JP7512953B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7512953B2
JP7512953B2 JP2021088985A JP2021088985A JP7512953B2 JP 7512953 B2 JP7512953 B2 JP 7512953B2 JP 2021088985 A JP2021088985 A JP 2021088985A JP 2021088985 A JP2021088985 A JP 2021088985A JP 7512953 B2 JP7512953 B2 JP 7512953B2
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JP
Japan
Prior art keywords
wiring
substrate
semiconductor element
metal body
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021088985A
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English (en)
Japanese (ja)
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JP2022181814A5 (https=
JP2022181814A (ja
Inventor
悠嗣 小嶌
知巳 奥村
善次 坂本
敬 佐藤
良 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2021088985A priority Critical patent/JP7512953B2/ja
Priority to PCT/JP2022/018365 priority patent/WO2022249805A1/ja
Publication of JP2022181814A publication Critical patent/JP2022181814A/ja
Publication of JP2022181814A5 publication Critical patent/JP2022181814A5/ja
Application granted granted Critical
Publication of JP7512953B2 publication Critical patent/JP7512953B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

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  • Inverter Devices (AREA)
JP2021088985A 2021-05-27 2021-05-27 半導体装置 Active JP7512953B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021088985A JP7512953B2 (ja) 2021-05-27 2021-05-27 半導体装置
PCT/JP2022/018365 WO2022249805A1 (ja) 2021-05-27 2022-04-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021088985A JP7512953B2 (ja) 2021-05-27 2021-05-27 半導体装置

Publications (3)

Publication Number Publication Date
JP2022181814A JP2022181814A (ja) 2022-12-08
JP2022181814A5 JP2022181814A5 (https=) 2023-03-09
JP7512953B2 true JP7512953B2 (ja) 2024-07-09

Family

ID=84228779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021088985A Active JP7512953B2 (ja) 2021-05-27 2021-05-27 半導体装置

Country Status (2)

Country Link
JP (1) JP7512953B2 (https=)
WO (1) WO2022249805A1 (https=)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009164208A (ja) 2007-12-28 2009-07-23 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
JP2015093295A (ja) 2013-11-11 2015-05-18 新日鐵住金株式会社 金属ナノ粒子を用いた金属接合構造及び金属接合方法並びに金属接合材料
JP2015177182A (ja) 2014-03-18 2015-10-05 三菱電機株式会社 パワーモジュール
WO2017002793A1 (ja) 2015-07-01 2017-01-05 三菱電機株式会社 半導体装置および半導体装置の製造方法
WO2017077728A1 (ja) 2015-11-05 2017-05-11 三菱電機株式会社 パワーモジュール及びパワーモジュールの製造方法
JP2018026417A (ja) 2016-08-09 2018-02-15 三菱電機株式会社 電力用半導体装置
JP2019212759A (ja) 2018-06-05 2019-12-12 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP2020191367A (ja) 2019-05-21 2020-11-26 株式会社デンソー 半導体装置
WO2020255773A1 (ja) 2019-06-20 2020-12-24 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2021097113A (ja) 2019-12-16 2021-06-24 株式会社デンソー 半導体装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009164208A (ja) 2007-12-28 2009-07-23 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
JP2015093295A (ja) 2013-11-11 2015-05-18 新日鐵住金株式会社 金属ナノ粒子を用いた金属接合構造及び金属接合方法並びに金属接合材料
JP2015177182A (ja) 2014-03-18 2015-10-05 三菱電機株式会社 パワーモジュール
WO2017002793A1 (ja) 2015-07-01 2017-01-05 三菱電機株式会社 半導体装置および半導体装置の製造方法
WO2017077728A1 (ja) 2015-11-05 2017-05-11 三菱電機株式会社 パワーモジュール及びパワーモジュールの製造方法
JP2018026417A (ja) 2016-08-09 2018-02-15 三菱電機株式会社 電力用半導体装置
JP2019212759A (ja) 2018-06-05 2019-12-12 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP2020191367A (ja) 2019-05-21 2020-11-26 株式会社デンソー 半導体装置
WO2020255773A1 (ja) 2019-06-20 2020-12-24 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2021097113A (ja) 2019-12-16 2021-06-24 株式会社デンソー 半導体装置

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JP2022181814A (ja) 2022-12-08
WO2022249805A1 (ja) 2022-12-01

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