JP2022541329A5 - - Google Patents
Info
- Publication number
- JP2022541329A5 JP2022541329A5 JP2022504702A JP2022504702A JP2022541329A5 JP 2022541329 A5 JP2022541329 A5 JP 2022541329A5 JP 2022504702 A JP2022504702 A JP 2022504702A JP 2022504702 A JP2022504702 A JP 2022504702A JP 2022541329 A5 JP2022541329 A5 JP 2022541329A5
- Authority
- JP
- Japan
- Prior art keywords
- connection region
- connection
- terminal
- substrate
- connection area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP19188325.5 | 2019-07-25 | ||
| EP19188325 | 2019-07-25 | ||
| PCT/EP2020/070879 WO2021013967A1 (en) | 2019-07-25 | 2020-07-23 | Power semiconductor module and method of forming the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022541329A JP2022541329A (ja) | 2022-09-22 |
| JP2022541329A5 true JP2022541329A5 (https=) | 2023-09-21 |
| JP7750825B2 JP7750825B2 (ja) | 2025-10-07 |
Family
ID=67438880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022504702A Active JP7750825B2 (ja) | 2019-07-25 | 2020-07-23 | パワー半導体モジュールおよびその形成方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20220246577A1 (https=) |
| EP (1) | EP4003632B1 (https=) |
| JP (1) | JP7750825B2 (https=) |
| CN (1) | CN114175223A (https=) |
| WO (1) | WO2021013967A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7643186B2 (ja) * | 2021-05-31 | 2025-03-11 | 富士電機株式会社 | 半導体モジュールおよび半導体モジュールの製造方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0982742A (ja) * | 1995-09-11 | 1997-03-28 | Fujitsu Ltd | ワイヤボンディング方法 |
| JP3625986B2 (ja) * | 1997-04-11 | 2005-03-02 | ローム株式会社 | 放熱板を具備する半導体装置、及び放熱板の超音波接合方法 |
| JP4222356B2 (ja) * | 1997-06-17 | 2009-02-12 | セイコーエプソン株式会社 | 電気光学装置用基板、電気光学装置、電子機器及び投射型表示装置 |
| US6979647B2 (en) * | 2003-09-02 | 2005-12-27 | Texas Instruments Incorporated | Method for chemical etch control of noble metals in the presence of less noble metals |
| TW200528550A (en) * | 2003-12-22 | 2005-09-01 | Uyemura C & Co Ltd | Polishing solution and method of polishing nonferrous metal materials |
| US20050139292A1 (en) * | 2003-12-31 | 2005-06-30 | Suresh Ramarajan | Method and apparatus for minimizing thickness-to-planarity and dishing in CMP |
| JP4709563B2 (ja) * | 2005-03-31 | 2011-06-22 | 株式会社東芝 | 半導体装置の製造方法 |
| KR20070088245A (ko) * | 2006-02-24 | 2007-08-29 | 후지필름 가부시키가이샤 | 금속용 연마액 |
| US20090315159A1 (en) * | 2008-06-20 | 2009-12-24 | Donald Charles Abbott | Leadframes having both enhanced-adhesion and smooth surfaces and methods to form the same |
| JP2011060927A (ja) | 2009-09-09 | 2011-03-24 | Hitachi Ltd | 半導体装置 |
| DE102009050257A1 (de) * | 2009-10-21 | 2011-05-12 | Mann + Hummel Gmbh | Filterelement, Filtereinrichtung und Verfahren zum Herstellen eines Filterelements |
| JP2012243943A (ja) | 2011-05-19 | 2012-12-10 | Tokai Rika Co Ltd | ワイヤボンディング構造及び電子装置とその製造方法 |
| JP2015146393A (ja) | 2014-02-03 | 2015-08-13 | カルソニックカンセイ株式会社 | 超音波ウェッジボンディング構造 |
| DE102014104496B4 (de) | 2014-03-31 | 2019-07-18 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung zur schweißtechnischen Verbindung von Anschlusselementen mit dem Substrat eines Leistungshalbleitermoduls und zugehöriges Verfahren |
| WO2016116177A1 (en) * | 2015-01-23 | 2016-07-28 | Abb Technology Ag | Method of generating a power semiconductor module |
| US10396057B2 (en) * | 2015-02-13 | 2019-08-27 | Nissan Arc, Ltd. | Half-bridge power semiconductor module and method for manufacturing same |
-
2020
- 2020-07-23 EP EP20744036.3A patent/EP4003632B1/en active Active
- 2020-07-23 JP JP2022504702A patent/JP7750825B2/ja active Active
- 2020-07-23 US US17/629,441 patent/US20220246577A1/en not_active Abandoned
- 2020-07-23 WO PCT/EP2020/070879 patent/WO2021013967A1/en not_active Ceased
- 2020-07-23 CN CN202080053829.1A patent/CN114175223A/zh active Pending
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