CN120380593A - 层叠基板、连接基板以及半导体装置 - Google Patents

层叠基板、连接基板以及半导体装置

Info

Publication number
CN120380593A
CN120380593A CN202380086751.7A CN202380086751A CN120380593A CN 120380593 A CN120380593 A CN 120380593A CN 202380086751 A CN202380086751 A CN 202380086751A CN 120380593 A CN120380593 A CN 120380593A
Authority
CN
China
Prior art keywords
laminated substrate
substrate according
laminated
substrate
carbon particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380086751.7A
Other languages
English (en)
Chinese (zh)
Inventor
光冈正史
山元泉太郎
松本有平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN120380593A publication Critical patent/CN120380593A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Solid State Image Pick-Up Elements (AREA)
CN202380086751.7A 2022-12-22 2023-12-04 层叠基板、连接基板以及半导体装置 Pending CN120380593A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022206054 2022-12-22
JP2022-206054 2022-12-22
PCT/JP2023/043238 WO2024135312A1 (ja) 2022-12-22 2023-12-04 積層基板、連結基板および半導体装置

Publications (1)

Publication Number Publication Date
CN120380593A true CN120380593A (zh) 2025-07-25

Family

ID=91588286

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380086751.7A Pending CN120380593A (zh) 2022-12-22 2023-12-04 层叠基板、连接基板以及半导体装置

Country Status (3)

Country Link
JP (1) JPWO2024135312A1 (https=)
CN (1) CN120380593A (https=)
WO (1) WO2024135312A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025116003A1 (ja) * 2023-11-30 2025-06-05 京セラ株式会社 配線基板および半導体デバイス

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016042819A1 (ja) * 2014-09-19 2016-03-24 京セラ株式会社 電子素子実装用基板および電子装置
JP6483854B2 (ja) * 2016-05-20 2019-03-13 京セラ株式会社 電子素子実装用基板および電子装置
JP7019021B2 (ja) * 2018-02-27 2022-02-14 京セラ株式会社 半導体パッケージ、半導体装置および半導体パッケージの製造方法
JP7242870B2 (ja) * 2019-08-29 2023-03-20 京セラ株式会社 実装基板および電子装置

Also Published As

Publication number Publication date
JPWO2024135312A1 (https=) 2024-06-27
WO2024135312A1 (ja) 2024-06-27

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