JP2021524670A5 - - Google Patents

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Publication number
JP2021524670A5
JP2021524670A5 JP2020565287A JP2020565287A JP2021524670A5 JP 2021524670 A5 JP2021524670 A5 JP 2021524670A5 JP 2020565287 A JP2020565287 A JP 2020565287A JP 2020565287 A JP2020565287 A JP 2020565287A JP 2021524670 A5 JP2021524670 A5 JP 2021524670A5
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JP
Japan
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temperature
substrate
substrates
processing steps
during
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JP2020565287A
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English (en)
Japanese (ja)
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JP7326344B2 (ja
JP2021524670A (ja
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Priority claimed from PCT/US2019/027494 external-priority patent/WO2019226252A1/en
Publication of JP2021524670A publication Critical patent/JP2021524670A/ja
Publication of JP2021524670A5 publication Critical patent/JP2021524670A5/ja
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JP2020565287A 2018-05-24 2019-04-15 空間分解ウエハ温度制御のための仮想センサ Active JP7326344B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862676156P 2018-05-24 2018-05-24
US62/676,156 2018-05-24
PCT/US2019/027494 WO2019226252A1 (en) 2018-05-24 2019-04-15 Virtual sensor for spatially resolved wafer temperature control

Publications (3)

Publication Number Publication Date
JP2021524670A JP2021524670A (ja) 2021-09-13
JP2021524670A5 true JP2021524670A5 (https=) 2022-04-21
JP7326344B2 JP7326344B2 (ja) 2023-08-15

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ID=68614135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020565287A Active JP7326344B2 (ja) 2018-05-24 2019-04-15 空間分解ウエハ温度制御のための仮想センサ

Country Status (7)

Country Link
US (1) US11024522B2 (https=)
JP (1) JP7326344B2 (https=)
KR (1) KR102757324B1 (https=)
CN (1) CN112074941B (https=)
SG (1) SG11202010209PA (https=)
TW (1) TWI837124B (https=)
WO (1) WO2019226252A1 (https=)

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JP7244348B2 (ja) * 2019-05-13 2023-03-22 東京エレクトロン株式会社 プラズマ処理装置、温度制御方法および温度制御プログラム
US20220084842A1 (en) * 2020-09-11 2022-03-17 Applied Materials, Inc. Antifragile systems for semiconductor processing equipment using multiple special sensors and algorithms
US11261538B1 (en) 2020-09-21 2022-03-01 Applied Materials, Inc. In-situ temperature mapping for epi chamber
TW202240734A (zh) * 2020-12-15 2022-10-16 美商蘭姆研究公司 多步驟半導體製造程序中的機器學習
KR102252144B1 (ko) * 2021-03-31 2021-05-17 (주)알티엠 플라즈마의 동작을 확인하는 전자 장치 및 그 동작 방법
US12360510B2 (en) 2021-04-20 2025-07-15 Lam Research Corporation Large spot spectral sensing to control spatial setpoints
KR102579155B1 (ko) * 2021-06-08 2023-09-18 세메스 주식회사 기판 처리 방법 및 장치, 온도 제어 방법
KR102467933B1 (ko) 2021-06-10 2022-11-16 경희대학교 산학협력단 디지털 트윈 기반의 온도분포 예측방법 및 온도분포 예측장치
KR102393813B1 (ko) * 2022-02-24 2022-05-04 주식회사 아크트리아 딥러닝 기반 반도체 약액의 정밀 온도 제어 시스템
TW202405594A (zh) * 2022-03-24 2024-02-01 日商東京威力科創股份有限公司 解析裝置、基板處理系統、基板處理裝置、解析方法及解析程式

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US7415312B2 (en) * 2004-05-25 2008-08-19 Barnett Jr James R Process module tuning
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