JP2022506060A - 多結晶シリコンの製造方法 - Google Patents
多結晶シリコンの製造方法 Download PDFInfo
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- JP2022506060A JP2022506060A JP2021523215A JP2021523215A JP2022506060A JP 2022506060 A JP2022506060 A JP 2022506060A JP 2021523215 A JP2021523215 A JP 2021523215A JP 2021523215 A JP2021523215 A JP 2021523215A JP 2022506060 A JP2022506060 A JP 2022506060A
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- Prior art keywords
- reactor
- measuring device
- vibration
- deposition
- polycrystalline silicon
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 18
- 238000000151 deposition Methods 0.000 claims description 14
- 239000007789 gas Substances 0.000 claims description 14
- 229920005591 polysilicon Polymers 0.000 claims description 14
- 230000008021 deposition Effects 0.000 claims description 13
- 238000005229 chemical vapour deposition Methods 0.000 claims description 8
- 230000001902 propagating effect Effects 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 238000004886 process control Methods 0.000 claims description 4
- 239000012495 reaction gas Substances 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 238000001947 vapour-phase growth Methods 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 238000005259 measurement Methods 0.000 description 8
- 238000005137 deposition process Methods 0.000 description 6
- 238000001228 spectrum Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000005046 Chlorosilane Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical group Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 2
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000004857 zone melting Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/03—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition of silicon halides or halosilanes or reduction thereof with hydrogen as the only reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Silicon Compounds (AREA)
Abstract
Description
Claims (14)
- 多結晶シリコンを製造する方法であって、水素と、シランおよび/またはハロシランとを含む反応ガスを化学気相成長反応器の反応空間に導入することを含み、前記反応空間が、多結晶シリコンを形成するために化学気相成長法によって元素シリコンが堆積される少なくとも1つの加熱された支持体を備え、少なくとも1つの反応器構成要素の少なくとも1つの位置における反応空間の外側で、反応器の振動を測定装置を用いて測定し、任意に記録することを特徴とする、多結晶シリコンの製造方法。
- 前記振動が、前記反応器構成要素の構造伝搬音であることを特徴とする、請求項1に記載の方法。
- 前記振動が、空気伝搬音であることを特徴とする、請求項1に記載の方法。
- 前記測定装置が、少なくとも1つの加速度センサーおよび/または少なくとも1つのマイクロフォンを含むことを特徴とする、請求項1~3のいずれか一項に記載の方法。
- 前記反応器構成要素が、反応器シェル、底板、ガス供給またはガス除去用の導管、および電極ホルダーからなる群から選択されることを特徴とする、請求項1~4のいずれか一項に記載の方法。
- 前記測定装置が、記録システムを含むことを特徴とする、請求項1~5のいずれか一項に記載の方法。
- 前記測定装置が、プロセス制御ステーションに連結されていることを特徴とする、請求項1~6のいずれか一項に記載の方法。
- 振動を、堆積の完了まで、好ましくは反応器の開放まで、測定および記録することを特徴とする、請求項1~7のいずれか一項に記載の方法。
- 測定された振動の閾値を超えた場合、堆積を中断または終了することを特徴とする、請求項1~8のいずれか一項に記載の方法。
- 1つまたは複数の支持体の転倒の事例が、測定された振動の持続時間および強度によって決定されることを特徴とする、請求項1~9のいずれか一項に記載の方法。
- 多結晶シリコンの堆積用の反応器であって、反応器構成要素として、底板、底板上に配置された反応器シェル、ガス供給用の少なくとも1つの導管、ガス除去用の少なくとも1つの導管、および少なくとも1つの加熱可能な支持体用の電極ホルダーを含み、反応器の振動を決定するための少なくとも1つの測定装置が、反応器構成要素のうちの1つまたは複数に取り付けられていることを特徴とする、反応器。
- 前記測定装置が、加速度センサーおよび/またはマイクロフォンを含むことを特徴とする、請求項11に記載の反応器。
- 前記測定装置が、記録システムを含むことを特徴とする、請求項11または12に記載の反応器。
- 前記測定装置が、前記反応器を制御するためのプロセス制御ステーションに結合されていることを特徴とする、請求項11~13のいずれか一項に記載の反応器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/EP2018/085306 WO2020125932A1 (de) | 2018-12-17 | 2018-12-17 | Verfahren zur herstellung von polykristallinem silicium |
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JP2022506060A true JP2022506060A (ja) | 2022-01-17 |
JP7239692B2 JP7239692B2 (ja) | 2023-03-14 |
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JP2021523215A Active JP7239692B2 (ja) | 2018-12-17 | 2018-12-17 | 多結晶シリコンの製造方法 |
Country Status (6)
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---|---|
US (2) | US11655541B2 (ja) |
JP (1) | JP7239692B2 (ja) |
KR (1) | KR102553013B1 (ja) |
CN (1) | CN112105584A (ja) |
