JP7750825B2 - パワー半導体モジュールおよびその形成方法 - Google Patents

パワー半導体モジュールおよびその形成方法

Info

Publication number
JP7750825B2
JP7750825B2 JP2022504702A JP2022504702A JP7750825B2 JP 7750825 B2 JP7750825 B2 JP 7750825B2 JP 2022504702 A JP2022504702 A JP 2022504702A JP 2022504702 A JP2022504702 A JP 2022504702A JP 7750825 B2 JP7750825 B2 JP 7750825B2
Authority
JP
Japan
Prior art keywords
connection region
terminal
power semiconductor
substrate
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022504702A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022541329A (ja
JP2022541329A5 (https=
Inventor
ギヨン，ダビド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Energy Ltd
Original Assignee
Hitachi Energy Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Energy Ltd filed Critical Hitachi Energy Ltd
Publication of JP2022541329A publication Critical patent/JP2022541329A/ja
Publication of JP2022541329A5 publication Critical patent/JP2022541329A5/ja
Application granted granted Critical
Publication of JP7750825B2 publication Critical patent/JP7750825B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07536—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP2022504702A 2019-07-25 2020-07-23 パワー半導体モジュールおよびその形成方法 Active JP7750825B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP19188325.5 2019-07-25
EP19188325 2019-07-25
PCT/EP2020/070879 WO2021013967A1 (en) 2019-07-25 2020-07-23 Power semiconductor module and method of forming the same

Publications (3)

Publication Number Publication Date
JP2022541329A JP2022541329A (ja) 2022-09-22
JP2022541329A5 JP2022541329A5 (https=) 2023-09-21
JP7750825B2 true JP7750825B2 (ja) 2025-10-07

Family

ID=67438880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022504702A Active JP7750825B2 (ja) 2019-07-25 2020-07-23 パワー半導体モジュールおよびその形成方法

Country Status (5)

Country Link
US (1) US20220246577A1 (https=)
EP (1) EP4003632B1 (https=)
JP (1) JP7750825B2 (https=)
CN (1) CN114175223A (https=)
WO (1) WO2021013967A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7643186B2 (ja) * 2021-05-31 2025-03-11 富士電機株式会社 半導体モジュールおよび半導体モジュールの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012243943A (ja) 2011-05-19 2012-12-10 Tokai Rika Co Ltd ワイヤボンディング構造及び電子装置とその製造方法
WO2016129097A1 (ja) 2015-02-13 2016-08-18 株式会社日産アーク ハーフブリッジパワー半導体モジュール及びその製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0982742A (ja) * 1995-09-11 1997-03-28 Fujitsu Ltd ワイヤボンディング方法
JP3625986B2 (ja) * 1997-04-11 2005-03-02 ローム株式会社 放熱板を具備する半導体装置、及び放熱板の超音波接合方法
JP4222356B2 (ja) * 1997-06-17 2009-02-12 セイコーエプソン株式会社 電気光学装置用基板、電気光学装置、電子機器及び投射型表示装置
US6979647B2 (en) * 2003-09-02 2005-12-27 Texas Instruments Incorporated Method for chemical etch control of noble metals in the presence of less noble metals
TW200528550A (en) * 2003-12-22 2005-09-01 Uyemura C & Co Ltd Polishing solution and method of polishing nonferrous metal materials
US20050139292A1 (en) * 2003-12-31 2005-06-30 Suresh Ramarajan Method and apparatus for minimizing thickness-to-planarity and dishing in CMP
JP4709563B2 (ja) * 2005-03-31 2011-06-22 株式会社東芝 半導体装置の製造方法
KR20070088245A (ko) * 2006-02-24 2007-08-29 후지필름 가부시키가이샤 금속용 연마액
US20090315159A1 (en) * 2008-06-20 2009-12-24 Donald Charles Abbott Leadframes having both enhanced-adhesion and smooth surfaces and methods to form the same
JP2011060927A (ja) 2009-09-09 2011-03-24 Hitachi Ltd 半導体装置
DE102009050257A1 (de) * 2009-10-21 2011-05-12 Mann + Hummel Gmbh Filterelement, Filtereinrichtung und Verfahren zum Herstellen eines Filterelements
JP2015146393A (ja) 2014-02-03 2015-08-13 カルソニックカンセイ株式会社 超音波ウェッジボンディング構造
DE102014104496B4 (de) 2014-03-31 2019-07-18 Semikron Elektronik Gmbh & Co. Kg Vorrichtung zur schweißtechnischen Verbindung von Anschlusselementen mit dem Substrat eines Leistungshalbleitermoduls und zugehöriges Verfahren
WO2016116177A1 (en) * 2015-01-23 2016-07-28 Abb Technology Ag Method of generating a power semiconductor module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012243943A (ja) 2011-05-19 2012-12-10 Tokai Rika Co Ltd ワイヤボンディング構造及び電子装置とその製造方法
WO2016129097A1 (ja) 2015-02-13 2016-08-18 株式会社日産アーク ハーフブリッジパワー半導体モジュール及びその製造方法

Also Published As

Publication number Publication date
EP4003632A1 (en) 2022-06-01
JP2022541329A (ja) 2022-09-22
EP4003632B1 (en) 2023-12-13
CN114175223A (zh) 2022-03-11
US20220246577A1 (en) 2022-08-04
WO2021013967A1 (en) 2021-01-28

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