JP2021169604A5 - - Google Patents
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- Publication number
- JP2021169604A5 JP2021169604A5 JP2021062836A JP2021062836A JP2021169604A5 JP 2021169604 A5 JP2021169604 A5 JP 2021169604A5 JP 2021062836 A JP2021062836 A JP 2021062836A JP 2021062836 A JP2021062836 A JP 2021062836A JP 2021169604 A5 JP2021169604 A5 JP 2021169604A5
- Authority
- JP
- Japan
- Prior art keywords
- chemical mechanical
- mechanical polishing
- cerium
- polishing composition
- optionally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000005498 polishing Methods 0.000 claims 21
- 239000000126 substance Substances 0.000 claims 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 14
- 239000000203 mixture Substances 0.000 claims 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 230000002378 acidificating effect Effects 0.000 claims 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 4
- 239000006061 abrasive grain Substances 0.000 claims 4
- 239000007800 oxidant agent Substances 0.000 claims 4
- -1 aminosilane compound Chemical class 0.000 claims 3
- 229910000420 cerium oxide Inorganic materials 0.000 claims 3
- 239000008119 colloidal silica Substances 0.000 claims 3
- 229910052757 nitrogen Inorganic materials 0.000 claims 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims 3
- 239000003002 pH adjusting agent Substances 0.000 claims 3
- 229910052684 Cerium Inorganic materials 0.000 claims 2
- 230000003115 biocidal effect Effects 0.000 claims 2
- 239000003139 biocide Substances 0.000 claims 2
- HSJPMRKMPBAUAU-UHFFFAOYSA-N cerium(3+);trinitrate Chemical compound [Ce+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O HSJPMRKMPBAUAU-UHFFFAOYSA-N 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 2
- 229920002635 polyurethane Polymers 0.000 claims 2
- 239000004814 polyurethane Substances 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 239000004094 surface-active agent Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 claims 1
- 150000001785 cerium compounds Chemical class 0.000 claims 1
- VYLVYHXQOHJDJL-UHFFFAOYSA-K cerium trichloride Chemical compound Cl[Ce](Cl)Cl VYLVYHXQOHJDJL-UHFFFAOYSA-K 0.000 claims 1
- VGBWDOLBWVJTRZ-UHFFFAOYSA-K cerium(3+);triacetate Chemical compound [Ce+3].CC([O-])=O.CC([O-])=O.CC([O-])=O VGBWDOLBWVJTRZ-UHFFFAOYSA-K 0.000 claims 1
- QCCDYNYSHILRDG-UHFFFAOYSA-K cerium(3+);trifluoride Chemical compound [F-].[F-].[F-].[Ce+3] QCCDYNYSHILRDG-UHFFFAOYSA-K 0.000 claims 1
- ZEDZJUDTPVFRNB-UHFFFAOYSA-K cerium(3+);triiodide Chemical compound I[Ce](I)I ZEDZJUDTPVFRNB-UHFFFAOYSA-K 0.000 claims 1
- OZECDDHOAMNMQI-UHFFFAOYSA-H cerium(3+);trisulfate Chemical compound [Ce+3].[Ce+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O OZECDDHOAMNMQI-UHFFFAOYSA-H 0.000 claims 1
- WTVAYLQYAWAHAX-UHFFFAOYSA-J cerium(4+);tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Ce+4] WTVAYLQYAWAHAX-UHFFFAOYSA-J 0.000 claims 1
- MOOUSOJAOQPDEH-UHFFFAOYSA-K cerium(iii) bromide Chemical compound [Br-].[Br-].[Br-].[Ce+3] MOOUSOJAOQPDEH-UHFFFAOYSA-K 0.000 claims 1
- UNJPQTDTZAKTFK-UHFFFAOYSA-K cerium(iii) hydroxide Chemical compound [OH-].[OH-].[OH-].[Ce+3] UNJPQTDTZAKTFK-UHFFFAOYSA-K 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- OKJMLYFJRFYBPS-UHFFFAOYSA-J tetraazanium;cerium(4+);tetrasulfate Chemical compound [NH4+].[NH4+].[NH4+].[NH4+].[Ce+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O OKJMLYFJRFYBPS-UHFFFAOYSA-J 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/849,135 US11384254B2 (en) | 2020-04-15 | 2020-04-15 | Chemical mechanical polishing composition containing composite silica particles, method of making the silica composite particles and method of polishing a substrate |
