JPWO2024135312A5 - - Google Patents

Info

Publication number
JPWO2024135312A5
JPWO2024135312A5 JP2024565747A JP2024565747A JPWO2024135312A5 JP WO2024135312 A5 JPWO2024135312 A5 JP WO2024135312A5 JP 2024565747 A JP2024565747 A JP 2024565747A JP 2024565747 A JP2024565747 A JP 2024565747A JP WO2024135312 A5 JPWO2024135312 A5 JP WO2024135312A5
Authority
JP
Japan
Prior art keywords
laminated substrate
substrate according
recess
inner frame
bonding surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024565747A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024135312A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/043238 external-priority patent/WO2024135312A1/ja
Publication of JPWO2024135312A1 publication Critical patent/JPWO2024135312A1/ja
Publication of JPWO2024135312A5 publication Critical patent/JPWO2024135312A5/ja
Pending legal-status Critical Current

Links

JP2024565747A 2022-12-22 2023-12-04 Pending JPWO2024135312A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022206054 2022-12-22
PCT/JP2023/043238 WO2024135312A1 (ja) 2022-12-22 2023-12-04 積層基板、連結基板および半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024135312A1 JPWO2024135312A1 (https=) 2024-06-27
JPWO2024135312A5 true JPWO2024135312A5 (https=) 2025-08-28

Family

ID=91588286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024565747A Pending JPWO2024135312A1 (https=) 2022-12-22 2023-12-04

Country Status (3)

Country Link
JP (1) JPWO2024135312A1 (https=)
CN (1) CN120380593A (https=)
WO (1) WO2024135312A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025116003A1 (ja) * 2023-11-30 2025-06-05 京セラ株式会社 配線基板および半導体デバイス

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016042819A1 (ja) * 2014-09-19 2016-03-24 京セラ株式会社 電子素子実装用基板および電子装置
JP6483854B2 (ja) * 2016-05-20 2019-03-13 京セラ株式会社 電子素子実装用基板および電子装置
JP7019021B2 (ja) * 2018-02-27 2022-02-14 京セラ株式会社 半導体パッケージ、半導体装置および半導体パッケージの製造方法
JP7242870B2 (ja) * 2019-08-29 2023-03-20 京セラ株式会社 実装基板および電子装置

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