JP2022550365A5 - - Google Patents
Info
- Publication number
- JP2022550365A5 JP2022550365A5 JP2022519388A JP2022519388A JP2022550365A5 JP 2022550365 A5 JP2022550365 A5 JP 2022550365A5 JP 2022519388 A JP2022519388 A JP 2022519388A JP 2022519388 A JP2022519388 A JP 2022519388A JP 2022550365 A5 JP2022550365 A5 JP 2022550365A5
- Authority
- JP
- Japan
- Prior art keywords
- hydroxylamine
- acid
- composition according
- mixture
- derivative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962906810P | 2019-09-27 | 2019-09-27 | |
| US62/906,810 | 2019-09-27 | ||
| PCT/US2020/052406 WO2021061922A1 (en) | 2019-09-27 | 2020-09-24 | Compositions for removing etch residues, methods of using and use thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022550365A JP2022550365A (ja) | 2022-12-01 |
| JP2022550365A5 true JP2022550365A5 (https=) | 2023-10-02 |
| JP7628116B2 JP7628116B2 (ja) | 2025-02-07 |
Family
ID=75166177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022519388A Active JP7628116B2 (ja) | 2019-09-27 | 2020-09-24 | ポストエッチング残留物を除去するための組成物、その組成物を使用する方法、及びその組成物の使用 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12298669B2 (https=) |
| EP (1) | EP4034629A4 (https=) |
| JP (1) | JP7628116B2 (https=) |
| KR (1) | KR20220075230A (https=) |
| CN (1) | CN114450388B (https=) |
| TW (1) | TWI910116B (https=) |
| WO (1) | WO2021061922A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020195343A1 (ja) * | 2019-03-26 | 2020-10-01 | 富士フイルムエレクトロニクスマテリアルズ株式会社 | 洗浄液 |
| WO2021126340A1 (en) | 2019-12-20 | 2021-06-24 | Versum Materials Us, Llc | Co/cu selective wet etchant |
| CN114999911A (zh) * | 2022-05-24 | 2022-09-02 | 长鑫存储技术有限公司 | 半导体结构及其形成方法 |
| JP2024094844A (ja) * | 2022-12-28 | 2024-07-10 | 東京応化工業株式会社 | 洗浄液、並びに、基板の洗浄方法及び半導体素子の製造方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5279771A (en) | 1990-11-05 | 1994-01-18 | Ekc Technology, Inc. | Stripping compositions comprising hydroxylamine and alkanolamine |
| US6492311B2 (en) * | 1990-11-05 | 2002-12-10 | Ekc Technology, Inc. | Ethyenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process |
| US6825156B2 (en) | 2002-06-06 | 2004-11-30 | Ekc Technology, Inc. | Semiconductor process residue removal composition and process |
| US5419779A (en) | 1993-12-02 | 1995-05-30 | Ashland Inc. | Stripping with aqueous composition containing hydroxylamine and an alkanolamine |
| US5994046A (en) * | 1996-06-14 | 1999-11-30 | Fuji Photo Film Co., Ltd. | Silver halide color photographic light-sensitive material and method of forming color image using the same |
| AU6530000A (en) * | 1999-08-19 | 2001-03-19 | Ashland Inc. | Stripping and cleaning compositions |
| US6723691B2 (en) | 1999-11-16 | 2004-04-20 | Advanced Technology Materials, Inc. | Post chemical-mechanical planarization (CMP) cleaning composition |
| KR100366974B1 (ko) | 1999-12-30 | 2003-01-14 | 유니켐스 (주) | 드라이필름용 박리액 조성물 및 이를 이용한 드라이필름의박리방법 |
| US8003587B2 (en) * | 2002-06-06 | 2011-08-23 | Ekc Technology, Inc. | Semiconductor process residue removal composition and process |
| KR20040041019A (ko) | 2002-11-08 | 2004-05-13 | 스미또모 가가꾸 고오교오 가부시끼가이샤 | 반도체 기판용 세정액 |
| TWI339780B (en) | 2005-07-28 | 2011-04-01 | Rohm & Haas Elect Mat | Stripper |
| WO2009058275A1 (en) | 2007-10-29 | 2009-05-07 | Ekc Technology, Inc. | Methods of post chemical mechanical polishing and wafer cleaning using amidoxime compositions |
| EP2207872B1 (en) * | 2007-10-29 | 2013-07-03 | Ekc Technology, Inc. | Novel nitrile and amidoxime compounds and methods of preparation |
| CN101597548A (zh) * | 2008-06-06 | 2009-12-09 | 安集微电子科技(上海)有限公司 | 一种等离子刻蚀残留物清洗液 |
| US8518865B2 (en) | 2009-08-31 | 2013-08-27 | Air Products And Chemicals, Inc. | Water-rich stripping and cleaning formulation and method for using same |
| JP5646882B2 (ja) | 2009-09-30 | 2014-12-24 | 富士フイルム株式会社 | 洗浄組成物、洗浄方法、及び半導体装置の製造方法 |
| US8101561B2 (en) * | 2009-11-17 | 2012-01-24 | Wai Mun Lee | Composition and method for treating semiconductor substrate surface |
| US8889609B2 (en) | 2011-03-16 | 2014-11-18 | Air Products And Chemicals, Inc. | Cleaning formulations and method of using the cleaning formulations |
| US9536730B2 (en) * | 2012-10-23 | 2017-01-03 | Air Products And Chemicals, Inc. | Cleaning formulations |
| KR101459725B1 (ko) * | 2014-02-18 | 2014-11-12 | 주식회사 코원이노텍 | 포스트-에칭 포토레지스트 에칭 중합체 및 잔류물을 제거하기 위한 스트리퍼 조성물 |
| JP6501492B2 (ja) * | 2014-10-31 | 2019-04-17 | 関東化學株式会社 | フォトレジスト残渣および／またはポリマー残渣を除去するための組成物 |
| WO2016076034A1 (ja) * | 2014-11-13 | 2016-05-19 | 三菱瓦斯化学株式会社 | 半導体素子を洗浄するためのアルカリ土類金属を含む洗浄液、およびそれを用いた半導体素子の洗浄方法 |
| US10073351B2 (en) | 2014-12-23 | 2018-09-11 | Versum Materials Us, Llc | Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation |
| CN113214920A (zh) * | 2015-03-31 | 2021-08-06 | 弗萨姆材料美国有限责任公司 | 清洁制剂 |
| TWI790196B (zh) | 2015-12-11 | 2023-01-21 | 日商富士軟片股份有限公司 | 洗淨液、基板洗淨方法及半導體元件的製造方法 |
-
2020
- 2020-09-24 WO PCT/US2020/052406 patent/WO2021061922A1/en not_active Ceased
- 2020-09-24 JP JP2022519388A patent/JP7628116B2/ja active Active
- 2020-09-24 TW TW109133041A patent/TWI910116B/zh active
- 2020-09-24 EP EP20870060.9A patent/EP4034629A4/en active Pending
- 2020-09-24 US US17/753,256 patent/US12298669B2/en active Active
- 2020-09-24 KR KR1020227013937A patent/KR20220075230A/ko active Pending
- 2020-09-24 CN CN202080067656.9A patent/CN114450388B/zh active Active
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