JP2022551842A5 - - Google Patents
Info
- Publication number
- JP2022551842A5 JP2022551842A5 JP2022520670A JP2022520670A JP2022551842A5 JP 2022551842 A5 JP2022551842 A5 JP 2022551842A5 JP 2022520670 A JP2022520670 A JP 2022520670A JP 2022520670 A JP2022520670 A JP 2022520670A JP 2022551842 A5 JP2022551842 A5 JP 2022551842A5
- Authority
- JP
- Japan
- Prior art keywords
- scribe lane
- mask
- exposure
- pattern
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962910857P | 2019-10-04 | 2019-10-04 | |
| US62/910,857 | 2019-10-04 | ||
| US16/679,997 US11094644B2 (en) | 2019-10-04 | 2019-11-11 | Integrated circuit with scribe lane patterns for defect reduction |
| US16/679,997 | 2019-11-11 | ||
| PCT/US2020/054204 WO2021067909A1 (en) | 2019-10-04 | 2020-10-05 | Integrated circuit with scribe lane patterns for defect reduction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022551842A JP2022551842A (ja) | 2022-12-14 |
| JP2022551842A5 true JP2022551842A5 (https=) | 2023-10-12 |
Family
ID=75274998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022520670A Pending JP2022551842A (ja) | 2019-10-04 | 2020-10-05 | 欠陥低減のためのスクライブレーンパターンを有する集積回路 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US11094644B2 (https=) |
| EP (1) | EP4042474A4 (https=) |
| JP (1) | JP2022551842A (https=) |
| CN (1) | CN114600231A (https=) |
| WO (1) | WO2021067909A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102846584B1 (ko) * | 2020-09-09 | 2025-08-18 | 삼성전자주식회사 | 반도체 패키지 |
| GB2644158A (en) * | 2024-08-27 | 2026-03-25 | Pragmatic Semiconductor Ltd | Integrated circuit chip |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2292637B (en) * | 1994-08-24 | 1998-07-22 | Nec Corp | Semiconductor device |
| US6068954A (en) * | 1998-09-01 | 2000-05-30 | Micron Technology, Inc. | Semiconductor wafer alignment methods |
| JP2001332556A (ja) * | 2000-05-25 | 2001-11-30 | Hitachi Ltd | 半導体装置の製造方法 |
| US6908830B2 (en) | 2003-06-23 | 2005-06-21 | International Business Machines Corporation | Method for printing marks on the edges of wafers |
| JP2010114130A (ja) * | 2008-11-04 | 2010-05-20 | Panasonic Corp | 半導体装置及びその製造方法 |
| US8368180B2 (en) | 2009-02-18 | 2013-02-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Scribe line metal structure |
| CN102156392A (zh) * | 2010-02-11 | 2011-08-17 | 中芯国际集成电路制造(上海)有限公司 | 光刻机对准参数的检测装置及其检测方法 |
| JP2011061236A (ja) * | 2010-11-26 | 2011-03-24 | Renesas Electronics Corp | 半導体装置 |
| CN103091971B (zh) * | 2011-10-27 | 2014-07-23 | 中芯国际集成电路制造(北京)有限公司 | 掩模板及其制造方法、以及监测掩模板雾状污染的方法 |
| JP5978732B2 (ja) * | 2012-04-17 | 2016-08-24 | 富士通セミコンダクター株式会社 | レチクル、露光方法、半導体装置の製造方法 |
| JP2015106693A (ja) * | 2013-12-02 | 2015-06-08 | 旭化成エレクトロニクス株式会社 | 半導体ウェハ及び半導体装置の製造方法 |
| CN105336711B (zh) * | 2014-06-19 | 2019-03-15 | 恩智浦美国有限公司 | 采用低k值介电材料的管芯边缘密封 |
| JP2017134292A (ja) | 2016-01-28 | 2017-08-03 | 三重富士通セミコンダクター株式会社 | 半導体装置の製造方法及びマスクの形成方法 |
| FR3075773B1 (fr) * | 2017-12-22 | 2020-01-24 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de realisation de dispositifs semi-conducteurs et de chemins de decoupe |
| WO2020164002A1 (en) * | 2019-02-13 | 2020-08-20 | Yangtze Memory Technologies Co., Ltd. | Marks for locating patterns in semiconductor fabrication |
-
2019
- 2019-11-11 US US16/679,997 patent/US11094644B2/en active Active
-
2020
- 2020-10-05 CN CN202080074719.3A patent/CN114600231A/zh active Pending
- 2020-10-05 WO PCT/US2020/054204 patent/WO2021067909A1/en not_active Ceased
- 2020-10-05 EP EP20871843.7A patent/EP4042474A4/en active Pending
- 2020-10-05 JP JP2022520670A patent/JP2022551842A/ja active Pending
-
2021
- 2021-07-15 US US17/376,876 patent/US20210398910A1/en active Pending
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