JP2023030046A - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- JP2023030046A JP2023030046A JP2022200599A JP2022200599A JP2023030046A JP 2023030046 A JP2023030046 A JP 2023030046A JP 2022200599 A JP2022200599 A JP 2022200599A JP 2022200599 A JP2022200599 A JP 2022200599A JP 2023030046 A JP2023030046 A JP 2023030046A
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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Abstract
Description
[付記A1]
半導体素子と、
前記半導体素子に導通する被接合体と、
材質が第1金属である第1ワイヤであって、前記被接合体に接合された第1ボンディング部および当該第1ボンディング部から延びる第1線状部を含む、第1ワイヤと、
材質が前記第1金属であり、かつ、前記被接合体に接合されたワイヤ片と、
材質が前記第1金属とは異なる第2金属である第2ワイヤであって、前記ワイヤ片を介して前記被接合体に接合された第2ボンディング部および当該第2ボンディング部から延びる第2線状部を含む、第2ワイヤと、を備える、半導体装置。
[付記A2]
前記第2ボンディング部は、前記被接合体から離間している、
付記A1に記載の半導体装置。
[付記A3]
前記第1ボンディング部および前記ワイヤ片は、ウェッジツールを用いたウェッジボンディングによって接合されており、当該接合時に形成された押圧痕を有する、
付記A1または付記A2に記載の半導体装置。
[付記A4]
前記ワイヤ片の形状は、前記第1ボンディング部と略同じ形状である、
付記A3に記載の半導体装置。
[付記A5]
前記第2ボンディング部は、ボールボンディングによって接合されたボール接合部である、
付記A1ないし付記A4のいずれか一項に記載の半導体装置。
[付記A6]
前記第2ボンディング部は、ステッチボンディングによって接合されたステッチ接合部である、
付記A1ないし付記A4のいずれか一項に記載の半導体装置。
[付記A7]
前記ワイヤ片は、細長形状であり、
前記第2線状部が前記ステッチ接合部から延びる方向と、前記ワイヤ片の長手方向とが一致する、
付記A6に記載の半導体装置。
[付記A8]
前記第1ワイヤおよび前記ワイヤ片の各々と前記被接合体との接合強度は、前記第2ワイヤを前記被接合体に直接接合した場合の前記第2ワイヤと前記被接合体との接合強度より高く、
前記ワイヤ片と前記第2ワイヤとの接合強度は、前記第2ワイヤを前記被接合体に直接接合した場合の前記第2ワイヤと前記被接合体との接合強度より高い、
付記A1ないし付記A7のいずれか一項に記載の半導体装置。
[付記A9]
前記第1ワイヤのワイヤ径は、前記第2ワイヤのワイヤ径より大きい、
付記A1ないし付記A8のいずれか一項に記載の半導体装置。
[付記A10]
前記被接合体は、前記第1ボンディング部が接合された被第1ボンディング部と、前記第2ボンディング部が前記ワイヤ片を介して接合された被第2ボンディング部と、を含み、
前記被第1ボンディング部および前記被第2ボンディング部は、互いに同じ材質の表層を有する、
付記A1ないし付記A9のいずれか一項に記載の半導体装置。
[付記A11]
前記被第1ボンディング部と前記被第2ボンディング部とはニッケルめっきされている、
付記A10に記載の半導体装置。
[付記A12]
前記第1金属は、主成分がアルミニウムであり、
前記第2金属は、主成分が金あるいは銅である、
付記A11に記載の半導体装置。
[付記A13]
半導体装置の製造方法であって、
材質が第1金属である第1配線材の一部を被接合体に接合することによりワイヤ片を形成することと、
前記第1配線材を用いて、前記被接合体に接合された第1ボンディング部および当該第1ボンディング部から延びる第1線状部を含む第1ワイヤを形成することと、
