JP2022062715A5 - - Google Patents
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- Publication number
- JP2022062715A5 JP2022062715A5 JP2021210036A JP2021210036A JP2022062715A5 JP 2022062715 A5 JP2022062715 A5 JP 2022062715A5 JP 2021210036 A JP2021210036 A JP 2021210036A JP 2021210036 A JP2021210036 A JP 2021210036A JP 2022062715 A5 JP2022062715 A5 JP 2022062715A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- core
- shell structure
- assembly
- metal particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 19
- 239000002184 metal Substances 0.000 claims 15
- 239000002923 metal particle Substances 0.000 claims 10
- 239000011258 core-shell material Substances 0.000 claims 9
- 239000002105 nanoparticle Substances 0.000 claims 9
- 239000011230 binding agent Substances 0.000 claims 6
- 239000000463 material Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims 3
- 239000000843 powder Substances 0.000 claims 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims 3
- 238000010030 laminating Methods 0.000 claims 2
- 229920000307 polymer substrate Polymers 0.000 claims 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000005266 casting Methods 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024009864A JP2024045324A (ja) | 2014-06-12 | 2024-01-26 | 焼結材料、及びそれを用いる接着方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IN2873CH2014 | 2014-06-12 | ||
| IN2873/CHE/2014 | 2014-06-12 | ||
| JP2019216135A JP7001659B2 (ja) | 2014-06-12 | 2019-11-29 | 焼結材料、及びそれを用いる接着方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019216135A Division JP7001659B2 (ja) | 2014-06-12 | 2019-11-29 | 焼結材料、及びそれを用いる接着方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024009864A Division JP2024045324A (ja) | 2014-06-12 | 2024-01-26 | 焼結材料、及びそれを用いる接着方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022062715A JP2022062715A (ja) | 2022-04-20 |
| JP2022062715A5 true JP2022062715A5 (enExample) | 2022-05-13 |
| JP7489956B2 JP7489956B2 (ja) | 2024-05-24 |
Family
ID=54834397
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016572384A Pending JP2017525839A (ja) | 2014-06-12 | 2015-06-12 | 焼結材料、及びそれを用いる接着方法 |
| JP2019216135A Active JP7001659B2 (ja) | 2014-06-12 | 2019-11-29 | 焼結材料、及びそれを用いる接着方法 |
| JP2021210036A Active JP7489956B2 (ja) | 2014-06-12 | 2021-12-24 | 焼結材料、及びそれを用いる接着方法 |
| JP2024009864A Withdrawn JP2024045324A (ja) | 2014-06-12 | 2024-01-26 | 焼結材料、及びそれを用いる接着方法 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016572384A Pending JP2017525839A (ja) | 2014-06-12 | 2015-06-12 | 焼結材料、及びそれを用いる接着方法 |
| JP2019216135A Active JP7001659B2 (ja) | 2014-06-12 | 2019-11-29 | 焼結材料、及びそれを用いる接着方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024009864A Withdrawn JP2024045324A (ja) | 2014-06-12 | 2024-01-26 | 焼結材料、及びそれを用いる接着方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11389865B2 (enExample) |
| EP (1) | EP3154729A4 (enExample) |
| JP (4) | JP2017525839A (enExample) |
| KR (5) | KR102424487B1 (enExample) |
| CN (1) | CN106660120A (enExample) |
| BR (1) | BR112016029118A2 (enExample) |
| WO (1) | WO2015192004A1 (enExample) |
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| JP6815133B2 (ja) | 2016-08-31 | 2021-01-20 | 日東電工株式会社 | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート |
| US20180166369A1 (en) * | 2016-12-14 | 2018-06-14 | Texas Instruments Incorporated | Bi-Layer Nanoparticle Adhesion Film |
| US9865527B1 (en) | 2016-12-22 | 2018-01-09 | Texas Instruments Incorporated | Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation |
| EP3569329B1 (en) * | 2017-01-11 | 2023-11-01 | Resonac Corporation | Copper paste for pressureless bonding, bonded body and semiconductor device |
| US9941194B1 (en) | 2017-02-21 | 2018-04-10 | Texas Instruments Incorporated | Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer |
| DE112017007299B4 (de) * | 2017-03-23 | 2024-10-10 | Mitsubishi Electric Corporation | Halbleiterelement-bonding-körper, halbleitereinheit und verfahren zur herstellung eines halbleiterelement-bonding-körpers |
