JP2023069822A5 - - Google Patents
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- Publication number
- JP2023069822A5 JP2023069822A5 JP2021181970A JP2021181970A JP2023069822A5 JP 2023069822 A5 JP2023069822 A5 JP 2023069822A5 JP 2021181970 A JP2021181970 A JP 2021181970A JP 2021181970 A JP2021181970 A JP 2021181970A JP 2023069822 A5 JP2023069822 A5 JP 2023069822A5
- Authority
- JP
- Japan
- Prior art keywords
- less
- copper
- preform layer
- group
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 9
- 230000002378 acidificating effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000002105 nanoparticle Substances 0.000 claims description 4
- 238000010191 image analysis Methods 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 7
- 125000003277 amino group Chemical group 0.000 claims 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 3
- 229910052799 carbon Inorganic materials 0.000 claims 3
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims 2
- -1 azole compound Chemical class 0.000 claims 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 2
- 125000005843 halogen group Chemical group 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000000304 alkynyl group Chemical group 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 150000001879 copper Chemical class 0.000 claims 1
- 229910001431 copper ion Inorganic materials 0.000 claims 1
- 238000004070 electrodeposition Methods 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021181970A JP2023069822A (ja) | 2021-11-08 | 2021-11-08 | 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法 |
| KR1020247012921A KR20240110560A (ko) | 2021-11-08 | 2022-11-08 | 산성 전해 구리 도금액, 프리폼층의 형성 방법, 접합용 시트의 제조 방법, 접합용 기판의 제조 방법 및 접합체의 제조 방법 |
| PCT/JP2022/041470 WO2023080250A1 (ja) | 2021-11-08 | 2022-11-08 | 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法 |
| TW111142603A TW202340541A (zh) | 2021-11-08 | 2022-11-08 | 酸性電解鍍銅液、預成形層之形成方法、接合用薄片之製造方法、接合用基板之製造方法及接合體之製造方法 |
| US18/705,691 US20250003102A1 (en) | 2021-11-08 | 2022-11-08 | Acidic electrolytic copper plating liquid, method for forming preform layer, method for producing joining sheet, method for producing joining substrate, and method for producing joined body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021181970A JP2023069822A (ja) | 2021-11-08 | 2021-11-08 | 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023069822A JP2023069822A (ja) | 2023-05-18 |
| JP2023069822A5 true JP2023069822A5 (https=) | 2023-06-28 |
Family
ID=86241621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021181970A Pending JP2023069822A (ja) | 2021-11-08 | 2021-11-08 | 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250003102A1 (https=) |
| JP (1) | JP2023069822A (https=) |
| KR (1) | KR20240110560A (https=) |
| TW (1) | TW202340541A (https=) |
| WO (1) | WO2023080250A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7763385B2 (ja) * | 2023-09-28 | 2025-10-31 | 古河電気工業株式会社 | 接合用フィルム、半導体モジュール、インバータ、電子機器及び半導体モジュールの製造方法 |
| JP2025137155A (ja) * | 2024-03-08 | 2025-09-19 | 三菱マテリアル株式会社 | 酸性電解銅めっき液 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3498306B2 (ja) * | 1999-09-16 | 2004-02-16 | 石原薬品株式会社 | ボイドフリー銅メッキ方法 |
| JP5366076B2 (ja) * | 2008-11-21 | 2013-12-11 | 奥野製薬工業株式会社 | 多孔質めっき皮膜形成用添加剤を含有する多孔質めっき皮膜用電気めっき浴 |
| FR2995912B1 (fr) * | 2012-09-24 | 2014-10-10 | Alchimer | Electrolyte et procede d'electrodeposition de cuivre sur une couche barriere |
| JP6543526B2 (ja) * | 2015-07-13 | 2019-07-10 | 株式会社Ｊｃｕ | 多孔質壺状銅めっき皮膜形成用電気めっき浴およびこれを用いた多孔質壺状銅めっき皮膜の形成方法 |
| TWI819048B (zh) * | 2018-08-23 | 2023-10-21 | 日商Ｄｉｃ股份有限公司 | 積層體、成形品、導電性圖案及電子電路 |
-
2021
- 2021-11-08 JP JP2021181970A patent/JP2023069822A/ja active Pending
-
2022
- 2022-11-08 TW TW111142603A patent/TW202340541A/zh unknown
- 2022-11-08 US US18/705,691 patent/US20250003102A1/en active Pending
- 2022-11-08 KR KR1020247012921A patent/KR20240110560A/ko active Pending
- 2022-11-08 WO PCT/JP2022/041470 patent/WO2023080250A1/ja not_active Ceased
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