JP2022511063A5 - - Google Patents

Info

Publication number
JP2022511063A5
JP2022511063A5 JP2021532010A JP2021532010A JP2022511063A5 JP 2022511063 A5 JP2022511063 A5 JP 2022511063A5 JP 2021532010 A JP2021532010 A JP 2021532010A JP 2021532010 A JP2021532010 A JP 2021532010A JP 2022511063 A5 JP2022511063 A5 JP 2022511063A5
Authority
JP
Japan
Prior art keywords
electrostatic chuck
dielectric
protrusions
openings
peripheral region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021532010A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022511063A (ja
Filing date
Publication date
Priority claimed from US16/213,816 external-priority patent/US11031273B2/en
Application filed filed Critical
Publication of JP2022511063A publication Critical patent/JP2022511063A/ja
Publication of JP2022511063A5 publication Critical patent/JP2022511063A5/ja
Priority to JP2025184352A priority Critical patent/JP2026020182A/ja
Pending legal-status Critical Current

Links

JP2021532010A 2018-12-07 2019-12-05 温度の影響を受けやすいプロセスのための改善された熱的結合を有する静電チャック Pending JP2022511063A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025184352A JP2026020182A (ja) 2018-12-07 2025-10-31 温度の影響を受けやすいプロセスのための改善された熱的結合を有する静電チャック

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/213,816 2018-12-07
US16/213,816 US11031273B2 (en) 2018-12-07 2018-12-07 Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes
PCT/US2019/064772 WO2020118104A1 (en) 2018-12-07 2019-12-05 Electrostatic chuck with improved thermal coupling for temperature sensitive processes

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025184352A Division JP2026020182A (ja) 2018-12-07 2025-10-31 温度の影響を受けやすいプロセスのための改善された熱的結合を有する静電チャック

Publications (2)

Publication Number Publication Date
JP2022511063A JP2022511063A (ja) 2022-01-28
JP2022511063A5 true JP2022511063A5 (https=) 2022-12-14

Family

ID=70971118

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021532010A Pending JP2022511063A (ja) 2018-12-07 2019-12-05 温度の影響を受けやすいプロセスのための改善された熱的結合を有する静電チャック
JP2025184352A Pending JP2026020182A (ja) 2018-12-07 2025-10-31 温度の影響を受けやすいプロセスのための改善された熱的結合を有する静電チャック

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025184352A Pending JP2026020182A (ja) 2018-12-07 2025-10-31 温度の影響を受けやすいプロセスのための改善された熱的結合を有する静電チャック

Country Status (6)

Country Link
US (1) US11031273B2 (https=)
JP (2) JP2022511063A (https=)
KR (1) KR102892468B1 (https=)
CN (1) CN113169111A (https=)
TW (1) TWI871296B (https=)
WO (1) WO2020118104A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11229968B2 (en) * 2011-11-30 2022-01-25 Watlow Electric Manufacturing Company Semiconductor substrate support with multiple electrodes and method for making same
WO2022174919A1 (en) * 2021-02-19 2022-08-25 Applied Materials, Inc. Substrate support, method of processing a substrate, and processing system
US20230011261A1 (en) * 2021-07-09 2023-01-12 Applied Materials, Inc. Multi-zone heater with minimum rf loss
KR102872170B1 (ko) * 2021-07-19 2025-10-15 삼성전자주식회사 반도체 장치의 제조용 장비 및 반도체 장치의 제조 방법
US20230073150A1 (en) * 2021-09-09 2023-03-09 Applied Materials, Inc. Heated lid for a process chamber
CN113903699B (zh) * 2021-09-22 2026-04-21 北京北方华创微电子装备有限公司 静电卡盘及半导体加工设备
CN118843930A (zh) * 2022-03-18 2024-10-25 朗姆研究公司 用于减少晶片背侧损伤的装置和方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5452510A (en) * 1993-12-20 1995-09-26 International Business Machines Corporation Method of making an electrostatic chuck with oxide insulator
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
DE19781631T1 (de) * 1997-01-02 1999-04-01 Cvc Products Inc Wärmeleitendes Spannfutter für Vakuumbearbeitungsvorrichtung
US6639783B1 (en) 1998-09-08 2003-10-28 Applied Materials, Inc. Multi-layer ceramic electrostatic chuck with integrated channel
JP3805134B2 (ja) 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
CN1207939C (zh) * 1999-09-29 2005-06-22 东京电子株式会社 多区电阻加热器
JP2001118915A (ja) 1999-10-15 2001-04-27 Applied Materials Inc 内蔵チャンネルを有する多層セラミック静電チャック
JP3881908B2 (ja) * 2002-02-26 2007-02-14 株式会社日立ハイテクノロジーズ プラズマ処理装置
KR100541447B1 (ko) * 2003-07-23 2006-01-11 삼성전자주식회사 웨이퍼용 정전척
JP2005136104A (ja) * 2003-10-29 2005-05-26 Ngk Spark Plug Co Ltd 静電チャック
JP4421874B2 (ja) 2003-10-31 2010-02-24 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
WO2006001425A1 (ja) 2004-06-28 2006-01-05 Kyocera Corporation 静電チャック
JP2006019534A (ja) * 2004-07-02 2006-01-19 Hitachi High-Technologies Corp プラズマ処理装置
US8512509B2 (en) * 2007-12-19 2013-08-20 Applied Materials, Inc. Plasma reactor gas distribution plate with radially distributed path splitting manifold
KR20090097229A (ko) * 2008-03-11 2009-09-16 전영재 반도체 및 ｌｃｄ 제조용 정전척
US9036326B2 (en) * 2008-04-30 2015-05-19 Axcelis Technologies, Inc. Gas bearing electrostatic chuck
WO2010019430A2 (en) 2008-08-12 2010-02-18 Applied Materials, Inc. Electrostatic chuck assembly
WO2013049586A1 (en) * 2011-09-30 2013-04-04 Applied Materials, Inc. Electrostatic chuck
JP5633766B2 (ja) * 2013-03-29 2014-12-03 Toto株式会社 静電チャック
JP6796066B2 (ja) * 2014-12-11 2020-12-02 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高温ｒｆ用途のための静電チャック

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