JP2022548981A5 - - Google Patents

Info

Publication number
JP2022548981A5
JP2022548981A5 JP2022518258A JP2022518258A JP2022548981A5 JP 2022548981 A5 JP2022548981 A5 JP 2022548981A5 JP 2022518258 A JP2022518258 A JP 2022518258A JP 2022518258 A JP2022518258 A JP 2022518258A JP 2022548981 A5 JP2022548981 A5 JP 2022548981A5
Authority
JP
Japan
Prior art keywords
coating
range
materials
layer
chamber component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022518258A
Other languages
English (en)
Japanese (ja)
Other versions
JP7662619B2 (ja
JP2022548981A (ja
Filing date
Publication date
Priority claimed from US16/890,346 external-priority patent/US11547030B2/en
Application filed filed Critical
Publication of JP2022548981A publication Critical patent/JP2022548981A/ja
Priority to JP2023143438A priority Critical patent/JP7715772B2/ja
Publication of JP2022548981A5 publication Critical patent/JP2022548981A5/ja
Priority to JP2025061658A priority patent/JP2025121899A/ja
Application granted granted Critical
Publication of JP7662619B2 publication Critical patent/JP7662619B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022518258A 2019-09-26 2020-09-28 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング Active JP7662619B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023143438A JP7715772B2 (ja) 2019-09-26 2023-09-05 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング
JP2025061658A JP2025121899A (ja) 2019-09-26 2025-04-03 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
IN201941038863 2019-09-26
IN201941038863 2019-09-26
US16/890,336 2020-06-02
US16/890,346 US11547030B2 (en) 2019-09-26 2020-06-02 Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
US16/890,336 US11540432B2 (en) 2019-09-26 2020-06-02 Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
US16/890,346 2020-06-02
PCT/US2020/053036 WO2021062349A1 (en) 2019-09-26 2020-09-28 Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2023143438A Division JP7715772B2 (ja) 2019-09-26 2023-09-05 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング
JP2025061658A Division JP2025121899A (ja) 2019-09-26 2025-04-03 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング

Publications (3)

Publication Number Publication Date
JP2022548981A JP2022548981A (ja) 2022-11-22
JP2022548981A5 true JP2022548981A5 (https=) 2024-03-14
JP7662619B2 JP7662619B2 (ja) 2025-04-15

Family

ID=75162433

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022518258A Active JP7662619B2 (ja) 2019-09-26 2020-09-28 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング
JP2023143438A Active JP7715772B2 (ja) 2019-09-26 2023-09-05 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング
JP2025061658A Pending JP2025121899A (ja) 2019-09-26 2025-04-03 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023143438A Active JP7715772B2 (ja) 2019-09-26 2023-09-05 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング
JP2025061658A Pending JP2025121899A (ja) 2019-09-26 2025-04-03 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング

Country Status (6)

