JP2022543116A5 - - Google Patents
Info
- Publication number
- JP2022543116A5 JP2022543116A5 JP2022506757A JP2022506757A JP2022543116A5 JP 2022543116 A5 JP2022543116 A5 JP 2022543116A5 JP 2022506757 A JP2022506757 A JP 2022506757A JP 2022506757 A JP2022506757 A JP 2022506757A JP 2022543116 A5 JP2022543116 A5 JP 2022543116A5
- Authority
- JP
- Japan
- Prior art keywords
- gate
- transistor
- conductive trace
- transistors
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962883865P | 2019-08-07 | 2019-08-07 | |
| US62/883,865 | 2019-08-07 | ||
| US16/848,366 | 2020-04-14 | ||
| US16/848,366 US11450671B2 (en) | 2019-08-07 | 2020-04-14 | Semiconductor apparatus having stacked devices and method of manufacture thereof |
| PCT/US2020/039379 WO2021025797A1 (en) | 2019-08-07 | 2020-06-24 | Semiconductor apparatus having stacked devices and method of manufacture thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022543116A JP2022543116A (ja) | 2022-10-07 |
| JP2022543116A5 true JP2022543116A5 (https=) | 2023-05-02 |
| JP7585593B2 JP7585593B2 (ja) | 2024-11-19 |
Family
ID=74498172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022506757A Active JP7585593B2 (ja) | 2019-08-07 | 2020-06-24 | 積み重ねられたデバイスを有する半導体装置及びその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11450671B2 (https=) |
| JP (1) | JP7585593B2 (https=) |
| KR (1) | KR102686114B1 (https=) |
| CN (1) | CN114175248A (https=) |
| TW (1) | TWI855124B (https=) |
| WO (1) | WO2021025797A1 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11469321B2 (en) * | 2020-02-27 | 2022-10-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device |
| US11550985B2 (en) | 2020-04-09 | 2023-01-10 | Tokyo Electron Limited | Method for automated standard cell design |
| US11714945B2 (en) | 2020-04-09 | 2023-08-01 | Tokyo Electron Limited | Method for automated standard cell design |
| US12183738B2 (en) * | 2021-01-29 | 2024-12-31 | Samsung Electronics Co., Ltd. | Cross-coupled gate design for stacked device with separated top-down gate |
| US11764154B2 (en) * | 2021-07-30 | 2023-09-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Power rail and signal line arrangement in integrated circuits having stacked transistors |
| US12588249B2 (en) * | 2021-08-13 | 2026-03-24 | Samsung Electronics Co., Ltd. | Integrated circuit devices including a cross-coupled structure |
| US11881393B2 (en) * | 2021-09-29 | 2024-01-23 | Advanced Micro Devices, Inc. | Cross field effect transistor library cell architecture design |
| US20250048690A1 (en) * | 2021-12-02 | 2025-02-06 | Imec Vzw | A complementary field-effect transistor device |
| US11894436B2 (en) * | 2021-12-06 | 2024-02-06 | International Business Machines Corporation | Gate-all-around monolithic stacked field effect transistors having multiple threshold voltages |
| US20230178544A1 (en) * | 2021-12-06 | 2023-06-08 | International Business Machines Corporation | Complementary field effect transistors having multiple voltage thresholds |
| US12218135B2 (en) | 2022-01-13 | 2025-02-04 | Tokyo Electron Limited | Wiring in diffusion breaks in an integrated circuit |
| US20230307457A1 (en) * | 2022-03-24 | 2023-09-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method of forming the same |
| US12563715B2 (en) | 2022-09-07 | 2026-02-24 | International Business Machines Corporation | Stacked random-access-memory with complementary adjacent cells |
| US12557260B2 (en) | 2022-10-05 | 2026-02-17 | International Business Machines Corporation | Stacked-FET SRAM cell with bottom pFET |
| JP2024062873A (ja) * | 2022-10-25 | 2024-05-10 | 株式会社アドバンテスト | 半導体装置および半導体装置の製造方法 |
