JP2022548981A5 - - Google Patents
Info
- Publication number
- JP2022548981A5 JP2022548981A5 JP2022518258A JP2022518258A JP2022548981A5 JP 2022548981 A5 JP2022548981 A5 JP 2022548981A5 JP 2022518258 A JP2022518258 A JP 2022518258A JP 2022518258 A JP2022518258 A JP 2022518258A JP 2022548981 A5 JP2022548981 A5 JP 2022548981A5
- Authority
- JP
- Japan
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023143438A JP7715772B2 (ja) | 2019-09-26 | 2023-09-05 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
| JP2025061658A JP2025121899A (ja) | 2019-09-26 | 2025-04-03 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IN201941038863 | 2019-09-26 | ||
| IN201941038863 | 2019-09-26 | ||
| US16/890,336 | 2020-06-02 | ||
| US16/890,346 | 2020-06-02 | ||
| US16/890,336 US11540432B2 (en) | 2019-09-26 | 2020-06-02 | Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools |
| US16/890,346 US11547030B2 (en) | 2019-09-26 | 2020-06-02 | Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools |
| PCT/US2020/053036 WO2021062349A1 (en) | 2019-09-26 | 2020-09-28 | Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023143438A Division JP7715772B2 (ja) | 2019-09-26 | 2023-09-05 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
| JP2025061658A Division JP2025121899A (ja) | 2019-09-26 | 2025-04-03 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2022548981A JP2022548981A (ja) | 2022-11-22 |
| JP2022548981A5 true JP2022548981A5 (https=) | 2024-03-14 |
| JPWO2021062349A5 JPWO2021062349A5 (https=) | 2024-03-14 |
| JP7662619B2 JP7662619B2 (ja) | 2025-04-15 |
Family
ID=75162433
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022518258A Active JP7662619B2 (ja) | 2019-09-26 | 2020-09-28 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
| JP2023143438A Active JP7715772B2 (ja) | 2019-09-26 | 2023-09-05 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
| JP2025061658A Pending JP2025121899A (ja) | 2019-09-26 | 2025-04-03 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023143438A Active JP7715772B2 (ja) | 2019-09-26 | 2023-09-05 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
| JP2025061658A Pending JP2025121899A (ja) | 2019-09-26 | 2025-04-03 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US11540432B2 (https=) |
| JP (3) | JP7662619B2 (https=) |
| KR (2) | KR20250113524A (https=) |
| CN (2) | CN114424676B (https=) |
| TW (3) | TW202446985A (https=) |
| WO (1) | WO2021062349A1 (https=) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11540432B2 (en) | 2019-09-26 | 2022-12-27 | Applied Materials, Inc. | Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools |
| WO2022269429A1 (en) * | 2021-06-25 | 2022-12-29 | Advanced Potash Technologies, Ltd. | Multi-step methods of making a high temperature multi-phase material and related materials, compositions and methods of use |
| US12557595B2 (en) * | 2022-01-26 | 2026-02-17 | Applied Materials, Inc. | Methods for electrostatic chuck ceramic surfacing |
| TW202346240A (zh) * | 2022-02-26 | 2023-12-01 | 日商Ｔｏｔｏ股份有限公司 | 複合結構物及具備複合結構物之半導體製造裝置 |
| JP2023124886A (ja) * | 2022-02-26 | 2023-09-07 | Toto株式会社 | 複合構造物および複合構造物を備えた半導体製造装置 |
| JP2023124885A (ja) * | 2022-02-26 | 2023-09-07 | Toto株式会社 | 複合構造物および複合構造物を備えた半導体製造装置 |
| KR102705799B1 (ko) * | 2022-03-29 | 2024-09-12 | 세메스 주식회사 | 로봇 암 및 이를 포함하는 기판처리장치 |
| JP2025522592A (ja) * | 2022-06-28 | 2025-07-15 | インテグリス・インコーポレーテッド | 送達システムのためのモジュールおよび関連方法 |
| KR20250029243A (ko) * | 2022-07-05 | 2025-03-04 | 램 리써치 코포레이션 | 엔드 이펙터 |
| KR102652284B1 (ko) * | 2022-07-11 | 2024-03-28 | 한국생산기술연구원 | 기판 이송용 핸드 |
| US12588463B2 (en) * | 2023-04-21 | 2026-03-24 | STATS ChipPAC Pte. Ltd. | Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge |
| CN116891131A (zh) * | 2023-06-01 | 2023-10-17 | 张组 | 一种铺砖路面用地砖的终端转运设备 |
| JP2025047784A (ja) * | 2023-09-21 | 2025-04-03 | キヤノントッキ株式会社 | 成膜装置及び成膜方法 |
| JP2025047786A (ja) * | 2023-09-21 | 2025-04-03 | キヤノントッキ株式会社 | 成膜装置及び成膜方法 |
| JP2025047785A (ja) * | 2023-09-21 | 2025-04-03 | キヤノントッキ株式会社 | 成膜装置及び成膜方法 |
| WO2025079541A1 (ja) * | 2023-10-12 | 2025-04-17 | セントラル硝子株式会社 | 成膜方法、半導体デバイスの製造方法、及び成膜システム |
| US20250149373A1 (en) * | 2023-11-06 | 2025-05-08 | Applied Materials, Inc. | Soft touch coating materials for substrate handling |
| US20250226258A1 (en) * | 2024-01-10 | 2025-07-10 | Applied Materials, Inc. | Compact faceplate loading platform |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2031098A1 (en) * | 1990-01-16 | 1991-07-17 | William F. Banholzer | Cvd diamond coated annulus components and method of their fabrication |