Country Link
US (4) US11540432B2 (https=)
JP (3) JP7662619B2 (https=)
KR (2) KR20250113524A (https=)
CN (2) CN114424676B (https=)
TW (3) TWI853096B (https=)
WO (1) WO2021062349A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11540432B2 (en) 2019-09-26 2022-12-27 Applied Materials, Inc. Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools
WO2022269429A1 (en) * 2021-06-25 2022-12-29 Advanced Potash Technologies, Ltd. Multi-step methods of making a high temperature multi-phase material and related materials, compositions and methods of use
US12557595B2 (en) * 2022-01-26 2026-02-17 Applied Materials, Inc. Methods for electrostatic chuck ceramic surfacing
JP2023124886A (ja) * 2022-02-26 2023-09-07 Toto株式会社 複合構造物および複合構造物を備えた半導体製造装置
JP2023124885A (ja) * 2022-02-26 2023-09-07 Toto株式会社 複合構造物および複合構造物を備えた半導体製造装置
TW202346240A (zh) * 2022-02-26 2023-12-01 日商Ｔｏｔｏ股份有限公司 複合結構物及具備複合結構物之半導體製造裝置
KR102705799B1 (ko) * 2022-03-29 2024-09-12 세메스 주식회사 로봇 암 및 이를 포함하는 기판처리장치
CN119547179A (zh) * 2022-06-28 2025-02-28 恩特格里斯公司 用于输送系统的模块及相关方法
CN119487626A (zh) * 2022-07-05 2025-02-18 朗姆研究公司 末端执行器
KR102652284B1 (ko) * 2022-07-11 2024-03-28 한국생산기술연구원 기판 이송용 핸드
US12588463B2 (en) * 2023-04-21 2026-03-24 STATS ChipPAC Pte. Ltd. Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge
CN116891131A (zh) * 2023-06-01 2023-10-17 张组 一种铺砖路面用地砖的终端转运设备
JP2025047785A (ja) * 2023-09-21 2025-04-03 キヤノントッキ株式会社 成膜装置及び成膜方法
JP2025047786A (ja) * 2023-09-21 2025-04-03 キヤノントッキ株式会社 成膜装置及び成膜方法
JP2025047784A (ja) * 2023-09-21 2025-04-03 キヤノントッキ株式会社 成膜装置及び成膜方法
WO2025079541A1 (ja) * 2023-10-12 2025-04-17 セントラル硝子株式会社 成膜方法、半導体デバイスの製造方法、及び成膜システム
US20250149373A1 (en) * 2023-11-06 2025-05-08 Applied Materials, Inc. Soft touch coating materials for substrate handling
US20250226258A1 (en) * 2024-01-10 2025-07-10 Applied Materials, Inc. Compact faceplate loading platform

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2031098A1 (en) * 1990-01-16 1991-07-17 William F. Banholzer Cvd diamond coated annulus components and method of their fabrication
US5756222A (en) * 1994-08-15 1998-05-26 Applied Materials, Inc. Corrosion-resistant aluminum article for semiconductor processing equipment
US5955858A (en) 1997-02-14 1999-09-21 Applied Materials, Inc. Mechanically clamping robot wrist
US6641939B1 (en) 1998-07-01 2003-11-04 The Morgan Crucible Company Plc Transition metal oxide doped alumina and methods of making and using
TW543079B (en) * 1999-06-03 2003-07-21 Applied Materials Inc Robot blade for semiconductor processing equipment
US6290859B1 (en) * 1999-11-12 2001-09-18 Sandia Corporation Tungsten coating for improved wear resistance and reliability of microelectromechanical devices
US6316734B1 (en) 2000-03-07 2001-11-13 3M Innovative Properties Company Flexible circuits with static discharge protection and process for manufacture
JP2002292920A (ja) * 2001-04-02 2002-10-09 Matsushita Electric Ind Co Ltd 電極構造体およびその製造方法ならびに電極構造体を用いる画像形成装置
US20080213496A1 (en) 2002-02-14 2008-09-04 Applied Materials, Inc. Method of coating semiconductor processing apparatus with protective yttrium-containing coatings
US20040183135A1 (en) * 2003-03-19 2004-09-23 Oh-Hun Kwon ESD dissipative structural components
JP4895635B2 (ja) * 2006-02-20 2012-03-14 セイコーインスツル株式会社 搬送装置
US9204525B2 (en) 2006-07-07 2015-12-01 Cocoon Inc. Protective covers
KR101119075B1 (ko) * 2007-03-12 2012-03-15 주식회사 코미코 웨이퍼 이송 장치
KR100825418B1 (ko) * 2007-10-15 2008-04-29 (주)쓰리나인 케이스 외관의 정전기 방지용 박막 및 그 제조방법
FI20095947A0 (fi) * 2009-09-14 2009-09-14 Beneq Oy Monikerrospinnoite, menetelmä monikerrospinnoitteen valmistamiseksi, ja sen käyttötapoja
WO2012088172A2 (en) 2010-12-20 2012-06-28 Entegris, Inc. Front opening large substrate container
US9105379B2 (en) 2011-01-21 2015-08-11 Uchicago Argonne, Llc Tunable resistance coatings
KR101387387B1 (ko) * 2011-12-21 2014-04-30 (주)탑나노시스 대전방지용 시트 및 이를 포함하여 대전방지된 작업 스테이지
US20150311043A1 (en) * 2014-04-25 2015-10-29 Applied Materials, Inc. Chamber component with fluorinated thin film coating
US20150334812A1 (en) * 2014-05-16 2015-11-19 John Mazzocco Design to manage charge and discharge of wafers and wafer carrier rings
TWI676227B (zh) * 2015-01-23 2019-11-01 美商應用材料股份有限公司 半導體工藝設備
US9881820B2 (en) 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
EP3377318A1 (en) * 2015-11-16 2018-09-26 Coorstek Inc. Corrosion-resistant components and methods of making
KR102678733B1 (ko) 2015-12-04 2024-06-26 어플라이드 머티어리얼스, 인코포레이티드 Hdp-cvd 챔버 아킹을 방지하기 위한 첨단 코팅 방법 및 재료들
US9850573B1 (en) * 2016-06-23 2017-12-26 Applied Materials, Inc. Non-line of sight deposition of erbium based plasma resistant ceramic coating
US20180016678A1 (en) * 2016-07-15 2018-01-18 Applied Materials, Inc. Multi-layer coating with diffusion barrier layer and erosion resistant layer
JP2018142597A (ja) * 2017-02-27 2018-09-13 三菱ケミカル株式会社 太陽電池モジュール
JP7019529B2 (ja) * 2018-07-30 2022-02-15 京セラ株式会社 試料搬送部材
US11540432B2 (en) 2019-09-26 2022-12-27 Applied Materials, Inc. Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools

