JP2023069822A - 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法 - Google Patents

酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法 Download PDF

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Publication number
JP2023069822A
JP2023069822A JP2021181970A JP2021181970A JP2023069822A JP 2023069822 A JP2023069822 A JP 2023069822A JP 2021181970 A JP2021181970 A JP 2021181970A JP 2021181970 A JP2021181970 A JP 2021181970A JP 2023069822 A JP2023069822 A JP 2023069822A
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Japan
Prior art keywords
copper
preform layer
substrate
bonding
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021181970A
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English (en)
Japanese (ja)
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JP2023069822A5 (https=
Inventor
順太 井上
Junta Inoue
大貴 古山
Daiki Furuyama
琢磨 片瀬
Takuma Katase
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP2021181970A priority Critical patent/JP2023069822A/ja
Priority to KR1020247012921A priority patent/KR20240110560A/ko
Priority to PCT/JP2022/041470 priority patent/WO2023080250A1/ja
Priority to TW111142603A priority patent/TW202340541A/zh
Priority to US18/705,691 priority patent/US20250003102A1/en
Publication of JP2023069822A publication Critical patent/JP2023069822A/ja
Publication of JP2023069822A5 publication Critical patent/JP2023069822A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2021181970A 2021-11-08 2021-11-08 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法 Pending JP2023069822A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021181970A JP2023069822A (ja) 2021-11-08 2021-11-08 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法
KR1020247012921A KR20240110560A (ko) 2021-11-08 2022-11-08 산성 전해 구리 도금액, 프리폼층의 형성 방법, 접합용 시트의 제조 방법, 접합용 기판의 제조 방법 및 접합체의 제조 방법
PCT/JP2022/041470 WO2023080250A1 (ja) 2021-11-08 2022-11-08 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法
TW111142603A TW202340541A (zh) 2021-11-08 2022-11-08 酸性電解鍍銅液、預成形層之形成方法、接合用薄片之製造方法、接合用基板之製造方法及接合體之製造方法
US18/705,691 US20250003102A1 (en) 2021-11-08 2022-11-08 Acidic electrolytic copper plating liquid, method for forming preform layer, method for producing joining sheet, method for producing joining substrate, and method for producing joined body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021181970A JP2023069822A (ja) 2021-11-08 2021-11-08 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法

Publications (2)

Publication Number Publication Date
JP2023069822A true JP2023069822A (ja) 2023-05-18
JP2023069822A5 JP2023069822A5 (https=) 2023-06-28

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JP2021181970A Pending JP2023069822A (ja) 2021-11-08 2021-11-08 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法

Country Status (5)

Country Link
US (1) US20250003102A1 (https=)
JP (1) JP2023069822A (https=)
KR (1) KR20240110560A (https=)
TW (1) TW202340541A (https=)
WO (1) WO2023080250A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025070623A1 (https=) * 2023-09-28 2025-04-03
WO2025187815A1 (ja) * 2024-03-08 2025-09-12 三菱マテリアル株式会社 酸性電解銅めっき液

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001152387A (ja) * 1999-09-16 2001-06-05 Ishihara Chem Co Ltd ボイドフリー銅メッキ方法
JP2010121194A (ja) * 2008-11-21 2010-06-03 Okuno Chem Ind Co Ltd 多孔質めっき皮膜形成用添加剤及び多孔質めっき皮膜の形成方法
JP2015533946A (ja) * 2012-09-24 2015-11-26 アルスィメール 電解液及びバリア層上に銅を電気めっきする方法
JP2017020082A (ja) * 2015-07-13 2017-01-26 株式会社Ｊｃｕ 多孔質壺状銅めっき皮膜形成用電気めっき浴およびこれを用いた多孔質壺状銅めっき皮膜の形成方法
WO2020040120A1 (ja) * 2018-08-23 2020-02-27 Dic株式会社 積層体、成形品、導電性パターン及び電子回路

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001152387A (ja) * 1999-09-16 2001-06-05 Ishihara Chem Co Ltd ボイドフリー銅メッキ方法
JP2010121194A (ja) * 2008-11-21 2010-06-03 Okuno Chem Ind Co Ltd 多孔質めっき皮膜形成用添加剤及び多孔質めっき皮膜の形成方法
JP2015533946A (ja) * 2012-09-24 2015-11-26 アルスィメール 電解液及びバリア層上に銅を電気めっきする方法
JP2017020082A (ja) * 2015-07-13 2017-01-26 株式会社Ｊｃｕ 多孔質壺状銅めっき皮膜形成用電気めっき浴およびこれを用いた多孔質壺状銅めっき皮膜の形成方法
WO2020040120A1 (ja) * 2018-08-23 2020-02-27 Dic株式会社 積層体、成形品、導電性パターン及び電子回路

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025070623A1 (https=) * 2023-09-28 2025-04-03
JP7763385B2 (ja) 2023-09-28 2025-10-31 古河電気工業株式会社 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法
JP2025178364A (ja) * 2023-09-28 2025-12-05 古河電気工業株式会社 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法
JP7804139B2 (ja) 2023-09-28 2026-01-21 古河電気工業株式会社 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法
WO2025187815A1 (ja) * 2024-03-08 2025-09-12 三菱マテリアル株式会社 酸性電解銅めっき液

Also Published As

Publication number Publication date
TW202340541A (zh) 2023-10-16
WO2023080250A1 (ja) 2023-05-11
US20250003102A1 (en) 2025-01-02
KR20240110560A (ko) 2024-07-15

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