| US5756222A (en) * | 1994-08-15 | 1998-05-26 | Applied Materials, Inc. | Corrosion-resistant aluminum article for semiconductor processing equipment |
| US5955858A (en) | 1997-02-14 | 1999-09-21 | Applied Materials, Inc. | Mechanically clamping robot wrist |
| US6641939B1 (en) | 1998-07-01 | 2003-11-04 | The Morgan Crucible Company Plc | Transition metal oxide doped alumina and methods of making and using |
| TW543079B (en) * | 1999-06-03 | 2003-07-21 | Applied Materials Inc | Robot blade for semiconductor processing equipment |
| US6290859B1 (en) * | 1999-11-12 | 2001-09-18 | Sandia Corporation | Tungsten coating for improved wear resistance and reliability of microelectromechanical devices |
| US6316734B1 (en) * | 2000-03-07 | 2001-11-13 | 3M Innovative Properties Company | Flexible circuits with static discharge protection and process for manufacture |
| JP2002292920A (ja) * | 2001-04-02 | 2002-10-09 | Matsushita Electric Ind Co Ltd | 電極構造体およびその製造方法ならびに電極構造体を用いる画像形成装置 |
| US20080213496A1 (en) | 2002-02-14 | 2008-09-04 | Applied Materials, Inc. | Method of coating semiconductor processing apparatus with protective yttrium-containing coatings |
| US20040183135A1 (en) * | 2003-03-19 | 2004-09-23 | Oh-Hun Kwon | ESD dissipative structural components |
| JP4895635B2 (ja) * | 2006-02-20 | 2012-03-14 | セイコーインスツル株式会社 | 搬送装置 |
| US9204525B2 (en) | 2006-07-07 | 2015-12-01 | Cocoon Inc. | Protective covers |
| KR101119075B1 (ko) * | 2007-03-12 | 2012-03-15 | 주식회사 코미코 | 웨이퍼 이송 장치 |
| KR100825418B1 (ko) | 2007-10-15 | 2008-04-29 | (주)쓰리나인 | 케이스 외관의 정전기 방지용 박막 및 그 제조방법 |
| FI20095947A0 (fi) * | 2009-09-14 | 2009-09-14 | Beneq Oy | Monikerrospinnoite, menetelmä monikerrospinnoitteen valmistamiseksi, ja sen käyttötapoja |
| WO2012088172A2 (en) | 2010-12-20 | 2012-06-28 | Entegris, Inc. | Front opening large substrate container |
| US9105379B2 (en) | 2011-01-21 | 2015-08-11 | Uchicago Argonne, Llc | Tunable resistance coatings |
| KR101387387B1 (ko) | 2011-12-21 | 2014-04-30 | (주)탑나노시스 | 대전방지용 시트 및 이를 포함하여 대전방지된 작업 스테이지 |
| US20150311043A1 (en) * | 2014-04-25 | 2015-10-29 | Applied Materials, Inc. | Chamber component with fluorinated thin film coating |
| US20150334812A1 (en) * | 2014-05-16 | 2015-11-19 | John Mazzocco | Design to manage charge and discharge of wafers and wafer carrier rings |
| TWI676227B (zh) * | 2015-01-23 | 2019-11-01 | 美商應用材料股份有限公司 | 半導體工藝設備 |
| US9881820B2 (en) | 2015-10-22 | 2018-01-30 | Lam Research Corporation | Front opening ring pod |
| US20170140902A1 (en) | 2015-11-16 | 2017-05-18 | Coorstek, Inc. | Corrosion-resistant components and methods of making |
| CN108292588B (zh) | 2015-12-04 | 2022-02-18 | 应用材料公司 | 用以防止hdp-cvd腔室电弧放电的先进涂层方法及材料 |
| US9850573B1 (en) * | 2016-06-23 | 2017-12-26 | Applied Materials, Inc. | Non-line of sight deposition of erbium based plasma resistant ceramic coating |
| US20180016678A1 (en) * | 2016-07-15 | 2018-01-18 | Applied Materials, Inc. | Multi-layer coating with diffusion barrier layer and erosion resistant layer |
| JP2018142597A (ja) * | 2017-02-27 | 2018-09-13 | 三菱ケミカル株式会社 | 太陽電池モジュール |
| JP7019529B2 (ja) * | 2018-07-30 | 2022-02-15 | 京セラ株式会社 | 試料搬送部材 |
| US11540432B2 (en) | 2019-09-26 | 2022-12-27 | Applied Materials, Inc. | Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools |
-
2020
- 2020-06-02 US US16/890,336 patent/US11540432B2/en active Active
- 2020-06-02 US US16/890,346 patent/US11547030B2/en active Active
- 2020-09-25 TW TW113127127A patent/TW202446985A/zh unknown
- 2020-09-25 TW TW109133277A patent/TWI853096B/zh active
- 2020-09-25 TW TW113127123A patent/TWI887047B/zh active
- 2020-09-28 JP JP2022518258A patent/JP7662619B2/ja active Active
- 2020-09-28 KR KR1020257023475A patent/KR20250113524A/ko active Pending
- 2020-09-28 KR KR1020227013686A patent/KR102836195B1/ko active Active
- 2020-09-28 CN CN202080066006.2A patent/CN114424676B/zh active Active
- 2020-09-28 WO PCT/US2020/053036 patent/WO2021062349A1/en not_active Ceased
- 2020-09-28 CN CN202511027140.2A patent/CN121023476A/zh active Pending
-
2022
- 2022-11-10 US US17/985,065 patent/US12004337B2/en active Active
-
2023
- 2023-09-05 JP JP2023143438A patent/JP7715772B2/ja active Active
-
2024
- 2024-04-26 US US18/648,278 patent/US12564012B2/en active Active
-
2025
- 2025-04-03 JP JP2025061658A patent/JP2025121899A/ja active Pending