Similar Documents

Publication Publication Date Title
JP2022548981A5 (https=)
KR102784023B1 (ko) 소수성 전구체들을 사용한 선택적 퇴적
TWI488990B (zh) 使用鋁烴化合物之金屬碳化物膜的原子層沈積
KR101379015B1 (ko) 플라즈마 원자층 증착법을 이용한 루테늄 막 증착 방법 및고밀도 루테늄 층
TWI556294B (zh) 金屬薄膜的矽烷或硼烷處理
JP2018095961A5 (https=)
KR102332870B1 (ko) TDMAT 또는 TDEAT 를 사용하여 PEALD 에 의해 Ti 함유 막을 형성하는 방법
US10875774B2 (en) Tritertbutyl aluminum reactants for vapor deposition
KR102948131B1 (ko) 프로세싱 챔버 부품들을 위한 보호 다층 코팅
US11817320B2 (en) CVD based oxide-metal multi structure for 3D NAND memory devices
JP2002541332A5 (https=)
JP7810533B2 (ja) 酸化シリコンの堆積方法
WO2009061666A1 (en) Atomic layer deposition process
JP2010199449A (ja) 抵抗素子の製造方法
US20230215763A1 (en) Systems and methods for cleaning and treating a surface of a substrate
KR20050002525A (ko) 반도체 소자의 확산방지막 제조방법
KR20040053456A (ko) 반도체 소자의 장벽 금속층 형성 방법
JP2004525257A (ja) ウエハ・バイアスを用いて低温アルファ・タンタル薄膜を得る方法
CN101091003B (zh) 钽氮化物膜的形成方法
KR100971413B1 (ko) 반도체 소자의 캐패시터 및 그 제조 방법
KR102117146B1 (ko) 변형된 원자층증착방식을 이용한 저저항 TiAlN 전극의 제조방법
US20250250674A1 (en) Reverse resistivity in topological semimetal grown by atomic layer deposition
KR101145726B1 (ko) 반도체 소자용 삼원계 비정질 이리듐 박막 및 이의 제조방법
JP2004282084A (ja) オクタンとともにテトラキス（メチルエチルアミノ）チタニウムを用いるＴｉベースバリアメタル薄膜のＭＯＣＶＤ法
KR20250122401A (ko) 비저항 역행성 ald 박막 및 이를 제조하는 방법