JP2021168365A - 板状物の加工方法 - Google Patents

板状物の加工方法 Download PDF

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Publication number
JP2021168365A
JP2021168365A JP2020071744A JP2020071744A JP2021168365A JP 2021168365 A JP2021168365 A JP 2021168365A JP 2020071744 A JP2020071744 A JP 2020071744A JP 2020071744 A JP2020071744 A JP 2020071744A JP 2021168365 A JP2021168365 A JP 2021168365A
Authority
JP
Japan
Prior art keywords
resin
sheet
plate
processing
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020071744A
Other languages
English (en)
Japanese (ja)
Inventor
誠 下谷
Makoto Shimotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2020071744A priority Critical patent/JP2021168365A/ja
Priority to KR1020210034350A priority patent/KR20210127083A/ko
Priority to TW110112680A priority patent/TW202138182A/zh
Priority to CN202110381139.5A priority patent/CN113524015A/zh
Publication of JP2021168365A publication Critical patent/JP2021168365A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2020071744A 2020-04-13 2020-04-13 板状物の加工方法 Pending JP2021168365A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020071744A JP2021168365A (ja) 2020-04-13 2020-04-13 板状物の加工方法
KR1020210034350A KR20210127083A (ko) 2020-04-13 2021-03-17 판상물의 가공 방법
TW110112680A TW202138182A (zh) 2020-04-13 2021-04-08 板狀物的加工方法
CN202110381139.5A CN113524015A (zh) 2020-04-13 2021-04-09 板状物的加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020071744A JP2021168365A (ja) 2020-04-13 2020-04-13 板状物の加工方法

Publications (1)

Publication Number Publication Date
JP2021168365A true JP2021168365A (ja) 2021-10-21

Family

ID=78079959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020071744A Pending JP2021168365A (ja) 2020-04-13 2020-04-13 板状物の加工方法

Country Status (4)

Country Link
JP (1) JP2021168365A (ko)
KR (1) KR20210127083A (ko)
CN (1) CN113524015A (ko)
TW (1) TW202138182A (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59174320A (ja) * 1983-03-24 1984-10-02 Yoshino Kogyosho Co Ltd 円状形シ−ト体の成形方法
JP2011249652A (ja) * 2010-05-28 2011-12-08 Disco Abrasive Syst Ltd ウェーハの平坦加工方法
JP2015518270A (ja) * 2012-03-20 2015-06-25 スリーエム イノベイティブ プロパティズ カンパニー 一時的基板支持体及び支持体分離のための積層体、方法、並びに材料

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5957330B2 (ja) 2012-08-01 2016-07-27 株式会社ディスコ ウェーハ貼着装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59174320A (ja) * 1983-03-24 1984-10-02 Yoshino Kogyosho Co Ltd 円状形シ−ト体の成形方法
JP2011249652A (ja) * 2010-05-28 2011-12-08 Disco Abrasive Syst Ltd ウェーハの平坦加工方法
JP2015518270A (ja) * 2012-03-20 2015-06-25 スリーエム イノベイティブ プロパティズ カンパニー 一時的基板支持体及び支持体分離のための積層体、方法、並びに材料

Also Published As

Publication number Publication date
TW202138182A (zh) 2021-10-16
KR20210127083A (ko) 2021-10-21
CN113524015A (zh) 2021-10-22

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