JP2023104919A - 半導体パッケージ - Google Patents

半導体パッケージ Download PDF

Info

Publication number
JP2023104919A
JP2023104919A JP2023005313A JP2023005313A JP2023104919A JP 2023104919 A JP2023104919 A JP 2023104919A JP 2023005313 A JP2023005313 A JP 2023005313A JP 2023005313 A JP2023005313 A JP 2023005313A JP 2023104919 A JP2023104919 A JP 2023104919A
Authority
JP
Japan
Prior art keywords
layer
electrode
electrode layer
region
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023005313A
Other languages
English (en)
Japanese (ja)
Inventor
クォン，ミョンジェ
Myung Jae Kwon
ナム，サンヒョク
Sang Hyuck Nam
パク，ジンヒョン
Jin Hyung Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2023104919A publication Critical patent/JP2023104919A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023005313A 2022-01-18 2023-01-17 半導体パッケージ Pending JP2023104919A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2022-0007505 2022-01-18
KR1020220007505A KR20230111540A (ko) 2022-01-18 2022-01-18 회로 기판 및 이를 포함하는 반도체 패키지

Publications (1)

Publication Number Publication Date
JP2023104919A true JP2023104919A (ja) 2023-07-28

Family

ID=87161517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023005313A Pending JP2023104919A (ja) 2022-01-18 2023-01-17 半導体パッケージ

Country Status (3)

Country Link
US (1) US20230232544A1 (ko)
JP (1) JP2023104919A (ko)
KR (1) KR20230111540A (ko)

Also Published As

Publication number Publication date
KR20230111540A (ko) 2023-07-25
US20230232544A1 (en) 2023-07-20

Similar Documents

Publication Publication Date Title
US8709940B2 (en) Structure of circuit board and method for fabricating the same
KR102163039B1 (ko) 인쇄회로기판, 그 제조방법, 및 전자부품 모듈
US8642898B2 (en) Circuit board structure with capacitors embedded therein
JP2008085089A (ja) 樹脂配線基板および半導体装置
KR20070065789A (ko) 회로판 및 그 제조방법
US8785789B2 (en) Printed circuit board and method for manufacturing the same
US20140211437A1 (en) Component built-in board mounting body and method of manufacturing the same, and component built-in board
JP2014212141A (ja) 部品内蔵基板及びその製造方法並びに実装体
US11690173B2 (en) Circuit board structure
TWI498056B (zh) 具有內埋元件的電路板、其製作方法及封裝結構
KR101109261B1 (ko) 인쇄회로기판 및 그 제조방법
US8829361B2 (en) Wiring board and mounting structure using the same
US10219374B2 (en) Printed wiring board
KR20150065029A (ko) 인쇄회로기판, 그 제조방법 및 반도체 패키지
JP2023104919A (ja) 半導体パッケージ
US20230046699A1 (en) Circuit board structure
KR20230140714A (ko) 반도체 패키지
US20230137841A1 (en) Circuit carrier and manufacturing method thereof and package structure
KR20240012227A (ko) 회로 기판 및 이를 포함하는 반도체 패키지
KR20240020538A (ko) 회로 기판 및 이를 포함하는 반도체 패키지
KR20240020913A (ko) 회로 기판 및 이를 포함하는 반도체 패키지
KR20230155288A (ko) 회로 기판 및 이를 포함하는 반도체 패키지
JP2007324232A (ja) Ｂｇａ型多層配線板及びｂｇａ型半導体パッケージ
KR20240027243A (ko) 회로 기판 및 이를 포함하는 반도체 패키지
KR20230172218A (ko) 반도체 패키지