JP2022502845A5 - - Google Patents

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Publication number
JP2022502845A5
JP2022502845A5 JP2021516573A JP2021516573A JP2022502845A5 JP 2022502845 A5 JP2022502845 A5 JP 2022502845A5 JP 2021516573 A JP2021516573 A JP 2021516573A JP 2021516573 A JP2021516573 A JP 2021516573A JP 2022502845 A5 JP2022502845 A5 JP 2022502845A5
Authority
JP
Japan
Prior art keywords
faceplate
angle
processing chamber
approximately
gas distribution
Prior art date
Application number
JP2021516573A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020068299A5 (https=
JP2022502845A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2019/047189 external-priority patent/WO2020068299A1/en
Publication of JP2022502845A publication Critical patent/JP2022502845A/ja
Publication of JPWO2020068299A5 publication Critical patent/JPWO2020068299A5/ja
Publication of JP2022502845A5 publication Critical patent/JP2022502845A5/ja
Pending legal-status Critical Current

Links

JP2021516573A 2018-09-26 2019-08-20 ガス分配アセンブリおよびその動作 Pending JP2022502845A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862736882P 2018-09-26 2018-09-26
US62/736,882 2018-09-26
PCT/US2019/047189 WO2020068299A1 (en) 2018-09-26 2019-08-20 Gas distribution assemblies and operation thereof

Publications (3)

Publication Number Publication Date
JP2022502845A JP2022502845A (ja) 2022-01-11
JPWO2020068299A5 JPWO2020068299A5 (https=) 2022-08-31
JP2022502845A5 true JP2022502845A5 (https=) 2022-08-31

Family

ID=69883686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021516573A Pending JP2022502845A (ja) 2018-09-26 2019-08-20 ガス分配アセンブリおよびその動作

Country Status (7)

Country Link
US (1) US20200098547A1 (https=)
JP (1) JP2022502845A (https=)
KR (1) KR20210049946A (https=)
CN (1) CN112714948A (https=)
SG (1) SG11202101349SA (https=)
TW (1) TW202027194A (https=)
WO (1) WO2020068299A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7114763B1 (ja) 2021-02-15 2022-08-08 株式会社Kokusai Electric 半導体装置の製造方法、基板処理装置、プログラム、および基板処理方法
CN113130354A (zh) * 2021-04-09 2021-07-16 长鑫存储技术有限公司 半导体生产装置

Family Cites Families (26)

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JP3192370B2 (ja) * 1995-06-08 2001-07-23 東京エレクトロン株式会社 プラズマ処理装置
US6176930B1 (en) * 1999-03-04 2001-01-23 Applied Materials, Inc. Apparatus and method for controlling a flow of process material to a deposition chamber
JP3654142B2 (ja) * 2000-01-20 2005-06-02 住友電気工業株式会社 半導体製造装置用ガスシャワー体
US6553932B2 (en) * 2000-05-12 2003-04-29 Applied Materials, Inc. Reduction of plasma edge effect on plasma enhanced CVD processes
US6805952B2 (en) * 2000-12-29 2004-10-19 Lam Research Corporation Low contamination plasma chamber components and methods for making the same
US6827815B2 (en) * 2002-01-15 2004-12-07 Applied Materials, Inc. Showerhead assembly for a processing chamber
US20050230350A1 (en) * 2004-02-26 2005-10-20 Applied Materials, Inc. In-situ dry clean chamber for front end of line fabrication
US20050274396A1 (en) * 2004-06-09 2005-12-15 Hong Shih Methods for wet cleaning quartz surfaces of components for plasma processing chambers
JP5005268B2 (ja) * 2006-06-12 2012-08-22 株式会社日立ハイテクノロジーズ プラズマ処理装置
US20080072821A1 (en) * 2006-07-21 2008-03-27 Dalton Jeremic J Small volume symmetric flow single wafer ald apparatus
US8876024B2 (en) * 2008-01-10 2014-11-04 Applied Materials, Inc. Heated showerhead assembly
KR101004903B1 (ko) * 2008-07-04 2010-12-28 삼성엘이디 주식회사 화학 기상 증착 장치
CN101740298B (zh) * 2008-11-07 2012-07-25 东京毅力科创株式会社 等离子体处理装置及其构成部件
TW201204868A (en) * 2010-07-12 2012-02-01 Applied Materials Inc Compartmentalized chamber
US20120052216A1 (en) * 2010-08-27 2012-03-01 Applied Materials, Inc. Gas distribution showerhead with high emissivity surface
CN106884157B (zh) * 2011-03-04 2019-06-21 诺发系统公司 混合型陶瓷喷淋头
US20130102156A1 (en) * 2011-10-21 2013-04-25 Lam Research Corporation Components of plasma processing chambers having textured plasma resistant coatings
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WO2013182878A2 (en) * 2012-06-07 2013-12-12 Soitec Gas injection components for deposition systems, deposition systems including such components, and related methods
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JP6156850B2 (ja) * 2014-12-25 2017-07-05 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理装置の部材の交換判断方法
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JP2017135170A (ja) * 2016-01-25 2017-08-03 株式会社ニューフレアテクノロジー 気相成長装置及び気相成長方法
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