JP2022079746A - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP2022079746A JP2022079746A JP2022062110A JP2022062110A JP2022079746A JP 2022079746 A JP2022079746 A JP 2022079746A JP 2022062110 A JP2022062110 A JP 2022062110A JP 2022062110 A JP2022062110 A JP 2022062110A JP 2022079746 A JP2022079746 A JP 2022079746A
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 264
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- 239000000758 substrate Substances 0.000 description 21
- 239000000126 substance Substances 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 229910052693 Europium Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- OOJQNBIDYDPHHE-UHFFFAOYSA-N barium silicon Chemical compound [Si].[Ba] OOJQNBIDYDPHHE-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
Description
11A、11B、21A、21B、21C、31A、31B 青色LED
12A、12B、22A、22B、22C、32A、32B 蛍光体シート
13A、13B、23A、23B、23C、33A、33B 白色反射樹脂
14、24、34 拡散樹脂
15、25、35 基板
16、26、36 バンプ
17A、27A、37A 青緑色蛍光体
17B、27B、37B 黄色蛍光体
17C、27C、37C 黄色蛍光体
17D、27D、37D 赤色蛍光体
Claims (6)
- 第1発光素子と、
第2発光素子と、
第1蛍光体及び前記第1蛍光体と異なる第3蛍光体を含み、且つ、前記第1発光素子の上面を被覆する第1蛍光体シートと、
前記第1蛍光体と異なる第2蛍光体及び前記第2蛍光体と異なる第4蛍光体を含み、且つ、前記第2発光素子の上面を被覆する第2蛍光体シートと、を有し、
前記第1蛍光体により波長変換された光のピーク波長は、前記第2蛍光体により波長変換された光のピーク波長以下且つ前記第4蛍光体により波長変換された光のピーク波長以下であり、前記第3蛍光体により波長変換された光のピーク波長は、前記第2蛍光体により波長変換された光のピーク波長以下且つ前記第4蛍光体により波長変換された光のピーク波長以下である、
ことを特徴とする発光装置。 - 前記第1蛍光体シートと前記第2蛍光体シートの間に設けられる白色反射樹脂をさらに有する、請求項1に記載の発光装置。
- 前記白色反射樹脂は、前記第1蛍光体シートの側面と、前記第1蛍光体シートの側面に対向する前記第2蛍光体シートの側面との間を遮る位置に設けられる、請求項1または2に記載の発光装置。
- 第1発光素子と、
第2発光素子と、
第3発光素子と、
第1蛍光体を含み、且つ、前記第1発光素子の上面を被覆する第1蛍光体シートと、
前記第1蛍光体と異なる第2蛍光体を含み、且つ、前記第2発光素子の上面を被覆する第2蛍光体シートと、
第3蛍光体及び前記第3蛍光体と異なる第4蛍光体を含み、且つ、前記第3発光素子の上面を被覆する第3蛍光体シートと、を有し、
前記第1蛍光体により波長変換された光のピーク波長は、前記第2蛍光体により波長変換された光のピーク波長以下であり、前記第2蛍光体により波長変換された光のピーク波長は、前記第3蛍光体により波長変換された光のピーク波長以下且つ前記第4蛍光体により波長変換された光のピーク波長以下である、
ことを特徴とする発光装置。 - 前記第1蛍光体シートと前記第2蛍光体シートの間に設けられる白色反射樹脂と、
前記第2蛍光体シートと前記第3蛍光体シートの間に設けられる第2白色反射樹脂と、をさらに有する、請求項4に記載の発光装置。 - 前記白色反射樹脂は、前記第1蛍光体シートの側面と、前記第1蛍光体シートの側面に対向する前記第2蛍光体シートの側面との間を遮る位置に設けられ、
前記第2白色反射樹脂は、前記第2蛍光体シートの側面と、前記第2蛍光体シートの側面に対向する前記第3蛍光体シートの側面との間を遮る位置に設けられる、請求項4または5に記載の発光装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2014254411 | 2014-12-16 | ||
JP2014254411 | 2014-12-16 | ||
JP2021003773A JP2021061448A (ja) | 2014-12-16 | 2021-01-13 | 発光装置 |
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JP2021003773A Division JP2021061448A (ja) | 2014-12-16 | 2021-01-13 | 発光装置 |
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JP2022079746A true JP2022079746A (ja) | 2022-05-26 |
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JP2015243309A Pending JP2016115941A (ja) | 2014-12-16 | 2015-12-14 | 発光装置 |
JP2021003773A Pending JP2021061448A (ja) | 2014-12-16 | 2021-01-13 | 発光装置 |
JP2022062110A Withdrawn JP2022079746A (ja) | 2014-12-16 | 2022-04-01 | 発光装置 |
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JP2015243309A Pending JP2016115941A (ja) | 2014-12-16 | 2015-12-14 | 発光装置 |
JP2021003773A Pending JP2021061448A (ja) | 2014-12-16 | 2021-01-13 | 発光装置 |
Country Status (2)
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US (3) | US10424562B2 (ja) |
JP (3) | JP2016115941A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108561764B (zh) * | 2018-03-21 | 2019-11-22 | 厦门市三安光电科技有限公司 | Led灯丝结构及基于其的led照明灯 |
JP2019204831A (ja) | 2018-05-22 | 2019-11-28 | ウシオオプトセミコンダクター株式会社 | 発光素子 |
CN111009603A (zh) * | 2018-10-04 | 2020-04-14 | 日亚化学工业株式会社 | 发光装置 |
JP6959548B2 (ja) | 2018-10-04 | 2021-11-02 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
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2015
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- 2015-12-14 JP JP2015243309A patent/JP2016115941A/ja active Pending
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2019
- 2019-08-20 US US16/545,151 patent/US11342312B2/en active Active
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2021
- 2021-01-13 JP JP2021003773A patent/JP2021061448A/ja active Pending
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2022
- 2022-04-01 JP JP2022062110A patent/JP2022079746A/ja not_active Withdrawn
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Also Published As
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US20160169460A1 (en) | 2016-06-16 |
US11756939B2 (en) | 2023-09-12 |
US10424562B2 (en) | 2019-09-24 |
JP2016115941A (ja) | 2016-06-23 |
JP2021061448A (ja) | 2021-04-15 |
US11342312B2 (en) | 2022-05-24 |
US20190378824A1 (en) | 2019-12-12 |
US20220246588A1 (en) | 2022-08-04 |
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