| JP7127269B2 (ja) * | 2017-10-23 | 2022-08-30 | 昭和電工マテリアルズ株式会社 | 部材接続方法 |
| JP7043794B2 (ja) * | 2017-11-06 | 2022-03-30 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板およびヒートシンク付パワーモジュール用基板の製造方法 |
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| KR102040020B1 (ko) * | 2018-08-29 | 2019-11-04 | 주식회사 영동테크 | 은과 구리의 고용체를 포함하는 금속 나노 분말 |
| JP7228422B2 (ja) * | 2019-03-15 | 2023-02-24 | 日東電工株式会社 | 焼結接合用シート、基材付き焼結接合用シート、および焼結接合用材料層付き半導体チップ |
| CN109819384A (zh) * | 2019-04-09 | 2019-05-28 | 重庆三峡学院 | 一种mems麦克风封装器件的制造方法 |
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| CN113345861A (zh) * | 2020-02-18 | 2021-09-03 | 朋程科技股份有限公司 | 功率组件的半成品及其制造方法以及功率组件的制造方法 |
| DE112021001365T5 (de) * | 2020-03-04 | 2022-12-22 | Denso Corporation | Halbleitervorrichtung und verfahren zur fertigung der halbleitervorrichtung |
| JP7604779B2 (ja) * | 2020-03-23 | 2024-12-24 | 富士電機株式会社 | 半導体製造装置及び半導体装置の製造方法 |
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| CN114823596A (zh) * | 2021-01-18 | 2022-07-29 | 日东电工株式会社 | 半导体装置、以及半导体装置的制造方法 |
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| FR3121277B1 (fr) * | 2021-03-26 | 2024-02-16 | Safran Electronics & Defense | Procédé pour assembler un composant électronique à un substrat |
| WO2023282976A2 (en) * | 2021-05-24 | 2023-01-12 | Corning Research & Development Corporation | Systems and methods of joining substrates using nano-particles |
| GB2612776A (en) * | 2021-11-10 | 2023-05-17 | Asm Assembly Systems Singapore Pte Ltd | Deposit levelling |
| JP2023073819A (ja) * | 2021-11-16 | 2023-05-26 | 富士電機株式会社 | 半導体装置及びその製造方法 |
| KR20240161145A (ko) * | 2022-03-15 | 2024-11-12 | 알파 어셈블리 솔루션스 인크. | 소결 준비된 다층 와이어/리본 본드 패드 및 다이 상단 부착 방법 |
| JP7683528B2 (ja) * | 2022-04-05 | 2025-05-27 | 株式会社三洋物産 | 遊技機 |
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| US20240182757A1 (en) * | 2022-12-02 | 2024-06-06 | Wolfspeed, Inc. | Core-Shell Particle Die-Attach Material |
| EP4421055A1 (de) | 2023-02-23 | 2024-08-28 | Heraeus Electronics GmbH & Co. KG | Kupfer-keramik-substrat mit sinterbarer oberseite |
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| DE102023104436A1 (de) | 2023-02-23 | 2024-08-29 | Heraeus Deutschland GmbH & Co. KG | Metall-Keramik-Substrat mit sinterbarer Oberseite |
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| EP4443488A1 (de) | 2023-04-04 | 2024-10-09 | Heraeus Electronics GmbH & Co. KG | Substratanordnung mit oberflächenstruktur |
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| JP2025086811A (ja) | 2023-11-28 | 2025-06-09 | 株式会社Pfa | 接合体製造装置および接合体製造方法 |
| CN118737861B (zh) * | 2024-09-04 | 2024-11-12 | 深圳平创半导体有限公司 | 一种晶圆的金属化方法 |
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| CN109792806B (zh) * | 2016-09-27 | 2022-07-29 | 诺维尔里斯公司 | 使用磁加热的预时效系统和方法 |
| CN108016032B (zh) * | 2017-12-05 | 2019-08-13 | 广西艾盛创制科技有限公司 | 一种提高打印件强度韧性的3d打印成型工艺方法和装置 |
| CN108098092A (zh) * | 2017-12-21 | 2018-06-01 | 成都川美新技术股份有限公司 | 一种采用焊锡膏对射频基板与壳体进行烧结的方法 |
-
2015
- 2015-06-12 CN CN201580037893.XA patent/CN106660120A/zh active Pending
- 2015-06-12 KR KR1020207035949A patent/KR102424487B1/ko active Active
- 2015-06-12 KR KR1020247022325A patent/KR20240112953A/ko not_active Ceased
- 2015-06-12 KR KR1020227025309A patent/KR20220106240A/ko not_active Ceased
- 2015-06-12 WO PCT/US2015/035566 patent/WO2015192004A1/en not_active Ceased
- 2015-06-12 US US15/316,684 patent/US11389865B2/en active Active
- 2015-06-12 EP EP15806611.8A patent/EP3154729A4/en active Pending
- 2015-06-12 KR KR1020167036636A patent/KR20170013927A/ko not_active Ceased
- 2015-06-12 BR BR112016029118A patent/BR112016029118A2/pt not_active Application Discontinuation
- 2015-06-12 KR KR1020197003667A patent/KR20190016142A/ko not_active Ceased
- 2015-06-12 JP JP2016572384A patent/JP2017525839A/ja active Pending
-
2019
- 2019-11-29 JP JP2019216135A patent/JP7001659B2/ja active Active
-
2021
- 2021-12-24 JP JP2021210036A patent/JP7489956B2/ja active Active
-
2024
- 2024-01-26 JP JP2024009864A patent/JP2024045324A/ja not_active Withdrawn
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