KR102757324B1 - 공간적으로 분해된 웨이퍼 온도 제어를 위한 가상 센서 - Google Patents

공간적으로 분해된 웨이퍼 온도 제어를 위한 가상 센서 Download PDF

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Publication number
KR102757324B1
KR102757324B1 KR1020207036794A KR20207036794A KR102757324B1 KR 102757324 B1 KR102757324 B1 KR 102757324B1 KR 1020207036794 A KR1020207036794 A KR 1020207036794A KR 20207036794 A KR20207036794 A KR 20207036794A KR 102757324 B1 KR102757324 B1 KR 102757324B1
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substrate
temperature
substrates
during
determining
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KR20210000731A (ko
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헤만트 피. 멍게카
우베 피. 할러
가네쉬 바라수브라마니안
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H01L21/67248—
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/4155—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by program execution, i.e. part program or machine function execution, e.g. selection of a program
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • H01L21/324—
    • H01L21/67103—
    • H01L21/67253—
    • H01L21/67276—
    • H01L21/6831—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50333—Temperature

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  • Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Mathematical Physics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Artificial Intelligence (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
KR1020207036794A 2018-05-24 2019-04-15 공간적으로 분해된 웨이퍼 온도 제어를 위한 가상 센서 Active KR102757324B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862676156P 2018-05-24 2018-05-24
US62/676,156 2018-05-24
PCT/US2019/027494 WO2019226252A1 (en) 2018-05-24 2019-04-15 Virtual sensor for spatially resolved wafer temperature control

Publications (2)

Publication Number Publication Date
KR20210000731A KR20210000731A (ko) 2021-01-05
KR102757324B1 true KR102757324B1 (ko) 2025-01-20

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KR1020207036794A Active KR102757324B1 (ko) 2018-05-24 2019-04-15 공간적으로 분해된 웨이퍼 온도 제어를 위한 가상 센서

Country Status (7)

Country Link
US (1) US11024522B2 (https=)
JP (1) JP7326344B2 (https=)
KR (1) KR102757324B1 (https=)
CN (1) CN112074941B (https=)
SG (1) SG11202010209PA (https=)
TW (1) TWI837124B (https=)
WO (1) WO2019226252A1 (https=)

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JP7244348B2 (ja) * 2019-05-13 2023-03-22 東京エレクトロン株式会社 プラズマ処理装置、温度制御方法および温度制御プログラム
US20220084842A1 (en) * 2020-09-11 2022-03-17 Applied Materials, Inc. Antifragile systems for semiconductor processing equipment using multiple special sensors and algorithms
US11261538B1 (en) 2020-09-21 2022-03-01 Applied Materials, Inc. In-situ temperature mapping for epi chamber
TW202240734A (zh) * 2020-12-15 2022-10-16 美商蘭姆研究公司 多步驟半導體製造程序中的機器學習
KR102252144B1 (ko) * 2021-03-31 2021-05-17 (주)알티엠 플라즈마의 동작을 확인하는 전자 장치 및 그 동작 방법
US12360510B2 (en) 2021-04-20 2025-07-15 Lam Research Corporation Large spot spectral sensing to control spatial setpoints
KR102579155B1 (ko) * 2021-06-08 2023-09-18 세메스 주식회사 기판 처리 방법 및 장치, 온도 제어 방법
KR102467933B1 (ko) 2021-06-10 2022-11-16 경희대학교 산학협력단 디지털 트윈 기반의 온도분포 예측방법 및 온도분포 예측장치
KR102393813B1 (ko) * 2022-02-24 2022-05-04 주식회사 아크트리아 딥러닝 기반 반도체 약액의 정밀 온도 제어 시스템
TW202405594A (zh) * 2022-03-24 2024-02-01 日商東京威力科創股份有限公司 解析裝置、基板處理系統、基板處理裝置、解析方法及解析程式

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JP2006112826A (ja) 2004-10-12 2006-04-27 Tokyo Electron Ltd 温度測定装置，温度測定方法，温度測定システム，制御システム，制御方法
US20120031892A1 (en) 2010-08-09 2012-02-09 Tokyo Electron Limited Heat Treatment Method, Recording Medium Having Recorded Program for Executing Heat Treatment Method, and Heat Treatment Apparatus
US10903097B2 (en) 2018-03-30 2021-01-26 Axcelis Technologies, Inc. In-situ wafer temperature measurement and control

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JP4480056B2 (ja) 1999-12-06 2010-06-16 コバレントマテリアル株式会社 半導体基板の昇降温制御方法とその装置
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JP2006113724A (ja) * 2004-10-13 2006-04-27 Omron Corp 制御方法、温度制御方法、温度調節器、熱処理装置、プログラムおよび記録媒体
US7838072B2 (en) * 2005-01-26 2010-11-23 Tokyo Electron Limited Method and apparatus for monolayer deposition (MLD)
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JP5203612B2 (ja) 2007-01-17 2013-06-05 株式会社日立ハイテクノロジーズ プラズマ処理装置
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Publication number Priority date Publication date Assignee Title
US20050267606A1 (en) 2004-05-25 2005-12-01 Bartlett James R Jr Process module tuning
JP2006112826A (ja) 2004-10-12 2006-04-27 Tokyo Electron Ltd 温度測定装置，温度測定方法，温度測定システム，制御システム，制御方法
US20120031892A1 (en) 2010-08-09 2012-02-09 Tokyo Electron Limited Heat Treatment Method, Recording Medium Having Recorded Program for Executing Heat Treatment Method, and Heat Treatment Apparatus
US10903097B2 (en) 2018-03-30 2021-01-26 Axcelis Technologies, Inc. In-situ wafer temperature measurement and control

Also Published As

Publication number Publication date
JP7326344B2 (ja) 2023-08-15
US11024522B2 (en) 2021-06-01
CN112074941A (zh) 2020-12-11
WO2019226252A1 (en) 2019-11-28
JP2021524670A (ja) 2021-09-13
SG11202010209PA (en) 2020-12-30
US20190362991A1 (en) 2019-11-28
CN112074941B (zh) 2025-01-24
KR20210000731A (ko) 2021-01-05
TW202011499A (zh) 2020-03-16
TWI837124B (zh) 2024-04-01

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