材質が前記第1金属とは異なる第2金属である第2配線材を用いて、前記ワイヤ片に接合された第2ボンディング部および当該第2ボンディング部から延びる第2線状部を含む第2ワイヤを形成することと、を有する、製造方法。
[付記A14]
前記ワイヤ片を形成することにおいては、ワイヤガイドと、当該ワイヤガイドから送られてくる前記第1配線材を接合対象に対して押し付けるウェッジと、前記第1配線材を切断するカッタとを備えたウェッジツールを用いて、前記ワイヤ片を形成し、
前記第1ワイヤを形成することにおいては、前記ウェッジツールを用いて、前記第1ワイヤを形成する、
付記A13に記載の製造方法。
[付記A15]
前記ワイヤ片を形成することは、
前記ウェッジによって前記被接合体に対して前記第1配線材の一部を押し付けた状態で超音波振動を付加して、前記第1配線材の一部を前記被接合体に接合することと、
前記第1配線材の一部を残すように前記第1配線材を切断することで、前記ワイヤ片を形成することと、を含む、
付記A14に記載の製造方法。
[付記A16]
前記第2ワイヤを形成することにおいては、キャピラリを用いて、前記第2ワイヤを形成し、
前記第2ワイヤを形成することは、
前記キャピラリの先端から突き出た前記第2配線材を溶融させて溶融ボールを形成することと、
当該溶融ボールを前記ワイヤ片に押し付けて接合することで、前記第2ボンディング部を形成するボールボンディングと、
当該ボールボンディング後に、前記第2配線材を引き出しつつ、前記キャピラリを移動することで、前記第2線状部を形成するルーピングと、
当該ルーピング後に、前記第2配線材を半導体素子に対して押し付けて接合するステッチボンディングと、を含む、
付記A13ないし付記A15のいずれか一項に記載の製造方法。
[付記A17]
前記第2ワイヤを形成することにおいては、キャピラリを用いて、前記第2ワイヤを形成し、
前記第2ワイヤを形成することは、
前記キャピラリの先端から突き出た前記第2配線材を溶融させて溶融ボールを形成し、当該溶融ボールを半導体素子に押し付けて接合するボールボンディングと、
当該ボールボンディング後に、前記第2配線材を引き出しつつ、前記キャピラリを移動することで、前記第2線状部を形成するルーピングと、
当該ルーピング後に、前記第2配線材を前記ワイヤ片に対して押し付けて接合することで、前記第2ボンディング部を形成するステッチボンディングと、を含む、
付記A13ないし付記A15のいずれか一項に記載の製造方法。
[付記A18]
前記ワイヤ片は、細長形状であり、
前記第2ワイヤを形成することにおいて、前記第2ボンディング部から前記第2線状部が延びる方向と、前記ワイヤ片の長手方向とを一致させて、前記第2ワイヤを形成する、付記A17に記載の製造方法。
[付記A19]
前記第1金属として、前記被接合体との接合強度が前記第2金属と前記被接合体との接合強度より高く、かつ、前記第2金属との接合強度が前記第2金属と前記被接合体との接合強度より高いものを用いる、
付記A13ないし付記A18のいずれか一項に記載の製造方法。
[付記A20]
前記第1ワイヤのワイヤ径は、前記第2ワイヤのワイヤ径より大きい、
付記A13ないし付記A19のいずれか一項に記載の製造方法。
[付記A21]
前記被接合体は、前記第1ボンディング部が接合された被第1ボンディング部と、前記第2ボンディング部が前記ワイヤ片を介して接合された被第2ボンディング部と、を含み、
前記被第1ボンディング部および前記被第2ボンディング部は、互いに同じ材質の表層を有する、
付記A13ないし付記A20のいずれか一項に記載の製造方法。
[付記A22]
前記被第1ボンディング部と前記被第2ボンディング部とにニッケルめっきを施すことをさらに有する、
付記A21に記載の製造方法。
[付記A23]
前記第1金属として、主成分がアルミニウムである金属を用い、
前記第2金属として、主成分が金あるいは銅である金属を用いる、
付記A22に記載の製造方法。
1 :半導体チップ
11 :第1半導体チップ
111 :チップ主面
112 :チップ裏面
113 :電極パッド
12 :第2半導体チップ(半導体素子)
121 :チップ主面
122 :チップ裏面
2 :リードフレーム(被接合体)
2A~2I:第1~第9リード
21 :ダイボンディング部
211 :第1ダイボンディング部
212 :第2ダイボンディング部
22 :ワイヤボンディング部
