JP2022138607A5 - - Google Patents

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JP2022138607A5
JP2022138607A5 JP2021038579A JP2021038579A JP2022138607A5 JP 2022138607 A5 JP2022138607 A5 JP 2022138607A5 JP 2021038579 A JP2021038579 A JP 2021038579A JP 2021038579 A JP2021038579 A JP 2021038579A JP 2022138607 A5 JP2022138607 A5 JP 2022138607A5
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Japan
Prior art keywords
conductive layers
storage
type diffusion
resistance element
circuit
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JP2021038579A
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English (en)
Japanese (ja)
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JP2022138607A (ja
JP7623857B2 (ja
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Priority to JP2021038579A priority Critical patent/JP7623857B2/ja
Priority claimed from JP2021038579A external-priority patent/JP7623857B2/ja
Priority to US17/685,479 priority patent/US11837301B2/en
Priority to CN202210213985.0A priority patent/CN115084146A/zh
Publication of JP2022138607A publication Critical patent/JP2022138607A/ja
Publication of JP2022138607A5 publication Critical patent/JP2022138607A5/ja
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JP2021038579A 2021-03-10 2021-03-10 基板、記録装置及び製造方法 Active JP7623857B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021038579A JP7623857B2 (ja) 2021-03-10 2021-03-10 基板、記録装置及び製造方法
US17/685,479 US11837301B2 (en) 2021-03-10 2022-03-03 Substrate, printing apparatus, and manufacturing method
CN202210213985.0A CN115084146A (zh) 2021-03-10 2022-03-07 基板、打印装置和制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021038579A JP7623857B2 (ja) 2021-03-10 2021-03-10 基板、記録装置及び製造方法

Publications (3)

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JP2022138607A JP2022138607A (ja) 2022-09-26
JP2022138607A5 true JP2022138607A5 (https=) 2024-02-26
JP7623857B2 JP7623857B2 (ja) 2025-01-29

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JP2021038579A Active JP7623857B2 (ja) 2021-03-10 2021-03-10 基板、記録装置及び製造方法

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US (1) US11837301B2 (https=)
JP (1) JP7623857B2 (https=)
CN (1) CN115084146A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7781010B2 (ja) * 2022-03-30 2025-12-05 キヤノン株式会社 記憶装置、液体吐出ヘッドおよび液体吐出装置
JP7799655B2 (ja) 2023-06-02 2026-01-15 キヤノン株式会社 半導体装置及びインクジェット記録素子基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3529635B2 (ja) * 1998-08-06 2004-05-24 日本電信電話株式会社 自己破壊型半導体装置
JP4946260B2 (ja) 2006-08-16 2012-06-06 富士通セミコンダクター株式会社 アンチヒューズ書込電圧発生回路を内蔵する半導体メモリ装置
JP5791294B2 (ja) 2011-02-11 2015-10-07 キヤノン株式会社 静電容量型電気機械変換装置
JP2013251804A (ja) 2012-06-01 2013-12-12 Canon Inc 測定装置の駆動装置、及び駆動方法
FR3025927B1 (fr) * 2014-09-12 2018-01-12 St Microelectronics Sa Programmation de cellules anti-fusibles
JP6789729B2 (ja) * 2016-08-31 2020-11-25 キヤノン株式会社 半導体装置、液体吐出ヘッド用基板、液体吐出ヘッド、及び液体吐出装置
JP6827740B2 (ja) * 2016-08-31 2021-02-10 キヤノン株式会社 半導体装置、液体吐出ヘッド用基板、液体吐出ヘッド、及び液体吐出装置
JP6622745B2 (ja) * 2017-03-30 2019-12-18 キヤノン株式会社 半導体装置、液体吐出ヘッド用基板、液体吐出ヘッド、及び液体吐出装置

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