JPWO2022191199A5 - - Google Patents

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JPWO2022191199A5
JPWO2022191199A5 JP2023505582A JP2023505582A JPWO2022191199A5 JP WO2022191199 A5 JPWO2022191199 A5 JP WO2022191199A5 JP 2023505582 A JP2023505582 A JP 2023505582A JP 2023505582 A JP2023505582 A JP 2023505582A JP WO2022191199 A5 JPWO2022191199 A5 JP WO2022191199A5
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estimated value
value
physical constant
temperature
obtaining
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JP7488523B2 (ja
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JP2023505582A 2021-03-09 2022-03-08 物理定数の推定値取得方法 Active JP7488523B2 (ja)

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Application Number Priority Date Filing Date Title
JP2021037203 2021-03-09
JP2021037203 2021-03-09
PCT/JP2022/010043 WO2022191199A1 (ja) 2021-03-09 2022-03-08 物理定数の推定値取得方法

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JPWO2022191199A1 JPWO2022191199A1 (https=) 2022-09-15
JPWO2022191199A5 true JPWO2022191199A5 (https=) 2024-01-10
JP7488523B2 JP7488523B2 (ja) 2024-05-22

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US (1) US20240160809A1 (https=)
EP (1) EP4306946A4 (https=)
JP (1) JP7488523B2 (https=)
WO (1) WO2022191199A1 (https=)

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JP2023142321A (ja) * 2022-03-24 2023-10-05 株式会社構造計画研究所 シミュレーション装置、シミュレーション方法及びプログラム

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* Cited by examiner, † Cited by third party
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JP4079638B2 (ja) * 2001-12-26 2008-04-23 株式会社東芝 有限要素法による残留応力解析方法
JP4130156B2 (ja) * 2003-05-30 2008-08-06 富士通株式会社 物性値測定装置および物性値測定方法
JP4309213B2 (ja) * 2003-09-05 2009-08-05 株式会社東芝 伝熱解析方法、伝熱解析プログラムおよび伝熱解析装置
JP2005164355A (ja) * 2003-12-02 2005-06-23 Olympus Corp 材料接合部評価方法および成形用金型
JP4280830B2 (ja) * 2004-08-24 2009-06-17 国立大学法人島根大学 比熱および熱伝導率の測定方法。
JP2006337233A (ja) * 2005-06-03 2006-12-14 Toshiba Corp 残留応力評価方法、残留応力評価プログラムを記録した記録媒体および残留応力評価装置
PT3188060T (pt) * 2014-08-27 2023-06-27 Nec Corp Dispositivo de simulação, método de simulação e meios de memória
JP7356823B2 (ja) * 2019-06-11 2023-10-05 株式会社構造計画研究所 パラメータ推定装置、パラメータ推定方法及びプログラム
JP2021037203A (ja) 2019-09-05 2021-03-11 Ｎｅｃエンベデッドプロダクツ株式会社 モータシステム、回胴式遊技機、制御方法及びプログラム

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