JP2019110286A5 - - Google Patents
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- Publication number
- JP2019110286A5 JP2019110286A5 JP2018175755A JP2018175755A JP2019110286A5 JP 2019110286 A5 JP2019110286 A5 JP 2019110286A5 JP 2018175755 A JP2018175755 A JP 2018175755A JP 2018175755 A JP2018175755 A JP 2018175755A JP 2019110286 A5 JP2019110286 A5 JP 2019110286A5
- Authority
- JP
- Japan
- Prior art keywords
- chemical mechanical
- mechanical polishing
- polishing composition
- per minute
- revolutions per
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 28
- 239000000126 substance Substances 0.000 claims 23
- 239000000203 mixture Substances 0.000 claims 16
- 239000010941 cobalt Substances 0.000 claims 7
- 229910017052 cobalt Inorganic materials 0.000 claims 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 7
- 238000000034 method Methods 0.000 claims 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 6
- 229920002635 polyurethane Polymers 0.000 claims 5
- 239000004814 polyurethane Substances 0.000 claims 5
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 235000003704 aspartic acid Nutrition 0.000 claims 4
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 claims 4
- 239000008119 colloidal silica Substances 0.000 claims 4
- 239000007800 oxidant agent Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- 150000003839 salts Chemical class 0.000 claims 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 4
- 239000004615 ingredient Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000006061 abrasive grain Substances 0.000 claims 2
- 239000011859 microparticle Substances 0.000 claims 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 1
- 230000003115 biocidal effect Effects 0.000 claims 1
- 239000003139 biocide Substances 0.000 claims 1
- 238000005260 corrosion Methods 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 239000004745 nonwoven fabric Substances 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000003002 pH adjusting agent Substances 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/710,898 | 2017-09-21 | ||
| US15/710,898 US10377921B2 (en) | 2017-09-21 | 2017-09-21 | Chemical mechanical polishing method for cobalt |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019110286A JP2019110286A (ja) | 2019-07-04 |
| JP2019110286A5 true JP2019110286A5 (enExample) | 2022-12-06 |
| JP7207918B2 JP7207918B2 (ja) | 2023-01-18 |
Family
ID=65719934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018175755A Active JP7207918B2 (ja) | 2017-09-21 | 2018-09-20 | コバルト用ケミカルメカニカルポリッシング方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10377921B2 (enExample) |
| JP (1) | JP7207918B2 (enExample) |
| KR (1) | KR102459546B1 (enExample) |
| CN (1) | CN109545736B (enExample) |
| TW (1) | TWI838343B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3714012B1 (en) * | 2017-11-22 | 2023-01-11 | Basf Se | Chemical mechanical polishing composition |
| US10947413B2 (en) * | 2019-03-29 | 2021-03-16 | Rohm And Haas Electronic Materials Cmp Holdings | Chemical mechanical polishing method for cobalt with high cobalt removal rates and reduced cobalt corrosion |
| US10787592B1 (en) * | 2019-05-16 | 2020-09-29 | Rohm And Haas Electronic Materials Cmp Holdings, I | Chemical mechanical polishing compositions and methods having enhanced defect inhibition and selectively polishing silicon nitride over silicon dioxide in an acid environment |
| CN113004801B (zh) * | 2019-12-20 | 2024-03-12 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| CN115160933B (zh) * | 2022-07-27 | 2023-11-28 | 河北工业大学 | 一种用于钴互连集成电路钴cmp的碱性抛光液及其制备方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4078787B2 (ja) * | 2000-03-31 | 2008-04-23 | Ｊｓｒ株式会社 | 化学機械研磨用水系分散体 |
| JP2011003665A (ja) | 2009-06-17 | 2011-01-06 | Jsr Corp | 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法 |
| JP5141792B2 (ja) * | 2010-06-29 | 2013-02-13 | 日立化成工業株式会社 | Ｃｍｐ研磨液及び研磨方法 |
| CN102304327A (zh) | 2011-07-05 | 2012-01-04 | 复旦大学 | 一种基于金属Co的抛光工艺的抛光液 |
| US20130045599A1 (en) * | 2011-08-15 | 2013-02-21 | Rohm and Electronic Materials CMP Holdings, Inc. | Method for chemical mechanical polishing copper |
| US20130186850A1 (en) | 2012-01-24 | 2013-07-25 | Applied Materials, Inc. | Slurry for cobalt applications |
| US20140011362A1 (en) | 2012-07-06 | 2014-01-09 | Basf Se | Chemical mechanical polishing (cmp) composition comprising a non-ionic surfactant and an aromatic compound comprising at least one acid group |
| SG11201506102TA (en) | 2013-02-28 | 2015-09-29 | Fujimi Inc | Polishing slurry for cobalt removal |
| JP6156630B2 (ja) | 2013-05-24 | 2017-07-05 | Jsr株式会社 | 化学機械研磨用水系分散体および化学機械研磨方法 |
| EP3112436A4 (en) * | 2014-02-26 | 2017-02-22 | Fujimi Incorporated | Polishing composition |
| US9583359B2 (en) * | 2014-04-04 | 2017-02-28 | Fujifilm Planar Solutions, LLC | Polishing compositions and methods for selectively polishing silicon nitride over silicon oxide films |
| WO2016008896A1 (en) | 2014-07-15 | 2016-01-21 | Basf Se | A chemical mechanical polishing (cmp) composition |
| US10217645B2 (en) * | 2014-07-25 | 2019-02-26 | Versum Materials Us, Llc | Chemical mechanical polishing (CMP) of cobalt-containing substrate |
| US9735030B2 (en) | 2014-09-05 | 2017-08-15 | Fujifilm Planar Solutions, LLC | Polishing compositions and methods for polishing cobalt films |
| EP3210238B1 (en) | 2014-10-21 | 2019-06-26 | Cabot Microelectronics Corporation | Cobalt polishing accelerators |
| US9944828B2 (en) | 2014-10-21 | 2018-04-17 | Cabot Microelectronics Corporation | Slurry for chemical mechanical polishing of cobalt |
| TWI775722B (zh) * | 2014-12-22 | 2022-09-01 | 德商巴斯夫歐洲公司 | 化學機械拋光（ｃｍｐ）組成物用於拋光含鈷及/或鈷合金之基材的用途 |
| CN104830235B (zh) | 2015-04-29 | 2017-06-23 | 清华大学 | 用于钴阻挡层结构化学机械抛光的抛光液及其应用 |
| WO2017025536A1 (en) | 2015-08-12 | 2017-02-16 | Basf Se | Use of a chemical mechanical polishing (cmp) composition for polishing of cobalt comprising substrates |
| US9528030B1 (en) | 2015-10-21 | 2016-12-27 | Cabot Microelectronics Corporation | Cobalt inhibitor combination for improved dishing |
-
2017
- 2017-09-21 US US15/710,898 patent/US10377921B2/en active Active
-
2018
- 2018-08-21 TW TW107129142A patent/TWI838343B/zh active
- 2018-08-21 CN CN201810954807.7A patent/CN109545736B/zh active Active
- 2018-09-11 KR KR1020180108055A patent/KR102459546B1/ko active Active
- 2018-09-20 JP JP2018175755A patent/JP7207918B2/ja active Active
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