JPWO2025070623A1 - - Google Patents
Info
- Publication number
- JPWO2025070623A1 JPWO2025070623A1 JP2025502689A JP2025502689A JPWO2025070623A1 JP WO2025070623 A1 JPWO2025070623 A1 JP WO2025070623A1 JP 2025502689 A JP2025502689 A JP 2025502689A JP 2025502689 A JP2025502689 A JP 2025502689A JP WO2025070623 A1 JPWO2025070623 A1 JP WO2025070623A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025158196A JP7804139B2 (ja) | 2023-09-28 | 2025-09-24 | 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023168826 | 2023-09-28 | ||
| JP2023168826 | 2023-09-28 | ||
| PCT/JP2024/034458 WO2025070623A1 (ja) | 2023-09-28 | 2024-09-26 | 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025158196A Division JP7804139B2 (ja) | 2023-09-28 | 2025-09-24 | 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025070623A1 true JPWO2025070623A1 (https=) | 2025-04-03 |
| JPWO2025070623A5 JPWO2025070623A5 (https=) | 2025-09-03 |
| JP7763385B2 JP7763385B2 (ja) | 2025-10-31 |
Family
ID=95201601
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025502689A Active JP7763385B2 (ja) | 2023-09-28 | 2024-09-26 | 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法 |
| JP2025158196A Active JP7804139B2 (ja) | 2023-09-28 | 2025-09-24 | 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025158196A Active JP7804139B2 (ja) | 2023-09-28 | 2025-09-24 | 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP7763385B2 (https=) |
| CN (1) | CN121942350A (https=) |
| TW (1) | TW202529277A (https=) |
| WO (1) | WO2025070623A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006032888A (ja) * | 2004-06-17 | 2006-02-02 | Renesas Technology Corp | 半導体装置および半導体装置の製造方法 |
| WO2018020640A1 (ja) * | 2016-07-28 | 2018-02-01 | 三菱電機株式会社 | 半導体装置 |
| JP2021097113A (ja) * | 2019-12-16 | 2021-06-24 | 株式会社デンソー | 半導体装置 |
| JP2023069822A (ja) * | 2021-11-08 | 2023-05-18 | 三菱マテリアル株式会社 | 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法 |
-
2024
- 2024-09-26 CN CN202480061977.6A patent/CN121942350A/zh active Pending
- 2024-09-26 WO PCT/JP2024/034458 patent/WO2025070623A1/ja active Pending
- 2024-09-26 JP JP2025502689A patent/JP7763385B2/ja active Active
- 2024-09-27 TW TW113137043A patent/TW202529277A/zh unknown
-
2025
- 2025-09-24 JP JP2025158196A patent/JP7804139B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006032888A (ja) * | 2004-06-17 | 2006-02-02 | Renesas Technology Corp | 半導体装置および半導体装置の製造方法 |
| WO2018020640A1 (ja) * | 2016-07-28 | 2018-02-01 | 三菱電機株式会社 | 半導体装置 |
| JP2021097113A (ja) * | 2019-12-16 | 2021-06-24 | 株式会社デンソー | 半導体装置 |
| JP2023069822A (ja) * | 2021-11-08 | 2023-05-18 | 三菱マテリアル株式会社 | 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7763385B2 (ja) | 2025-10-31 |
| JP7804139B2 (ja) | 2026-01-21 |
| JP2025178364A (ja) | 2025-12-05 |
| CN121942350A (zh) | 2026-04-28 |
| TW202529277A (zh) | 2025-07-16 |
| WO2025070623A1 (ja) | 2025-04-03 |
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