JP2023136251A5 - - Google Patents
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- Publication number
- JP2023136251A5 JP2023136251A5 JP2022041769A JP2022041769A JP2023136251A5 JP 2023136251 A5 JP2023136251 A5 JP 2023136251A5 JP 2022041769 A JP2022041769 A JP 2022041769A JP 2022041769 A JP2022041769 A JP 2022041769A JP 2023136251 A5 JP2023136251 A5 JP 2023136251A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating layer
- connection terminal
- external connection
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 68
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022041769A JP7469348B2 (ja) | 2022-03-16 | 2022-03-16 | 配線基板および配線基板の製造方法 |
| DE112023001427.2T DE112023001427T5 (de) | 2022-03-16 | 2023-01-23 | Leiterplatte und Verfahren zur Herstellung einer Leiterplatte |
| PCT/JP2023/001894 WO2023176148A1 (ja) | 2022-03-16 | 2023-01-23 | 配線基板および配線基板の製造方法 |
| US18/845,879 US20250185165A1 (en) | 2022-03-16 | 2023-01-23 | Wiring board and method for manufacturing wiring board |
| CN202380027575.XA CN118872046A (zh) | 2022-03-16 | 2023-01-23 | 布线基板及布线基板的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022041769A JP7469348B2 (ja) | 2022-03-16 | 2022-03-16 | 配線基板および配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023136251A JP2023136251A (ja) | 2023-09-29 |
| JP2023136251A5 true JP2023136251A5 (cg-RX-API-DMAC7.html) | 2024-02-06 |
| JP7469348B2 JP7469348B2 (ja) | 2024-04-16 |
Family
ID=88022687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022041769A Active JP7469348B2 (ja) | 2022-03-16 | 2022-03-16 | 配線基板および配線基板の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250185165A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7469348B2 (cg-RX-API-DMAC7.html) |
| CN (1) | CN118872046A (cg-RX-API-DMAC7.html) |
| DE (1) | DE112023001427T5 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2023176148A1 (cg-RX-API-DMAC7.html) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3580688B2 (ja) * | 1997-12-25 | 2004-10-27 | 京セラ株式会社 | 積層セラミック回路基板の製造方法 |
| JP4445777B2 (ja) | 2004-02-27 | 2010-04-07 | 日本特殊陶業株式会社 | 配線基板、及び配線基板の製造方法 |
| JP5154819B2 (ja) | 2007-04-03 | 2013-02-27 | 新光電気工業株式会社 | 基板及びその製造方法 |
| KR20170011366A (ko) | 2015-07-22 | 2017-02-02 | 삼성전자주식회사 | 반도체 칩 및 이를 가지는 반도체 패키지 |
| JP2020024077A (ja) | 2018-08-08 | 2020-02-13 | 株式会社東芝 | 復水器及び発電プラント |
-
2022
- 2022-03-16 JP JP2022041769A patent/JP7469348B2/ja active Active
-
2023
- 2023-01-23 US US18/845,879 patent/US20250185165A1/en active Pending
- 2023-01-23 DE DE112023001427.2T patent/DE112023001427T5/de active Pending
- 2023-01-23 CN CN202380027575.XA patent/CN118872046A/zh active Pending
- 2023-01-23 WO PCT/JP2023/001894 patent/WO2023176148A1/ja not_active Ceased