| US16/849,135 | 2020-04-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021169604A JP2021169604A (ja) | 2021-10-28 |
| JP2021169604A5 true JP2021169604A5 (enExample) | 2024-03-27 |
Family
ID=78081571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021062836A Pending JP2021169604A (ja) | 2020-04-15 | 2021-04-01 | 複合シリカ粒子を含有するケミカルメカニカルポリッシング組成物、シリカ複合粒子を製造する方法、及び基板を研磨する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US11384254B2 (enExample) |
| JP (1) | JP2021169604A (enExample) |
| KR (1) | KR20210127876A (enExample) |
| CN (1) | CN113528026B (enExample) |
| TW (1) | TW202140741A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4053882A4 (en) * | 2021-01-06 | 2022-10-26 | Showa Denko Materials Co., Ltd. | Polishing fluid, polishing fluid set, and polishing method |
| EP4067449A1 (en) * | 2021-04-02 | 2022-10-05 | SKC Solmics Co., Ltd. | Polishing composition for semiconductor process and method for manufacturing semiconductor device by using the same |
| KR102728251B1 (ko) * | 2021-12-31 | 2024-11-11 | 주식회사 케이씨텍 | 컨택 공정용 금속막 슬러리 조성물 |
| CN116063930A (zh) * | 2023-03-29 | 2023-05-05 | 国科大杭州高等研究院 | 一种半导体硅片抛光用的纳米硅铈复合抛光液的制备方法 |
| WO2025108860A1 (en) * | 2023-11-20 | 2025-05-30 | Merck Patent Gmbh | Silica particles, compositions comprising such particles, and uses of such particles and compositions |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030118824A1 (en) * | 2001-12-20 | 2003-06-26 | Tokarz Bozena Stanislawa | Coated silica particles and method for production thereof |
| JP4294710B2 (ja) * | 2007-09-13 | 2009-07-15 | 三井金属鉱業株式会社 | 酸化セリウム及びその製造方法 |
| WO2012102187A1 (ja) * | 2011-01-25 | 2012-08-02 | 日立化成工業株式会社 | Ｃｍｐ研磨液及びその製造方法、複合粒子の製造方法、並びに基体の研磨方法 |
| EP3161095B8 (en) * | 2014-06-25 | 2021-07-07 | CMC Materials, Inc. | Copper barrier chemical-mechanical polishing composition |
| US10032644B2 (en) * | 2015-06-05 | 2018-07-24 | Versum Materials Us, Llc | Barrier chemical mechanical planarization slurries using ceria-coated silica abrasives |
| US9293339B1 (en) * | 2015-09-24 | 2016-03-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of polishing semiconductor substrate |
| WO2017147891A1 (en) * | 2016-03-04 | 2017-09-08 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of chemical mechanical polishing a semiconductor substrate |
| JP6797665B2 (ja) * | 2016-12-20 | 2020-12-09 | 花王株式会社 | 研磨液組成物 |
| JP7062360B2 (ja) * | 2016-12-28 | 2022-05-06 | キヤノン株式会社 | 情報処理装置、情報処理装置の作動方法およびプログラム |
| US10037889B1 (en) * | 2017-03-29 | 2018-07-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cationic particle containing slurries and methods of using them for CMP of spin-on carbon films |
| US10428241B2 (en) * | 2017-10-05 | 2019-10-01 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions containing charged abrasive |
| JP7020865B2 (ja) * | 2017-10-30 | 2022-02-16 | 日揮触媒化成株式会社 | セリア系複合微粒子分散液、その製造方法及びセリア系複合微粒子分散液を含む研磨用砥粒分散液 |
| JPWO2019181487A1 (ja) * | 2018-03-23 | 2021-03-11 | 富士フイルム株式会社 | 研磨液および化学的機械的研磨方法 |
| US10995238B2 (en) * | 2018-07-03 | 2021-05-04 | Rohm And Haas Electronic Materials Cmp Holdings | Neutral to alkaline chemical mechanical polishing compositions and methods for tungsten |
-
2020
- 2020-04-15 US US16/849,135 patent/US11384254B2/en active Active
-
2021
- 2021-04-01 JP JP2021062836A patent/JP2021169604A/ja active Pending
- 2021-04-06 CN CN202110398366.9A patent/CN113528026B/zh active Active
- 2021-04-06 TW TW110112389A patent/TW202140741A/zh unknown
- 2021-04-07 KR KR1020210045203A patent/KR20210127876A/ko not_active Withdrawn
-
2022
- 2022-02-23 US US17/678,148 patent/US11718769B2/en active Active
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