedes de fabrication |
| US9825088B2 (en) * | 2015-07-24 | 2017-11-21 | Epistar Corporation | Light-emitting device and manufacturing method thereof |
| KR102651097B1 (ko) * | 2016-10-28 | 2024-03-22 | 엘지디스플레이 주식회사 | 발광 다이오드 디스플레이 장치 |
| KR102772357B1 (ko) * | 2016-12-20 | 2025-02-21 | 엘지디스플레이 주식회사 | 발광 다이오드 칩 및 이를 포함하는 발광 다이오드 디스플레이 장치 |
| KR20190117706A (ko) * | 2017-02-24 | 2019-10-16 | 메사추세츠 인스티튜트 오브 테크놀로지 | 수직으로 적층된 다색 발광 다이오드(led) 디스플레이를 위한 방법들 및 장치들 |
| US10418499B2 (en) * | 2017-06-01 | 2019-09-17 | Glo Ab | Self-aligned nanowire-based light emitting diode subpixels for a direct view display and method of making thereof |
| CN107482032A (zh) * | 2017-08-10 | 2017-12-15 | 佛山市国星半导体技术有限公司 | 一种用于全彩显示的MicroLED芯片及其制作方法 |
| US12100696B2 (en) * | 2017-11-27 | 2024-09-24 | Seoul Viosys Co., Ltd. | Light emitting diode for display and display apparatus having the same |
| US11282981B2 (en) * | 2017-11-27 | 2022-03-22 | Seoul Viosys Co., Ltd. | Passivation covered light emitting unit stack |
| US10804429B2 (en) * | 2017-12-22 | 2020-10-13 | Lumileds Llc | III-nitride multi-wavelength LED for visible light communication |
| US11114499B2 (en) * | 2018-01-02 | 2021-09-07 | Seoul Viosys Co., Ltd. | Display device having light emitting stacked structure |
| US10784240B2 (en) * | 2018-01-03 | 2020-09-22 | Seoul Viosys Co., Ltd. | Light emitting device with LED stack for display and display apparatus having the same |
| US10325894B1 (en) | 2018-04-17 | 2019-06-18 | Shaoher Pan | Integrated multi-color light-emitting pixel arrays based devices by bonding |
| TWI667786B (zh) * | 2018-05-31 | 2019-08-01 | 友達光電股份有限公司 | 發光二極體顯示器及其製造方法 |
| KR102579311B1 (ko) * | 2018-07-13 | 2023-09-15 | 삼성전자주식회사 | 발광 소자, 발광 소자의 제조 방법 및 발광 소자를 포함하는 디스플레이 장치 |
| US20200043901A1 (en) * | 2018-08-02 | 2020-02-06 | Intel Corporation | Laser transfer printing for making micro led display devices and method |
| US10879419B2 (en) | 2018-08-17 | 2020-12-29 | Seoul Viosys Co., Ltd. | Light emitting device |
| US12125941B2 (en) * | 2019-12-09 | 2024-10-22 | Seoul Viosys Co., Ltd. | Light emitting device for display and display apparatus having the same |
| US11404473B2 (en) * | 2019-12-23 | 2022-08-02 | Lumileds Llc | III-nitride multi-wavelength LED arrays |
-
2021
- 2021-03-30 KR KR1020227037966A patent/KR20220162161A/ko not_active Ceased
- 2021-03-30 TW TW110111498A patent/TWI912299B/zh active
- 2021-03-30 AU AU2021246026A patent/AU2021246026A1/en not_active Withdrawn
- 2021-03-30 JP JP2022549111A patent/JP2023520120A/ja active Pending
- 2021-03-30 CN CN202180024512.XA patent/CN115335889B/zh active Active
- 2021-03-30 US US17/217,484 patent/US12255185B2/en active Active
- 2021-03-30 EP EP21780070.5A patent/EP4128206A4/en not_active Withdrawn
- 2021-03-30 DE DE21780070.5T patent/DE21780070T1/de active Pending
- 2021-03-30 WO PCT/US2021/024873 patent/WO2021202521A1/en not_active Ceased
- 2021-03-30 CN CN202511021705.6A patent/CN121078879A/zh active Pending
-
2025
- 2025-02-12 US US19/052,058 patent/US20250192116A1/en active Pending
- 2025-02-13 US US19/053,254 patent/US20250183236A1/en active Pending
- 2025-08-06 US US19/292,778 patent/US20260005204A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US12255185B2 (en) | 2025-03-18 |
| TW202145601A (zh) | 2021-12-01 |
| KR20220162161A (ko) | 2022-12-07 |
| US20250183236A1 (en) | 2025-06-05 |
| CN121078879A (zh) | 2025-12-05 |
| US20210305220A1 (en) | 2021-09-30 |
| CN115335889B (zh) | 2025-08-29 |
| US20260005204A1 (en) | 2026-01-01 |
| EP4128206A1 (en) | 2023-02-08 |
| WO2021202521A1 (en) | 2021-10-07 |
| TWI912299B (zh) | 2026-01-21 |
| JP2023520120A (ja) | 2023-05-16 |
| CN115335889A (zh) | 2022-11-11 |
| AU2021246026A1 (en) | 2022-11-03 |
| US20250192116A1 (en) | 2025-06-12 |
| EP4128206A4 (en) | 2024-04-24 |
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