TW (1) | TWI736033B (ja) |
WO (1) | WO2020125932A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006008423A (ja) * | 2004-06-22 | 2006-01-12 | Tokuyama Corp | シリコンの製造方法およびシリコン製造装置 |
JP2010254539A (ja) * | 2009-04-28 | 2010-11-11 | Mitsubishi Materials Corp | 多結晶シリコン製造装置 |
JP2011037699A (ja) * | 2009-07-15 | 2011-02-24 | Mitsubishi Materials Corp | 多結晶シリコンの製造方法、製造装置及び多結晶シリコン |
JP2012224533A (ja) * | 2011-04-20 | 2012-11-15 | Siliconvalue Llc | 多結晶シリコン製造装置、及びこれを用いた多結晶シリコンの製造方法 |
JP2015048295A (ja) * | 2013-09-04 | 2015-03-16 | Jnc株式会社 | 多結晶シリコンの掻き取り装置および掻き取り方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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IL117770A0 (en) * | 1996-04-02 | 1996-08-04 | Levtec Ltd | Method and apparatus for growing of extended crystals |
TW558789B (en) * | 2002-05-02 | 2003-10-21 | Hitachi High Tech Corp | Semiconductor processing device and diagnostic method of semiconductor processing device |
US7922814B2 (en) * | 2005-11-29 | 2011-04-12 | Chisso Corporation | Production process for high purity polycrystal silicon and production apparatus for the same |
JP5509578B2 (ja) | 2007-11-28 | 2014-06-04 | 三菱マテリアル株式会社 | 多結晶シリコン製造装置及び製造方法 |
JP5238762B2 (ja) * | 2010-07-06 | 2013-07-17 | 信越化学工業株式会社 | 多結晶シリコン棒および多結晶シリコン棒の製造方法 |
DE102010040093A1 (de) * | 2010-09-01 | 2012-03-01 | Wacker Chemie Ag | Verfahren zur Herstellung von polykristallinem Silicium |
DE102010042869A1 (de) | 2010-10-25 | 2012-04-26 | Wacker Chemie Ag | Verfahren zur Herstellung von polykristallinen Siliciumstäben |
US20130129570A1 (en) * | 2011-04-20 | 2013-05-23 | Siliconvalue Llc. | Polycrystal silicon manufacturing apparatus |
DE102011078727A1 (de) * | 2011-07-06 | 2013-01-10 | Wacker Chemie Ag | Schutzvorrichtung für Elektrodenhalterungen in CVD Reaktoren |
CN104583122B (zh) | 2012-08-29 | 2017-09-05 | 赫姆洛克半导体运营有限责任公司 | 锥形流化床反应器及其使用方法 |
DE102013200660A1 (de) * | 2013-01-17 | 2014-07-17 | Wacker Chemie Ag | Verfahren zur Abscheidung von polykristallinem Silicium |
DE102013215093A1 (de) | 2013-08-01 | 2015-02-05 | Wacker Chemie Ag | Trägerkörper für die Abscheidung von polykristallinem Silicium |
DE102013219070A1 (de) * | 2013-09-23 | 2015-03-26 | Wacker Chemie Ag | Verfahren zur Herstellung von polykristallinem Silicium |
-
2018
- 2018-12-17 CN CN201880093378.7A patent/CN112105584A/zh active Pending
- 2018-12-17 US US17/294,772 patent/US11655541B2/en active Active
- 2018-12-17 KR KR1020217016807A patent/KR102553013B1/ko active IP Right Grant
- 2018-12-17 WO PCT/EP2018/085306 patent/WO2020125932A1/de active Application Filing
- 2018-12-17 JP JP2021523215A patent/JP7239692B2/ja active Active
-
2019
- 2019-11-26 TW TW108142837A patent/TWI736033B/zh active
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2023
- 2023-03-14 US US18/183,495 patent/US20230220554A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006008423A (ja) * | 2004-06-22 | 2006-01-12 | Tokuyama Corp | シリコンの製造方法およびシリコン製造装置 |
JP2010254539A (ja) * | 2009-04-28 | 2010-11-11 | Mitsubishi Materials Corp | 多結晶シリコン製造装置 |
JP2011037699A (ja) * | 2009-07-15 | 2011-02-24 | Mitsubishi Materials Corp | 多結晶シリコンの製造方法、製造装置及び多結晶シリコン |
JP2012224533A (ja) * | 2011-04-20 | 2012-11-15 | Siliconvalue Llc | 多結晶シリコン製造装置、及びこれを用いた多結晶シリコンの製造方法 |
JP2015048295A (ja) * | 2013-09-04 | 2015-03-16 | Jnc株式会社 | 多結晶シリコンの掻き取り装置および掻き取り方法 |
Also Published As
Publication number | Publication date |
---|---|
US20220010434A1 (en) | 2022-01-13 |
KR102553013B1 (ko) | 2023-07-06 |
JP7239692B2 (ja) | 2023-03-14 |
WO2020125932A1 (de) | 2020-06-25 |
TWI736033B (zh) | 2021-08-11 |
TW202024405A (zh) | 2020-07-01 |
US20230220554A1 (en) | 2023-07-13 |
US11655541B2 (en) | 2023-05-23 |
CN112105584A (zh) | 2020-12-18 |
KR20210087974A (ko) | 2021-07-13 |
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