JP2021097110A - 磁性ペースト - Google Patents
磁性ペースト Download PDFInfo
- Publication number
- JP2021097110A JP2021097110A JP2019226740A JP2019226740A JP2021097110A JP 2021097110 A JP2021097110 A JP 2021097110A JP 2019226740 A JP2019226740 A JP 2019226740A JP 2019226740 A JP2019226740 A JP 2019226740A JP 2021097110 A JP2021097110 A JP 2021097110A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- mass
- magnetic
- magnetic paste
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000003822 epoxy resin Substances 0.000 claims abstract description 202
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 202
- 239000003085 diluting agent Substances 0.000 claims abstract description 63
- 239000004020 conductor Substances 0.000 claims abstract description 38
- 239000006247 magnetic powder Substances 0.000 claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 39
- 229910000859 α-Fe Inorganic materials 0.000 claims description 24
- 239000000843 powder Substances 0.000 claims description 23
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 16
- 238000011049 filling Methods 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 238000005498 polishing Methods 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 229910002551 Fe-Mn Inorganic materials 0.000 claims description 5
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 239000004848 polyfunctional curative Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 70
- -1 glycidyl ester Chemical class 0.000 description 50
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 33
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 33
- 239000000243 solution Substances 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 22
- 239000002184 metal Substances 0.000 description 22
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 21
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 21
- 229920003986 novolac Polymers 0.000 description 21
- 238000007747 plating Methods 0.000 description 21
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 19
- 239000000126 substance Substances 0.000 description 19
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 18
- 206010042674 Swelling Diseases 0.000 description 18
- 125000001931 aliphatic group Chemical group 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 230000008961 swelling Effects 0.000 description 18
- 239000002270 dispersing agent Substances 0.000 description 17
- 150000002148 esters Chemical group 0.000 description 17
- 230000000694 effects Effects 0.000 description 16
- 230000001588 bifunctional effect Effects 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 229910045601 alloy Inorganic materials 0.000 description 13
- 239000000956 alloy Substances 0.000 description 13
- 230000035699 permeability Effects 0.000 description 13
- 238000007788 roughening Methods 0.000 description 13
- 239000011701 zinc Substances 0.000 description 13
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 12
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 11
- 239000007787 solid Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 10
- 239000007788 liquid Substances 0.000 description 10
- 239000007800 oxidant agent Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 9
- 150000001412 amines Chemical class 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 125000003700 epoxy group Chemical group 0.000 description 8
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 7
- 150000008065 acid anhydrides Chemical class 0.000 description 7
- 239000000654 additive Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 239000007822 coupling agent Substances 0.000 description 7
- 125000004122 cyclic group Chemical group 0.000 description 7
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 230000003472 neutralizing effect Effects 0.000 description 7
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 6
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 6
- 229930003836 cresol Natural products 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000012756 surface treatment agent Substances 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000004305 biphenyl Substances 0.000 description 5
- 235000010290 biphenyl Nutrition 0.000 description 5
- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011258 core-shell material Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical class OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 4
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 229910000640 Fe alloy Inorganic materials 0.000 description 4
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 4
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 238000006386 neutralization reaction Methods 0.000 description 4
- 239000012766 organic filler Substances 0.000 description 4
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 3
- 150000005215 alkyl ethers Chemical class 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 239000004643 cyanate ester Substances 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 2
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
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- FVKFHMNJTHKMRX-UHFFFAOYSA-N 3,4,6,7,8,9-hexahydro-2H-pyrimido[1,2-a]pyrimidine Chemical compound C1CCN2CCCNC2=N1 FVKFHMNJTHKMRX-UHFFFAOYSA-N 0.000 description 2