| US12475942B2 (en) * | 2022-12-01 | 2025-11-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit structure with complementary field effect transistor and memory cell and method of making thereof |
| US12562211B2 (en) * | 2023-03-20 | 2026-02-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Power control circuit for memory circuit based on complementary field effect transistor devices |
| EP4576217A1 (en) * | 2023-12-22 | 2025-06-25 | IMEC vzw | Sram device |
| KR20260012944A (ko) * | 2024-07-19 | 2026-01-27 | 삼성전자주식회사 | 반도체 장치 및 그의 제조 방법 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0186720B1 (fr) * | 1984-12-28 | 1989-05-17 | International Business Machines Corporation | Réseau prédiffusé multifonction en technologie C. Mos |
| US5164612A (en) * | 1992-04-16 | 1992-11-17 | Kaplinsky Cecil H | Programmable CMOS flip-flop emptying multiplexers |
| EP0647030A3 (en) * | 1993-09-30 | 1995-11-08 | Texas Instruments Inc | Integrated circuit device. |
| US5528177A (en) * | 1994-09-16 | 1996-06-18 | Research Foundation Of State University Of New York | Complementary field-effect transistor logic circuits for wave pipelining |
| US7442634B2 (en) * | 2004-12-21 | 2008-10-28 | Intel Corporation | Method for constructing contact formations |
| KR100702011B1 (ko) * | 2005-03-16 | 2007-03-30 | 삼성전자주식회사 | 다중 게이트 트랜지스터들을 채택하는 씨모스 에스램 셀들및 그 제조방법들 |
| US8476689B2 (en) * | 2008-12-23 | 2013-07-02 | Augustine Wei-Chun Chang | Super CMOS devices on a microelectronics system |
| US8574982B2 (en) | 2010-02-25 | 2013-11-05 | International Business Machines Corporation | Implementing eDRAM stacked FET structure |
| JP5651415B2 (ja) * | 2010-09-21 | 2015-01-14 | 株式会社東芝 | 不揮発性半導体記憶装置及びその製造方法 |
| US8446176B1 (en) * | 2011-12-15 | 2013-05-21 | Freescale Semiconductor, Inc. | Reconfigurable engineering change order base cell |
| US8952431B2 (en) | 2013-05-09 | 2015-02-10 | International Business Machines Corporation | Stacked carbon-based FETs |
| GB2529582B (en) * | 2013-06-25 | 2019-10-23 | Intel Corp | Monolithic three-dimensional (3D) ICs with local inter-level interconnects |
| JP6305067B2 (ja) * | 2014-01-09 | 2018-04-04 | 株式会社東芝 | 半導体装置の製造方法 |
| WO2015155656A1 (en) * | 2014-04-11 | 2015-10-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
| KR102373263B1 (ko) * | 2014-05-30 | 2022-03-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 이를 제조하기 위한 방법 |
| US9831238B2 (en) * | 2014-05-30 | 2017-11-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including insulating film having opening portion and conductive film in the opening portion |
| HK1243822A1 (zh) * | 2014-10-10 | 2018-07-20 | Schottky Lsi, Inc. | 微电子系统中的超级cmos(scmostm)器件 |
| US10741587B2 (en) | 2016-03-11 | 2020-08-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, semiconductor wafer, module, electronic device, and manufacturing method the same |
| JP7019029B2 (ja) * | 2017-08-16 | 2022-02-14 | 東京エレクトロン株式会社 | Fetデバイスのナノチャネル構造にシングルディフュージョンブレークを組み込むための方法及びデバイス |
| US10833078B2 (en) | 2017-12-04 | 2020-11-10 | Tokyo Electron Limited | Semiconductor apparatus having stacked gates and method of manufacture thereof |
-
2020
- 2020-04-14 US US16/848,366 patent/US11450671B2/en active Active
- 2020-06-24 WO PCT/US2020/039379 patent/WO2021025797A1/en not_active Ceased
- 2020-06-24 CN CN202080054218.9A patent/CN114175248A/zh active Pending
- 2020-06-24 JP JP2022506757A patent/JP7585593B2/ja active Active
- 2020-06-24 KR KR1020227006909A patent/KR102686114B1/ko active Active
- 2020-08-04 TW TW109126302A patent/TWI855124B/zh active
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