CN121942350A - 接合用膜、半导体模块、逆变器、电子设备以及半导体模块的制造方法 - Google Patents

接合用膜、半导体模块、逆变器、电子设备以及半导体模块的制造方法

Info

Publication number
CN121942350A
CN121942350A CN202480061977.6A CN202480061977A CN121942350A CN 121942350 A CN121942350 A CN 121942350A CN 202480061977 A CN202480061977 A CN 202480061977A CN 121942350 A CN121942350 A CN 121942350A
Authority
CN
China
Prior art keywords
bonding
metal
layer
bonded
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480061977.6A
Other languages
English (en)
Chinese (zh)
Inventor
泷本宝生
三原尚明
金子洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of CN121942350A publication Critical patent/CN121942350A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Die Bonding (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN202480061977.6A 2023-09-28 2024-09-26 接合用膜、半导体模块、逆变器、电子设备以及半导体模块的制造方法 Pending CN121942350A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023168826 2023-09-28
JP2023-168826 2023-09-28
PCT/JP2024/034458 WO2025070623A1 (ja) 2023-09-28 2024-09-26 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法

Publications (1)

Publication Number Publication Date
CN121942350A true CN121942350A (zh) 2026-04-28

Family

ID=95201601

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480061977.6A Pending CN121942350A (zh) 2023-09-28 2024-09-26 接合用膜、半导体模块、逆变器、电子设备以及半导体模块的制造方法

Country Status (4)

Country Link
JP (2) JP7763385B2 (https=)
CN (1) CN121942350A (https=)
TW (1) TW202529277A (https=)
WO (1) WO2025070623A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4145287B2 (ja) * 2004-06-17 2008-09-03 株式会社ルネサステクノロジ 半導体装置および半導体装置の製造方法
WO2018020640A1 (ja) * 2016-07-28 2018-02-01 三菱電機株式会社 半導体装置
JP7495225B2 (ja) * 2019-12-16 2024-06-04 株式会社デンソー 半導体装置
JP2023069822A (ja) * 2021-11-08 2023-05-18 三菱マテリアル株式会社 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法

Also Published As

Publication number Publication date
JP7763385B2 (ja) 2025-10-31
JP7804139B2 (ja) 2026-01-21
JP2025178364A (ja) 2025-12-05
JPWO2025070623A1 (https=) 2025-04-03
TW202529277A (zh) 2025-07-16
WO2025070623A1 (ja) 2025-04-03

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