JPWO2024135312A1 - - Google Patents
Info
- Publication number
- JPWO2024135312A1 JPWO2024135312A1 JP2024565747A JP2024565747A JPWO2024135312A1 JP WO2024135312 A1 JPWO2024135312 A1 JP WO2024135312A1 JP 2024565747 A JP2024565747 A JP 2024565747A JP 2024565747 A JP2024565747 A JP 2024565747A JP WO2024135312 A1 JPWO2024135312 A1 JP WO2024135312A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022206054 | 2022-12-22 | ||
| PCT/JP2023/043238 WO2024135312A1 (ja) | 2022-12-22 | 2023-12-04 | 積層基板、連結基板および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024135312A1 true JPWO2024135312A1 (https=) | 2024-06-27 |
| JPWO2024135312A5 JPWO2024135312A5 (https=) | 2025-08-28 |
Family
ID=91588286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024565747A Pending JPWO2024135312A1 (https=) | 2022-12-22 | 2023-12-04 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024135312A1 (https=) |
| CN (1) | CN120380593A (https=) |
| WO (1) | WO2024135312A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025116003A1 (ja) * | 2023-11-30 | 2025-06-05 | 京セラ株式会社 | 配線基板および半導体デバイス |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016042819A1 (ja) * | 2014-09-19 | 2016-03-24 | 京セラ株式会社 | 電子素子実装用基板および電子装置 |
| WO2017200011A1 (ja) * | 2016-05-20 | 2017-11-23 | 京セラ株式会社 | 電子素子実装用基板および電子装置 |
| WO2019168056A1 (ja) * | 2018-02-27 | 2019-09-06 | 京セラ株式会社 | 半導体パッケージ、半導体装置および半導体パッケージの製造方法 |
| WO2021039963A1 (ja) * | 2019-08-29 | 2021-03-04 | 京セラ株式会社 | 実装基板および電子装置 |
-
2023
- 2023-12-04 WO PCT/JP2023/043238 patent/WO2024135312A1/ja not_active Ceased
- 2023-12-04 JP JP2024565747A patent/JPWO2024135312A1/ja active Pending
- 2023-12-04 CN CN202380086751.7A patent/CN120380593A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016042819A1 (ja) * | 2014-09-19 | 2016-03-24 | 京セラ株式会社 | 電子素子実装用基板および電子装置 |
| WO2017200011A1 (ja) * | 2016-05-20 | 2017-11-23 | 京セラ株式会社 | 電子素子実装用基板および電子装置 |
| WO2019168056A1 (ja) * | 2018-02-27 | 2019-09-06 | 京セラ株式会社 | 半導体パッケージ、半導体装置および半導体パッケージの製造方法 |
| WO2021039963A1 (ja) * | 2019-08-29 | 2021-03-04 | 京セラ株式会社 | 実装基板および電子装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN120380593A (zh) | 2025-07-25 |
| WO2024135312A1 (ja) | 2024-06-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
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| A131 | Notification of reasons for refusal |
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| A521 | Request for written amendment filed |
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