JP2022181814A5 - - Google Patents

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Publication number
JP2022181814A5
JP2022181814A5 JP2021088985A JP2021088985A JP2022181814A5 JP 2022181814 A5 JP2022181814 A5 JP 2022181814A5 JP 2021088985 A JP2021088985 A JP 2021088985A JP 2021088985 A JP2021088985 A JP 2021088985A JP 2022181814 A5 JP2022181814 A5 JP 2022181814A5
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JP
Japan
Prior art keywords
main electrode
layer
wiring member
sintered
electrode
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Application number
JP2021088985A
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English (en)
Japanese (ja)
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JP2022181814A (ja
JP7512953B2 (ja
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Priority to JP2021088985A priority Critical patent/JP7512953B2/ja
Priority claimed from JP2021088985A external-priority patent/JP7512953B2/ja
Priority to PCT/JP2022/018365 priority patent/WO2022249805A1/ja
Publication of JP2022181814A publication Critical patent/JP2022181814A/ja
Publication of JP2022181814A5 publication Critical patent/JP2022181814A5/ja
Application granted granted Critical
Publication of JP7512953B2 publication Critical patent/JP7512953B2/ja
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JP2021088985A 2021-05-27 2021-05-27 半導体装置 Active JP7512953B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021088985A JP7512953B2 (ja) 2021-05-27 2021-05-27 半導体装置
PCT/JP2022/018365 WO2022249805A1 (ja) 2021-05-27 2022-04-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021088985A JP7512953B2 (ja) 2021-05-27 2021-05-27 半導体装置

Publications (3)

Publication Number Publication Date
JP2022181814A JP2022181814A (ja) 2022-12-08
JP2022181814A5 true JP2022181814A5 (https=) 2023-03-09
JP7512953B2 JP7512953B2 (ja) 2024-07-09

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ID=84228779

Family Applications (1)

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JP2021088985A Active JP7512953B2 (ja) 2021-05-27 2021-05-27 半導体装置

Country Status (2)

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JP (1) JP7512953B2 (https=)
WO (1) WO2022249805A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009164208A (ja) 2007-12-28 2009-07-23 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
JP6384894B2 (ja) 2013-11-11 2018-09-05 新日鐵住金株式会社 金属ナノ粒子を用いた金属接合構造及び金属接合方法並びに金属接合材料
JP2015177182A (ja) 2014-03-18 2015-10-05 三菱電機株式会社 パワーモジュール
JP6430007B2 (ja) 2015-07-01 2018-11-28 三菱電機株式会社 半導体装置および半導体装置の製造方法
WO2017077728A1 (ja) 2015-11-05 2017-05-11 三菱電機株式会社 パワーモジュール及びパワーモジュールの製造方法
JP2018026417A (ja) 2016-08-09 2018-02-15 三菱電機株式会社 電力用半導体装置
JP7130445B2 (ja) 2018-06-05 2022-09-05 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP2020191367A (ja) 2019-05-21 2020-11-26 株式会社デンソー 半導体装置
CN113169083B (zh) 2019-06-20 2024-12-31 富士电机株式会社 半导体装置以及半导体装置的制造方法
JP7495225B2 (ja) 2019-12-16 2024-06-04 株式会社デンソー 半導体装置

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