JP2021122882A - 切削装置 - Google Patents
切削装置 Download PDFInfo
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- JP2021122882A JP2021122882A JP2020016991A JP2020016991A JP2021122882A JP 2021122882 A JP2021122882 A JP 2021122882A JP 2020016991 A JP2020016991 A JP 2020016991A JP 2020016991 A JP2020016991 A JP 2020016991A JP 2021122882 A JP2021122882 A JP 2021122882A
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- carry
- transport pad
- Prior art date
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- 238000005520 cutting process Methods 0.000 title claims abstract description 172
- 238000003754 machining Methods 0.000 claims description 27
- 230000005484 gravity Effects 0.000 claims description 7
- 230000004308 accommodation Effects 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 description 18
- 239000007788 liquid Substances 0.000 description 11
- 239000002173 cutting fluid Substances 0.000 description 10
- 230000006870 function Effects 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 230000007723 transport mechanism Effects 0.000 description 6
- 238000003860 storage Methods 0.000 description 5
- 239000006061 abrasive grain Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/018—Holding the work by suction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/02—Means for holding or positioning work with clamping means
- B26D7/04—Means for holding or positioning work with clamping means providing adjustable clamping pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/02—Means for holding or positioning work with clamping means
Abstract
【解決手段】被加工物を切削する切削装置であって、該被加工物をスピンドルに装着された切削ブレードで切削する切削ユニットと、該切削ユニットを移動させる移動ユニットと、該被加工物を搬送できる搬送パッドと、該搬送パッドに接続され、引き上げ力を該搬送パッドに印加するカウンターバランス部と、を備え、該搬送パッドは、該移動ユニットに着脱され、該移動ユニットに装着された状態で該被加工物を吸引保持でき、該被加工物を吸引保持した状態で該移動ユニットにより移動されることで該被加工物の搬送を実施する。
【選択図】図1
Description
2 切削装置
4 装置基台
6 チャックテーブル
6a 保持面
8 切削ユニット
8a 切削ブレード
8b ノズル
10 カメラユニット
16 開口
18 X軸移動テーブル
20 防塵防滴カバー
22 支持構造
24,32 ガイドレール
26,34 移動プレート
28 ボールねじ
30,38 パルスモータ
40a 載置領域
40b 搬入出領域
40c 加工領域
40d 直上の領域
40e 搬出領域
40f 待機領域
42 アーム部
44 搬送パッド
46 被係合部
48 係合部
50 搬出ユニット
52 搬出テーブル
54 洗浄ノズル
56 乾燥ノズル
58 支持枠
58a 支持柱
58b 支持梁
60 カウンターバランス部
62 シリンダ
64 ピストンロッド
66 ロッド
68,70 接続部
68a 移動体
68b レール
72,74 軸
76 ピストン
78 内部空間
78a,78b 部屋
80 給気源
82 電磁弁
84,86 配管
88 調圧器
Claims (3)
- 被加工物を切削ブレードで切削する切削装置であって、
上方に露出した保持面を有し、該保持面上に載る該被加工物を保持するチャックテーブルと、
該チャックテーブルの該保持面上で保持された該被加工物をスピンドルに装着された該切削ブレードで切削する切削ユニットと、
該被加工物の切削が実施される加工領域と、該被加工物の搬入出が実施される搬入出領域と、の間で該チャックテーブルを該保持面に平行な加工送り方向に沿って移動させる加工送りユニットと、
該切削ユニットを該保持面と平行で該加工送り方向に垂直な割り出し送り方向と、該保持面に垂直な方向と、に移動させる移動ユニットと、
該搬入出領域に隣接し、切削前の該被加工物が載せられる載置領域と、
切削後の該被加工物を支持でき、該搬入出領域の直上の領域と、該搬入出領域に隣接する搬出領域と、の間を移動する搬出テーブルと、
該載置領域に載せられた切削前の該被加工物を該搬入出領域に位置する該チャックテーブルに搬送できるとともに、該チャックテーブルに載る切削後の該被加工物を該搬出テーブルに搬送できる搬送パッドと、
該搬送パッドに接続され、引き上げ力を該搬送パッドに印加するカウンターバランス部と、を備え、
該搬送パッドは、該搬入出領域に隣接する待機領域で該移動ユニットに着脱され、該移動ユニットに装着された状態で該被加工物を吸引保持でき、該被加工物を吸引保持した状態で該移動ユニットにより移動されることで該被加工物の搬送を実施できることを特徴とする切削装置。 - 該カウンターバランス部が該搬送パッドに印加する該引き上げ力の大きさは、該搬送パッドにかかる重力の大きさ以下であることを特徴とする請求項1記載の切削装置。
- 該カウンターバランス部は、
一端が該搬送パッドの上部に固定されており、ピストンロッドの一部を収容するとともに該ピストンロッドの収容長さが可変なシリンダを備え、
該シリンダへの該ピストンロッドの収容長さを変化させることで伸縮可能であることを特徴とする請求項1又は2記載の切削装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020016991A JP7412855B2 (ja) | 2020-02-04 | 2020-02-04 | 切削装置 |
US17/149,155 US11404303B2 (en) | 2020-02-04 | 2021-01-14 | Cutting apparatus for cutting workpiece with cutting blade |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020016991A JP7412855B2 (ja) | 2020-02-04 | 2020-02-04 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021122882A true JP2021122882A (ja) | 2021-08-30 |
JP7412855B2 JP7412855B2 (ja) | 2024-01-15 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020016991A Active JP7412855B2 (ja) | 2020-02-04 | 2020-02-04 | 切削装置 |
Country Status (2)
Country | Link |
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US (1) | US11404303B2 (ja) |
JP (1) | JP7412855B2 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5693771B1 (ja) | 2014-04-30 | 2015-04-01 | マキノジェイ株式会社 | ワーク搬送装置および加工システム |
JP2017054956A (ja) * | 2015-09-10 | 2017-03-16 | 株式会社ディスコ | 被加工物の支持治具 |
JP6973931B2 (ja) | 2017-12-25 | 2021-12-01 | 株式会社ディスコ | 切削装置 |
JP2019115962A (ja) * | 2017-12-27 | 2019-07-18 | 株式会社ディスコ | チャックテーブル修正方法及び切削装置 |
JP7126750B2 (ja) * | 2018-03-20 | 2022-08-29 | 株式会社ディスコ | 切削装置 |
JP7075808B2 (ja) * | 2018-04-20 | 2022-05-26 | 株式会社ディスコ | 切削装置 |
-
2020
- 2020-02-04 JP JP2020016991A patent/JP7412855B2/ja active Active
-
2021
- 2021-01-14 US US17/149,155 patent/US11404303B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20210237299A1 (en) | 2021-08-05 |
US11404303B2 (en) | 2022-08-02 |
JP7412855B2 (ja) | 2024-01-15 |
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