CN115335889B - 用于具有堆叠的键合结构的多色led的系统和方法 - Google Patents

用于具有堆叠的键合结构的多色led的系统和方法

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Publication number
CN115335889B
CN115335889B CN202180024512.XA CN202180024512A CN115335889B CN 115335889 B CN115335889 B CN 115335889B CN 202180024512 A CN202180024512 A CN 202180024512A CN 115335889 B CN115335889 B CN 115335889B
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China
Prior art keywords
layer
led
light emitting
emitting layer
substrate
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CN202180024512.XA
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Chinese (zh)
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CN115335889A (zh
Inventor
李起鸣
徐群超
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Shanghai Xianyao Display Technology Co Ltd
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Shanghai Xianyao Display Technology Co ltd
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Priority to CN202511021705.6A priority Critical patent/CN121078879A/zh
Publication of CN115335889A publication Critical patent/CN115335889A/zh
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0137Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018Bonding of wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/032Manufacture or treatment of electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/813Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • H10H20/8314Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • H10H20/8316Multi-layer electrodes comprising at least one discontinuous layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • H10H20/833Transparent materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142Two-dimensional arrangements, e.g. asymmetric LED layout
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0364Manufacture or treatment of packages of interconnections

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
CN202180024512.XA 2020-03-30 2021-03-30 用于具有堆叠的键合结构的多色led的系统和方法 Active CN115335889B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202511021705.6A CN121078879A (zh) 2020-03-30 2021-03-30 用于具有键合结构的led的系统和方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063002092P 2020-03-30 2020-03-30
US63/002,092 2020-03-30
PCT/US2021/024873 WO2021202521A1 (en) 2020-03-30 2021-03-30 Systems and methods for multi-color led with stacked bonding structures

Related Child Applications (1)

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CN202511021705.6A Division CN121078879A (zh) 2020-03-30 2021-03-30 用于具有键合结构的led的系统和方法

Publications (2)

Publication Number Publication Date
CN115335889A CN115335889A (zh) 2022-11-11
CN115335889B true CN115335889B (zh) 2025-08-29

Family

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CN202511021705.6A Pending CN121078879A (zh) 2020-03-30 2021-03-30 用于具有键合结构的led的系统和方法

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US (4) US12255185B2 (https=)
EP (1) EP4128206A4 (https=)
JP (1) JP2023520120A (https=)
KR (1) KR20220162161A (https=)
CN (2) CN115335889B (https=)
AU (1) AU2021246026A1 (https=)
DE (1) DE21780070T1 (https=)
TW (1) TWI912299B (https=)
WO (1) WO2021202521A1 (https=)

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US20230369304A1 (en) * 2022-05-11 2023-11-16 Seoul Viosys Co., Ltd. Pixel device and display apparatus having the same
CN115000118B (zh) * 2022-06-28 2024-12-31 安徽熙泰智能科技有限公司 有源寻址的micro LED元胞结构、其制备方法及micro LED器件
EP4542651A4 (en) * 2022-07-15 2025-11-26 Lg Electronics Inc Semiconductor Light Emitting Device Housing and Display Device
JP2025526685A (ja) * 2022-08-12 2025-08-15 ジェイド バード ディスプレイ(シャンハイ) リミテッド 多色led画素ユニットおよびマイクロledディスプレイパネル
CN116247143A (zh) * 2022-09-08 2023-06-09 华灿光电(浙江)有限公司 三基色发光二极管、发光模块及其制备方法
TWI854577B (zh) * 2023-04-06 2024-09-01 國立清華大學 紅外光發光元件
US20240395849A1 (en) * 2023-05-23 2024-11-28 Rayleigh Vision Limited Micro light-emitting diode panel structure
CN119604105B (zh) * 2023-09-07 2026-04-14 武汉华星光电半导体显示技术有限公司 显示面板
CN119630158B (zh) * 2023-09-12 2025-11-21 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN117012865B (zh) * 2023-09-27 2023-12-29 季华实验室 全彩Micro LED显示芯片及其制备方法
WO2025081418A1 (en) * 2023-10-19 2025-04-24 Jade Bird Display (shanghai) Limited A micro led display panel
CN119907388A (zh) * 2023-10-24 2025-04-29 京东方科技集团股份有限公司 发光芯片、显示装置和制造方法
CN119907389B (zh) * 2023-10-24 2025-11-25 武汉华星光电半导体显示技术有限公司 显示面板
WO2025097378A1 (en) * 2023-11-09 2025-05-15 Jade Bird Display (shanghai) Limited Micro led, micro led display panel and epitaxial structure
KR20250081955A (ko) * 2023-11-27 2025-06-09 삼성디스플레이 주식회사 표시 패널, 이를 포함하는 스마트 글라스, 및 이의 제조 방법

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Publication number Publication date
US12255185B2 (en) 2025-03-18
TW202145601A (zh) 2021-12-01
KR20220162161A (ko) 2022-12-07
US20250183236A1 (en) 2025-06-05
CN121078879A (zh) 2025-12-05
US20210305220A1 (en) 2021-09-30
US20260005204A1 (en) 2026-01-01
EP4128206A1 (en) 2023-02-08
WO2021202521A1 (en) 2021-10-07
TWI912299B (zh) 2026-01-21
DE21780070T1 (de) 2023-05-25
JP2023520120A (ja) 2023-05-16
CN115335889A (zh) 2022-11-11
AU2021246026A1 (en) 2022-11-03
US20250192116A1 (en) 2025-06-12
EP4128206A4 (en) 2024-04-24

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Address after: 201306 Shanghai Pudong New Area China Free Trade Zone Lingang New Area Ocean Road 99, No. 11, 13 7th Floor

Patentee after: Shanghai Xianyao Display Technology Co., Ltd.

Country or region after: China

Address before: 201306 No. 1889, Hongyin Road, Pudong New Area, Shanghai

Patentee before: SHANGHAI XIANYAO DISPLAY TECHNOLOGY Co.,Ltd.

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