221 :第1ワイヤボンディング部(被第1ボンディング部)
222 :第2ワイヤボンディング部(被第2ボンディング部)
23 :端子部
24 :放熱部
200 :リードフレーム(被接合体)
201 :フレーム
3 :ワイヤ
301 :第1配線材
302 :第2配線材
31 :第1ワイヤ
311 :ウェッジ接合部
312 :ウェッジ接合部(第1ボンディング部)
313 :第1線状部
32 :第2ワイヤ
321 :ボール接合部(第2ボンディング部)
322 :ステッチ接合部(第2ボンディング部)
323 :第2線状部
33 :第3ワイヤ
331 :ボール接合部
332 :ステッチ接合部
333 :第3線状部
4 :ワイヤ片
411 :被押圧面
412 :当接面
413 :外周面
42 :破断面
43 :押圧痕
5 :樹脂パッケージ
6 :ウェッジツール
61 :ウェッジ
611 :ガイド溝
611a:内面
62 :ワイヤガイド
63 :カッタ
7 :キャピラリ
71 :溶融ボール
91 :接合層
[付記B1]
半導体素子と、
一端が前記半導体素子に接合されたアルミニウムワイヤと、
前記アルミニウムワイヤを覆うワイヤ被覆部を有する陽極酸化皮膜と、
前記半導体素子および前記陽極酸化皮膜を覆う封止樹脂と、
を備えることを特徴とする半導体装置。
[付記B2]
前記半導体素子は、主成分がアルミニウムである電極パッドを有しており、
当該電極パッドは、前記アルミニウムワイヤの一端が接合されたパッド主面を有しており、
前記陽極酸化皮膜は、前記パッド主面を覆うパッド被覆部をさらに有する、
付記B1に記載の半導体装置。
[付記B3]
前記陽極酸化皮膜は、前記ワイヤ被覆部と前記パッド被覆部とが一体的に形成されている、
付記B2に記載の半導体装置。
[付記B4]
前記陽極酸化皮膜は、複数の孔が形成されたポーラス層を有しており、
前記複数の孔を封孔する水和物をさらに備える、
付記B1ないし付記B3のいずれか一項に記載の半導体装置。
[付記B5]
前記アルミニウムワイヤには、鉄、ケイ素、あるいは、ニッケルが添加されている、
付記B1ないし付記B4のいずれか一項に記載の半導体装置。
[付記B6]
前記半導体素子と電気的に接続された電極をさらに備えており、
当該電極は、前記封止樹脂の内側で前記半導体素子が接合されたダイボンディング部と前記封止樹脂から露出する端子部とを有する、
付記B1ないし付記B5のいずれか一項に記載の半導体装置。
[付記B7]
前記電極は、リードフレームである、
付記B6に記載の半導体装置。
[付記B8]
アルミニウムワイヤの一端を前記半導体素子に接合することと、
前記アルミニウムワイヤを覆う陽極酸化皮膜を形成することと、
半導体素子および前記陽極酸化皮膜を覆う封止樹脂を形成することと、
を有することを特徴とする、半導体装置の製造方法。
[付記B9]
前記半導体素子は、主成分がアルミニウムである電極パッドを有しており、
前記ワイヤボンディング工程において、前記アルミニウムワイヤの一端を前記電極パッドに接合し、
前記陽極酸化皮膜を形成することにおいて、前記電極パッドを覆う陽極酸化皮膜を形成する、
付記B8に記載の製造方法。
[付記B10]
前記陽極酸化皮膜を形成することは、前記アルミニウムワイヤの一端を前記半導体素子に接合することの後であり、かつ、前記封止樹脂を形成することの前に行われる、
付記B9に記載の製造方法。
[付記B11]
前記アルミニウムワイヤの一端を前記半導体素子に接合することにおいては、ウェッジボンディング法を用いる、
付記B8ないし付記B10のいずれか一項に記載の製造方法。
[付記B12]
前記陽極酸化皮膜は、複数の孔が形成されたポーラス層を有し、
前記複数の孔を水和物により封孔することをさらに有する、
付記B8ないし付記B11のいずれか一項に記載の製造方法。
[付記B13]
前記半導体装置は、前記半導体素子と電気的に接続される電極をさらに備えており、
前記半導体素子を前記電極に接合することをさらに有する、
付記B8ないし付記B12のいずれか一項に記載の製造方法。
[付記B14]
前記陽極酸化皮膜を形成することにおいては、陽極としての前記電極と陰極とを電解液に浸し、前記陽極および前記陰極に直流電圧を印加する、
付記B13に記載の製造方法。
[付記B15]
前記陽極酸化皮膜を形成することにおいて、前記電解液にアルカリ性の溶液を用いる、付記B14に記載の製造方法。
