JPWO2023022041A5 - - Google Patents

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Publication number
JPWO2023022041A5
JPWO2023022041A5 JP2023542347A JP2023542347A JPWO2023022041A5 JP WO2023022041 A5 JPWO2023022041 A5 JP WO2023022041A5 JP 2023542347 A JP2023542347 A JP 2023542347A JP 2023542347 A JP2023542347 A JP 2023542347A JP WO2023022041 A5 JPWO2023022041 A5 JP WO2023022041A5
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JP
Japan
Prior art keywords
contact portion
substrate
hole
protrusions
substrate contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023542347A
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English (en)
Japanese (ja)
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JPWO2023022041A1 (https=
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Application filed filed Critical
Priority claimed from PCT/JP2022/030261 external-priority patent/WO2023022041A1/ja
Publication of JPWO2023022041A1 publication Critical patent/JPWO2023022041A1/ja
Publication of JPWO2023022041A5 publication Critical patent/JPWO2023022041A5/ja
Pending legal-status Critical Current

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JP2023542347A 2021-08-20 2022-08-08 Pending JPWO2023022041A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163235231P 2021-08-20 2021-08-20
JP2021148145 2021-09-10
PCT/JP2022/030261 WO2023022041A1 (ja) 2021-08-20 2022-08-08 静電チャック、基板支持器及び基板処理装置

Publications (2)

Publication Number Publication Date
JPWO2023022041A1 JPWO2023022041A1 (https=) 2023-02-23
JPWO2023022041A5 true JPWO2023022041A5 (https=) 2025-05-22

Family

ID=85240649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023542347A Pending JPWO2023022041A1 (https=) 2021-08-20 2022-08-08

Country Status (5)

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US (1) US20240186917A1 (https=)
JP (1) JPWO2023022041A1 (https=)
KR (1) KR20240051154A (https=)
TW (1) TW202316542A (https=)
WO (1) WO2023022041A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025004883A1 (ja) * 2023-06-29 2025-01-02 東京エレクトロン株式会社 プラズマ処理装置
KR20250142237A (ko) * 2024-03-21 2025-09-30 에이에스엠 아이피 홀딩 비.브이. 서셉터, 반도체 처리 시스템, 및 관련 방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3639686B2 (ja) * 1996-01-31 2005-04-20 キヤノン株式会社 基板の保持装置とこれを用いた露光装置、及びデバイスの製造方法
JP3983387B2 (ja) * 1998-09-29 2007-09-26 日本碍子株式会社 静電チャック
US6320736B1 (en) * 1999-05-17 2001-11-20 Applied Materials, Inc. Chuck having pressurized zones of heat transfer gas
KR100511854B1 (ko) * 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
JP4061131B2 (ja) * 2002-06-18 2008-03-12 キヤノンアネルバ株式会社 静電吸着装置
KR20040070008A (ko) * 2003-01-29 2004-08-06 쿄세라 코포레이션 정전척
JP4674792B2 (ja) * 2003-12-05 2011-04-20 東京エレクトロン株式会社 静電チャック
JP4636807B2 (ja) * 2004-03-18 2011-02-23 キヤノン株式会社 基板保持装置およびそれを用いた露光装置
JP4869610B2 (ja) * 2005-03-17 2012-02-08 東京エレクトロン株式会社 基板保持部材及び基板処理装置
KR102200053B1 (ko) * 2013-02-13 2021-01-08 엔테그리스, 아이엔씨. 중합체 양각을 갖는 진공 척
JP2013153171A (ja) * 2013-02-15 2013-08-08 Panasonic Corp プラズマ処理装置及びプラズマ処理方法
KR20160015510A (ko) * 2014-07-30 2016-02-15 삼성전자주식회사 정전척 어셈블리, 이를 구비하는 반도체 제조장치, 및 이를 이용한 플라즈마 처리방법
JP6948822B2 (ja) 2017-04-25 2021-10-13 東京エレクトロン株式会社 基板処理装置及び基板取り外し方法

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