SG11202010209PA - Virtual sensor for spatially resolved wafer temperature control - Google Patents

Virtual sensor for spatially resolved wafer temperature control

Info

Publication number
SG11202010209PA
SG11202010209PA SG11202010209PA SG11202010209PA SG11202010209PA SG 11202010209P A SG11202010209P A SG 11202010209PA SG 11202010209P A SG11202010209P A SG 11202010209PA SG 11202010209P A SG11202010209P A SG 11202010209PA SG 11202010209P A SG11202010209P A SG 11202010209PA
Authority
SG
Singapore
Prior art keywords
temperature control
wafer temperature
spatially resolved
virtual sensor
spatially
Prior art date
Application number
SG11202010209PA
Other languages
English (en)
Inventor
Hemant P Mungekar
Uwe P Haller
Ganesh Balasubramanian
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11202010209PA publication Critical patent/SG11202010209PA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/4155—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by program execution, i.e. part program or machine function execution, e.g. selection of a program
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50333—Temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Mathematical Physics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Artificial Intelligence (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
SG11202010209PA 2018-05-24 2019-04-15 Virtual sensor for spatially resolved wafer temperature control SG11202010209PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862676156P 2018-05-24 2018-05-24
PCT/US2019/027494 WO2019226252A1 (en) 2018-05-24 2019-04-15 Virtual sensor for spatially resolved wafer temperature control

Publications (1)

Publication Number Publication Date
SG11202010209PA true SG11202010209PA (en) 2020-12-30

Family

ID=68614135

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202010209PA SG11202010209PA (en) 2018-05-24 2019-04-15 Virtual sensor for spatially resolved wafer temperature control

Country Status (7)

Country Link
US (1) US11024522B2 (https=)
JP (1) JP7326344B2 (https=)
KR (1) KR102757324B1 (https=)
CN (1) CN112074941B (https=)
SG (1) SG11202010209PA (https=)
TW (1) TWI837124B (https=)
WO (1) WO2019226252A1 (https=)

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JP7244348B2 (ja) * 2019-05-13 2023-03-22 東京エレクトロン株式会社 プラズマ処理装置、温度制御方法および温度制御プログラム
US20220084842A1 (en) * 2020-09-11 2022-03-17 Applied Materials, Inc. Antifragile systems for semiconductor processing equipment using multiple special sensors and algorithms
US11261538B1 (en) 2020-09-21 2022-03-01 Applied Materials, Inc. In-situ temperature mapping for epi chamber
TW202240734A (zh) * 2020-12-15 2022-10-16 美商蘭姆研究公司 多步驟半導體製造程序中的機器學習
KR102252144B1 (ko) * 2021-03-31 2021-05-17 (주)알티엠 플라즈마의 동작을 확인하는 전자 장치 및 그 동작 방법
US12360510B2 (en) 2021-04-20 2025-07-15 Lam Research Corporation Large spot spectral sensing to control spatial setpoints
KR102579155B1 (ko) * 2021-06-08 2023-09-18 세메스 주식회사 기판 처리 방법 및 장치, 온도 제어 방법
KR102467933B1 (ko) 2021-06-10 2022-11-16 경희대학교 산학협력단 디지털 트윈 기반의 온도분포 예측방법 및 온도분포 예측장치
KR102393813B1 (ko) * 2022-02-24 2022-05-04 주식회사 아크트리아 딥러닝 기반 반도체 약액의 정밀 온도 제어 시스템
TW202405594A (zh) * 2022-03-24 2024-02-01 日商東京威力科創股份有限公司 解析裝置、基板處理系統、基板處理裝置、解析方法及解析程式

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JP4480056B2 (ja) 1999-12-06 2010-06-16 コバレントマテリアル株式会社 半導体基板の昇降温制御方法とその装置
US7016754B2 (en) 2003-05-08 2006-03-21 Onwafer Technologies, Inc. Methods of and apparatus for controlling process profiles
US8050900B2 (en) 2003-09-30 2011-11-01 Tokyo Electron Limited System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
US7127358B2 (en) 2004-03-30 2006-10-24 Tokyo Electron Limited Method and system for run-to-run control
US7415312B2 (en) * 2004-05-25 2008-08-19 Barnett Jr James R Process module tuning
JP4756845B2 (ja) 2004-10-12 2011-08-24 東京エレクトロン株式会社 温度測定装置，温度測定方法，温度測定システム，制御システム，制御方法
JP2006113724A (ja) * 2004-10-13 2006-04-27 Omron Corp 制御方法、温度制御方法、温度調節器、熱処理装置、プログラムおよび記録媒体
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US20070091541A1 (en) 2005-10-20 2007-04-26 Applied Materials, Inc. Method of processing a workpiece in a plasma reactor using feed forward thermal control
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US7787685B2 (en) * 2006-04-17 2010-08-31 Taiwan Semiconductor Manufacturing Company, Ltd. Extracting ordinary and extraordinary optical characteristics for critical dimension measurement of anisotropic materials
JP5203612B2 (ja) 2007-01-17 2013-06-05 株式会社日立ハイテクノロジーズ プラズマ処理装置
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KR20180011119A (ko) * 2015-05-22 2018-01-31 어플라이드 머티어리얼스, 인코포레이티드 방위방향으로 튜닝가능한 다중-구역 정전 척
US10903097B2 (en) * 2018-03-30 2021-01-26 Axcelis Technologies, Inc. In-situ wafer temperature measurement and control

Also Published As

Publication number Publication date
JP7326344B2 (ja) 2023-08-15
US11024522B2 (en) 2021-06-01
CN112074941A (zh) 2020-12-11
WO2019226252A1 (en) 2019-11-28
JP2021524670A (ja) 2021-09-13
KR102757324B1 (ko) 2025-01-20
US20190362991A1 (en) 2019-11-28
CN112074941B (zh) 2025-01-24
KR20210000731A (ko) 2021-01-05
TW202011499A (zh) 2020-03-16
TWI837124B (zh) 2024-04-01

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