1 :半導体チップ
11 :第1半導体チップ
111 :チップ主面
112 :チップ裏面
113 :電極パッド
113a:パッド主面
113b:パッド裏面
113c:パッド側面
12 :第2半導体チップ
121 :チップ主面
122 :チップ裏面
2 :リードフレーム
2A~2I:第1~第9リード
21 :ダイボンディング部
211 :第1ダイボンディング部
212 :第2ダイボンディング部
22 :ワイヤボンディング部
221 :第1ワイヤボンディング部
222 :第2ワイヤボンディング部
23 :端子部
24 :放熱部
200 :リードフレーム
201 :フレーム
3 :ワイヤ
31 :アルミワイヤ
32 :金ワイヤ
4 :陽極酸化皮膜
4A :アルミ素地
4B :バリア層
4C :ポーラス層
4D :孔
41 :ワイヤ被覆部
42 :パッド被覆部
5 :樹脂パッケージ
6 :水和物
71 :陰極
72 :電解液
91 :接合層
Claims (15)
- 半導体素子と、
一端が前記半導体素子に接合されたアルミニウムワイヤと、
前記アルミニウムワイヤを覆うワイヤ被覆部を有する陽極酸化皮膜と、
前記半導体素子および前記陽極酸化皮膜を覆う封止樹脂と、を備えることを特徴とする半導体装置。 - 前記半導体素子は、主成分がアルミニウムである電極パッドを有しており、
当該電極パッドは、前記アルミニウムワイヤの一端が接合されたパッド主面を有しており、
前記陽極酸化皮膜は、前記パッド主面を覆うパッド被覆部をさらに有する、請求項1に記載の半導体装置。 - 前記陽極酸化皮膜は、前記ワイヤ被覆部と前記パッド被覆部とが一体的に形成されている、請求項2に記載の半導体装置。
- 前記陽極酸化皮膜は、複数の孔が形成されたポーラス層を有しており、
前記複数の孔を封孔する水和物をさらに備える、請求項1ないし請求項3のいずれか一項に記載の半導体装置。 - 前記アルミニウムワイヤには、鉄、ケイ素、あるいは、ニッケルが添加されている、請求項1ないし請求項4のいずれか一項に記載の半導体装置。
- 前記半導体素子と電気的に接続された電極をさらに備えており、
当該電極は、前記封止樹脂の内側で前記半導体素子が接合されたダイボンディング部と前記封止樹脂から露出する端子部とを有する、請求項1ないし請求項5のいずれか一項に記載の半導体装置。 - 前記電極は、リードフレームである、請求項6に記載の半導体装置。
- 半導体装置の製造方法であって、
アルミニウムワイヤの一端を半導体素子に接合することと、
前記アルミニウムワイヤを覆う陽極酸化皮膜を形成することと、
前記半導体素子および前記陽極酸化皮膜を覆う封止樹脂を形成することと、
を有することを特徴とする、製造方法。 - 前記半導体素子は、主成分がアルミニウムである電極パッドを有しており、
前記アルミニウムワイヤの一端を前記半導体素子に接合することにおいて、前記アルミニウムワイヤの一端を前記電極パッドに接合し、
前記陽極酸化皮膜を形成することにおいて、前記電極パッドを覆う陽極酸化皮膜を形成する、請求項8に記載の製造方法。 - 前記陽極酸化皮膜を形成することは、前記アルミニウムワイヤの一端を前記半導体素子に接合することの後であり、かつ、前記封止樹脂を形成することの前に行われる、請求項9に記載の製造方法。
- 前記アルミニウムワイヤの一端を前記半導体素子に接合することにおいては、ウェッジボンディング法を用いる、請求項8ないし請求項10のいずれか一項に記載の製造方法。
- 前記陽極酸化皮膜は、複数の孔が形成されたポーラス層を有し、
前記複数の孔を水和物により封孔することをさらに有する、請求項8ないし請求項11のいずれか一項に記載の製造方法。 - 前記半導体装置は、前記半導体素子と電気的に接続される電極をさらに備えており、
前記半導体素子を前記電極に接合することをさらに有する、請求項8ないし請求項12のいずれか一項に記載の製造方法。 - 前記陽極酸化皮膜を形成することにおいては、陽極としての前記電極と陰極とを電解液に浸し、前記陽極および前記陰極に直流電圧を印加する、請求項13に記載の製造方法。
- 前記陽極酸化皮膜を形成することにおいて、前記電解液にアルカリ性の溶液を用いる、請求項14に記載の製造方法。
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