JP7763385B2 - 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法 - Google Patents

接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法

Info

Publication number
JP7763385B2
JP7763385B2 JP2025502689A JP2025502689A JP7763385B2 JP 7763385 B2 JP7763385 B2 JP 7763385B2 JP 2025502689 A JP2025502689 A JP 2025502689A JP 2025502689 A JP2025502689 A JP 2025502689A JP 7763385 B2 JP7763385 B2 JP 7763385B2
Authority
JP
Japan
Prior art keywords
metal
bonding
layer
bonding film
semiconductor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025502689A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025070623A5 (https=
JPWO2025070623A1 (https=
Inventor
宝生 瀧本
尚明 三原
洋 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of JPWO2025070623A1 publication Critical patent/JPWO2025070623A1/ja
Publication of JPWO2025070623A5 publication Critical patent/JPWO2025070623A5/ja
Priority to JP2025158196A priority Critical patent/JP7804139B2/ja
Application granted granted Critical
Publication of JP7763385B2 publication Critical patent/JP7763385B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Die Bonding (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2025502689A 2023-09-28 2024-09-26 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法 Active JP7763385B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025158196A JP7804139B2 (ja) 2023-09-28 2025-09-24 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023168826 2023-09-28
JP2023168826 2023-09-28
PCT/JP2024/034458 WO2025070623A1 (ja) 2023-09-28 2024-09-26 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025158196A Division JP7804139B2 (ja) 2023-09-28 2025-09-24 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法

Publications (3)

Publication Number Publication Date
JPWO2025070623A1 JPWO2025070623A1 (https=) 2025-04-03
JPWO2025070623A5 JPWO2025070623A5 (https=) 2025-09-03
JP7763385B2 true JP7763385B2 (ja) 2025-10-31

Family

ID=95201601

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2025502689A Active JP7763385B2 (ja) 2023-09-28 2024-09-26 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法
JP2025158196A Active JP7804139B2 (ja) 2023-09-28 2025-09-24 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025158196A Active JP7804139B2 (ja) 2023-09-28 2025-09-24 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法

Country Status (4)

Country Link
JP (2) JP7763385B2 (https=)
CN (1) CN121942350A (https=)
TW (1) TW202529277A (https=)
WO (1) WO2025070623A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006032888A (ja) 2004-06-17 2006-02-02 Renesas Technology Corp 半導体装置および半導体装置の製造方法
WO2018020640A1 (ja) 2016-07-28 2018-02-01 三菱電機株式会社 半導体装置
JP2021097113A (ja) 2019-12-16 2021-06-24 株式会社デンソー 半導体装置
JP2023069822A (ja) 2021-11-08 2023-05-18 三菱マテリアル株式会社 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006032888A (ja) 2004-06-17 2006-02-02 Renesas Technology Corp 半導体装置および半導体装置の製造方法
WO2018020640A1 (ja) 2016-07-28 2018-02-01 三菱電機株式会社 半導体装置
JP2021097113A (ja) 2019-12-16 2021-06-24 株式会社デンソー 半導体装置
JP2023069822A (ja) 2021-11-08 2023-05-18 三菱マテリアル株式会社 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法

Also Published As

Publication number Publication date
JP7804139B2 (ja) 2026-01-21
JP2025178364A (ja) 2025-12-05
JPWO2025070623A1 (https=) 2025-04-03
CN121942350A (zh) 2026-04-28
TW202529277A (zh) 2025-07-16
WO2025070623A1 (ja) 2025-04-03

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