JP2022051283A5 - - Google Patents

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Publication number
JP2022051283A5
JP2022051283A5 JP2020157679A JP2020157679A JP2022051283A5 JP 2022051283 A5 JP2022051283 A5 JP 2022051283A5 JP 2020157679 A JP2020157679 A JP 2020157679A JP 2020157679 A JP2020157679 A JP 2020157679A JP 2022051283 A5 JP2022051283 A5 JP 2022051283A5
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JP
Japan
Prior art keywords
insulating layer
pad
wiring
reinforcing
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2020157679A
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English (en)
Japanese (ja)
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JP7519248B2 (ja
JP2022051283A (ja
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Priority to JP2020157679A priority Critical patent/JP7519248B2/ja
Priority claimed from JP2020157679A external-priority patent/JP7519248B2/ja
Priority to US17/447,608 priority patent/US11688669B2/en
Publication of JP2022051283A publication Critical patent/JP2022051283A/ja
Publication of JP2022051283A5 publication Critical patent/JP2022051283A5/ja
Application granted granted Critical
Publication of JP7519248B2 publication Critical patent/JP7519248B2/ja
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JP2020157679A 2020-09-18 2020-09-18 配線基板及びその製造方法 Active JP7519248B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020157679A JP7519248B2 (ja) 2020-09-18 2020-09-18 配線基板及びその製造方法
US17/447,608 US11688669B2 (en) 2020-09-18 2021-09-14 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020157679A JP7519248B2 (ja) 2020-09-18 2020-09-18 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2022051283A JP2022051283A (ja) 2022-03-31
JP2022051283A5 true JP2022051283A5 (cg-RX-API-DMAC7.html) 2023-03-31
JP7519248B2 JP7519248B2 (ja) 2024-07-19

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ID=80740783

Family Applications (1)

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JP2020157679A Active JP7519248B2 (ja) 2020-09-18 2020-09-18 配線基板及びその製造方法

Country Status (2)

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US (1) US11688669B2 (cg-RX-API-DMAC7.html)
JP (1) JP7519248B2 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7841689B2 (ja) * 2022-03-17 2026-04-07 新光電気工業株式会社 配線基板及びその製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243813A (ja) 2002-02-14 2003-08-29 Alps Electric Co Ltd 端子構造
US20060076639A1 (en) * 2004-10-13 2006-04-13 Lypen William J Schottky diodes and methods of making the same
US7245025B2 (en) * 2005-11-30 2007-07-17 International Business Machines Corporation Low cost bonding pad and method of fabricating same
US7592710B2 (en) * 2006-03-03 2009-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. Bond pad structure for wire bonding
JP2007317842A (ja) 2006-05-25 2007-12-06 Elpida Memory Inc プリント配線基板及びこれを用いた半導体パッケージ
JP2009016818A (ja) 2007-07-04 2009-01-22 Samsung Electro-Mechanics Co Ltd 多層印刷回路基板及びその製造方法
JP2011502352A (ja) * 2007-10-31 2011-01-20 アギア システムズ インコーポレーテッド 半導体デバイスのためのボンド・パッド・サポート構造
JP5501562B2 (ja) 2007-12-13 2014-05-21 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
US7993950B2 (en) * 2008-04-30 2011-08-09 Cavendish Kinetics, Ltd. System and method of encapsulation
US20100237500A1 (en) * 2009-03-20 2010-09-23 Stats Chippac, Ltd. Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site
JP5185885B2 (ja) 2009-05-21 2013-04-17 新光電気工業株式会社 配線基板および半導体装置
JP2012039197A (ja) 2010-08-04 2012-02-23 Canon Inc 電気機械変換装置及びその作製方法
JP2012156257A (ja) 2011-01-25 2012-08-16 Fujitsu Ltd 回路基板及び電子装置
JP2013074054A (ja) 2011-09-27 2013-04-22 Renesas Electronics Corp 電子装置、配線基板、及び、電子装置の製造方法
US20140054742A1 (en) * 2012-08-27 2014-02-27 Agency For Science, Technology And Research Semiconductor Structure
US9349700B2 (en) * 2013-04-24 2016-05-24 Stats Chippac, Ltd. Semiconductor device and method of forming stress-reduced conductive joint structures
KR20150058778A (ko) * 2013-11-21 2015-05-29 삼성전자주식회사 반도체 장치 및 그 제조 방법, 상기 반도체 장치를 포함하는 반도체 패키지 및 그 제조 방법
US10163661B2 (en) * 2015-06-30 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Stacked semiconductor devices and methods of forming same
JP2017022190A (ja) 2015-07-08 2017-01-26 パナソニックＩｐマネジメント株式会社 実装構造体
US9871009B2 (en) * 2016-06-15 2018-01-16 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method
CN110634852B (zh) * 2018-06-21 2021-06-25 群创光电股份有限公司 半导体装置
US10886260B2 (en) * 2018-09-07 2021-01-05 Innolux Corporation Display device
US10872842B2 (en) * 2019-02-25 2020-12-22 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and manufacturing method thereof
US11289802B2 (en) * 2019-04-08 2022-03-29 Apple Inc. Millimeter wave impedance matching structures
US11670608B2 (en) * 2019-09-27 2023-06-06 Taiwan Semiconductor Manufacturing Co., Ltd. Prevention of metal pad corrosion due to exposure to halogen
US11244914B2 (en) * 2020-05-05 2022-02-08 Taiwan Semiconductor Manufacturing Company, Ltd. Bond pad with enhanced reliability
US11545450B2 (en) * 2020-07-16 2023-01-03 Nvidia Corporation Interlocked redistribution layer interface for flip-chip integrated circuits

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