TW202529277A - 接合用膜、半導體模組、變流器、電子機器及半導體模組之製造方法 - Google Patents

接合用膜、半導體模組、變流器、電子機器及半導體模組之製造方法

Info

Publication number
TW202529277A
TW202529277A TW113137043A TW113137043A TW202529277A TW 202529277 A TW202529277 A TW 202529277A TW 113137043 A TW113137043 A TW 113137043A TW 113137043 A TW113137043 A TW 113137043A TW 202529277 A TW202529277 A TW 202529277A
Authority
TW
Taiwan
Prior art keywords
bonding
metal
layer
bonding film
film
Prior art date
Application number
TW113137043A
Other languages
English (en)
Chinese (zh)
Inventor
瀧本宝生
三原尚明
金子洋
Original Assignee
日商古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商古河電氣工業股份有限公司 filed Critical 日商古河電氣工業股份有限公司
Publication of TW202529277A publication Critical patent/TW202529277A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Die Bonding (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW113137043A 2023-09-28 2024-09-27 接合用膜、半導體模組、變流器、電子機器及半導體模組之製造方法 TW202529277A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023168826 2023-09-28
JP2023-168826 2023-09-28

Publications (1)

Publication Number Publication Date
TW202529277A true TW202529277A (zh) 2025-07-16

Family

ID=95201601

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113137043A TW202529277A (zh) 2023-09-28 2024-09-27 接合用膜、半導體模組、變流器、電子機器及半導體模組之製造方法

Country Status (4)

Country Link
JP (2) JP7763385B2 (https=)
CN (1) CN121942350A (https=)
TW (1) TW202529277A (https=)
WO (1) WO2025070623A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4145287B2 (ja) * 2004-06-17 2008-09-03 株式会社ルネサステクノロジ 半導体装置および半導体装置の製造方法
WO2018020640A1 (ja) * 2016-07-28 2018-02-01 三菱電機株式会社 半導体装置
JP7495225B2 (ja) * 2019-12-16 2024-06-04 株式会社デンソー 半導体装置
JP2023069822A (ja) * 2021-11-08 2023-05-18 三菱マテリアル株式会社 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法

Also Published As

Publication number Publication date
JP7763385B2 (ja) 2025-10-31
JP7804139B2 (ja) 2026-01-21
JP2025178364A (ja) 2025-12-05
JPWO2025070623A1 (https=) 2025-04-03
CN121942350A (zh) 2026-04-28
WO2025070623A1 (ja) 2025-04-03

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