JPWO2020068299A5 - - Google Patents

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Publication number
JPWO2020068299A5
JPWO2020068299A5 JP2021516573A JP2021516573A JPWO2020068299A5 JP WO2020068299 A5 JPWO2020068299 A5 JP WO2020068299A5 JP 2021516573 A JP2021516573 A JP 2021516573A JP 2021516573 A JP2021516573 A JP 2021516573A JP WO2020068299 A5 JPWO2020068299 A5 JP WO2020068299A5
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JP
Japan
Prior art keywords
faceplate
processing chamber
angle
disposed
gas distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021516573A
Other languages
English (en)
Japanese (ja)
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JP2022502845A5 (https=
JP2022502845A (ja
Publication date
Application filed filed Critical
Priority claimed from PCT/US2019/047189 external-priority patent/WO2020068299A1/en
Publication of JP2022502845A publication Critical patent/JP2022502845A/ja
Publication of JPWO2020068299A5 publication Critical patent/JPWO2020068299A5/ja
Publication of JP2022502845A5 publication Critical patent/JP2022502845A5/ja
Pending legal-status Critical Current

Links

JP2021516573A 2018-09-26 2019-08-20 ガス分配アセンブリおよびその動作 Pending JP2022502845A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862736882P 2018-09-26 2018-09-26
US62/736,882 2018-09-26
PCT/US2019/047189 WO2020068299A1 (en) 2018-09-26 2019-08-20 Gas distribution assemblies and operation thereof

Publications (3)

Publication Number Publication Date
JP2022502845A JP2022502845A (ja) 2022-01-11
JPWO2020068299A5 true JPWO2020068299A5 (https=) 2022-08-31
JP2022502845A5 JP2022502845A5 (https=) 2022-08-31

Family

ID=69883686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021516573A Pending JP2022502845A (ja) 2018-09-26 2019-08-20 ガス分配アセンブリおよびその動作

Country Status (7)

Country Link
US (1) US20200098547A1 (https=)
JP (1) JP2022502845A (https=)
KR (1) KR20210049946A (https=)
CN (1) CN112714948A (https=)
SG (1) SG11202101349SA (https=)
TW (1) TW202027194A (https=)
WO (1) WO2020068299A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7114763B1 (ja) 2021-02-15 2022-08-08 株式会社Kokusai Electric 半導体装置の製造方法、基板処理装置、プログラム、および基板処理方法
CN113130354A (zh) * 2021-04-09 2021-07-16 长鑫存储技术有限公司 半导体生产装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
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JP3192370B2 (ja) * 1995-06-08 2001-07-23 東京エレクトロン株式会社 プラズマ処理装置
US6176930B1 (en) * 1999-03-04 2001-01-23 Applied Materials, Inc. Apparatus and method for controlling a flow of process material to a deposition chamber
JP3654142B2 (ja) * 2000-01-20 2005-06-02 住友電気工業株式会社 半導体製造装置用ガスシャワー体
US6553932B2 (en) * 2000-05-12 2003-04-29 Applied Materials, Inc. Reduction of plasma edge effect on plasma enhanced CVD processes
US6805952B2 (en) * 2000-12-29 2004-10-19 Lam Research Corporation Low contamination plasma chamber components and methods for making the same
US6827815B2 (en) * 2002-01-15 2004-12-07 Applied Materials, Inc. Showerhead assembly for a processing chamber
US20050230350A1 (en) * 2004-02-26 2005-10-20 Applied Materials, Inc. In-situ dry clean chamber for front end of line fabrication
US20050274396A1 (en) * 2004-06-09 2005-12-15 Hong Shih Methods for wet cleaning quartz surfaces of components for plasma processing chambers
JP5005268B2 (ja) * 2006-06-12 2012-08-22 株式会社日立ハイテクノロジーズ プラズマ処理装置
US20080072821A1 (en) * 2006-07-21 2008-03-27 Dalton Jeremic J Small volume symmetric flow single wafer ald apparatus
US8876024B2 (en) * 2008-01-10 2014-11-04 Applied Materials, Inc. Heated showerhead assembly
KR101004903B1 (ko) * 2008-07-04 2010-12-28 삼성엘이디 주식회사 화학 기상 증착 장치
CN101740298B (zh) * 2008-11-07 2012-07-25 东京毅力科创株式会社 等离子体处理装置及其构成部件
TW201204868A (en) * 2010-07-12 2012-02-01 Applied Materials Inc Compartmentalized chamber
US20120052216A1 (en) * 2010-08-27 2012-03-01 Applied Materials, Inc. Gas distribution showerhead with high emissivity surface
CN106884157B (zh) * 2011-03-04 2019-06-21 诺发系统公司 混合型陶瓷喷淋头
US20130102156A1 (en) * 2011-10-21 2013-04-25 Lam Research Corporation Components of plasma processing chambers having textured plasma resistant coatings
US9330939B2 (en) * 2012-03-28 2016-05-03 Applied Materials, Inc. Method of enabling seamless cobalt gap-fill
WO2013182878A2 (en) * 2012-06-07 2013-12-12 Soitec Gas injection components for deposition systems, deposition systems including such components, and related methods
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TWI600786B (zh) * 2013-05-01 2017-10-01 應用材料股份有限公司 用於腔室清潔或預清潔製程之鈷移除
CN204134770U (zh) * 2013-08-14 2015-02-04 应用材料公司 用于沉积聚合物材料的工艺腔室和该工艺腔室中用的喷头
JP6156850B2 (ja) * 2014-12-25 2017-07-05 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理装置の部材の交換判断方法
US20170178758A1 (en) * 2015-12-18 2017-06-22 Applied Materials, Inc. Uniform wafer temperature achievement in unsymmetric chamber environment
JP2017135170A (ja) * 2016-01-25 2017-08-03 株式会社ニューフレアテクノロジー 気相成長装置及び気相成長方法
KR102251209B1 (ko) * 2016-06-15 2021-05-11 어플라이드 머티어리얼스, 인코포레이티드 고 전력 플라즈마 에칭 프로세스들을 위한 가스 분배 플레이트 조립체

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