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- 229910019142 PO4 Inorganic materials 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
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- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
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- 230000000996 additive effect Effects 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 150000003973 alkyl amines Chemical class 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 125000005037 alkyl phenyl group Chemical group 0.000 description 2
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- 125000000129 anionic group Chemical group 0.000 description 2
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- DEKLIKGLDMCMJG-UHFFFAOYSA-M decanoate;tetrabutylphosphanium Chemical compound CCCCCCCCCC([O-])=O.CCCC[P+](CCCC)(CCCC)CCCC DEKLIKGLDMCMJG-UHFFFAOYSA-M 0.000 description 2
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- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
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- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
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- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 235000013824 polyphenols Nutrition 0.000 description 2
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
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- 239000010937 tungsten Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- SDUWQMDIQSWWIE-UHFFFAOYSA-N (3-cyanato-5-methylidenecyclohexa-1,3-dien-1-yl) cyanate Chemical compound C=C1CC(OC#N)=CC(OC#N)=C1 SDUWQMDIQSWWIE-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
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- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- MZYHMUONCNKCHE-UHFFFAOYSA-N naphthalene-1,2,3,4-tetracarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=C(C(O)=O)C(C(O)=O)=C21 MZYHMUONCNKCHE-UHFFFAOYSA-N 0.000 description 1
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- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
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- 239000003960 organic solvent Substances 0.000 description 1
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- 125000003566 oxetanyl group Chemical group 0.000 description 1
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- PRCNQQRRDGMPKS-UHFFFAOYSA-N pentane-2,4-dione;zinc Chemical compound [Zn].CC(=O)CC(C)=O.CC(=O)CC(C)=O PRCNQQRRDGMPKS-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
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- 239000012286 potassium permanganate Substances 0.000 description 1
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- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- BTURAGWYSMTVOW-UHFFFAOYSA-M sodium dodecanoate Chemical compound [Na+].CCCCCCCCCCCC([O-])=O BTURAGWYSMTVOW-UHFFFAOYSA-M 0.000 description 1
- 229940082004 sodium laurate Drugs 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- GHPYAGKTTCKKDF-UHFFFAOYSA-M tetraphenylphosphanium;thiocyanate Chemical compound [S-]C#N.C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 GHPYAGKTTCKKDF-UHFFFAOYSA-M 0.000 description 1
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- 150000003568 thioethers Chemical class 0.000 description 1
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical class SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- AJSTXXYNEIHPMD-UHFFFAOYSA-N triethyl borate Chemical compound CCOB(OCC)OCC AJSTXXYNEIHPMD-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
- H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
- H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/0302—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity characterised by unspecified or heterogeneous hardness or specially adapted for magnetic hardness transitions
- H01F1/0311—Compounds
- H01F1/0313—Oxidic compounds
- H01F1/0315—Ferrites
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/147—Alloys characterised by their composition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/42—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of organic or organo-metallic materials, e.g. graphene
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
Abstract
Description
[1] (A)磁性粉体、
(B)エポキシ樹脂、
(C)反応性希釈剤、及び
(D)硬化剤、を含み、
(C)成分が、3官能以上の反応性希釈剤を含む、磁性ペースト。
[2] 3官能以上の反応性希釈剤の含有量が、磁性ペースト中の不揮発成分を100質量%としたとき、0.5質量%以上10質量%以下である、[1]に記載の磁性ペースト。
[3] 3官能以上の反応性希釈剤の含有量が、(C)成分全体を100質量%としたとき、20質量%以上である、[1]又は[2]に記載の磁性ペースト。
[4] (A)成分が、軟磁性粉体である、[1]〜[3]のいずれかに記載の磁性ペースト。
[5] (A)成分が、酸化鉄粉である、[1]〜[4]のいずれかに記載の磁性ペースト。
[6] 酸化鉄粉が、Ni、Cu、Mn、及びZnから選ばれる少なくとも1種を含むフェライトである、[5]に記載の磁性ペースト。
[7] (A)成分が、Fe−Mn系フェライト、及びFe−Mn−Zn系フェライトから選ばれる少なくとも1種である、[1]〜[6]のいずれかに記載の磁性ペースト。
[8] (A)成分の含有量が、磁性ペースト中の不揮発成分を100質量%としたとき、60質量%以上である、[1]〜[7]のいずれかに記載の磁性ペースト。
[9] スルーホール充填用である、[1]〜[8]のいずれかに記載の磁性ペースト。
[10] [1]〜[9]のいずれかに記載の磁性ペーストの硬化物によりスルーホールが充填されている基板を含む、回路基板。
[11] [10]に記載の回路基板を含むインダクタ基板。
[12](1)スルーホールに磁性ペーストを充填し、該磁性ペーストを熱硬化させ、硬化物を得る工程、
(2)硬化物の表面を研磨する工程、
(3)硬化物を研磨した面をデスミア処理する工程、及び
(4)硬化物を研磨した面に導体層を形成する工程、を含み、
磁性ペーストが、[1]〜[9]のいずれかに記載の磁性ペーストである、回路基板の製造方法。
本発明の磁性ペーストは、(A)磁性粉体、(B)エポキシ樹脂、(C)反応性希釈剤、及び(D)硬化剤、を含み、(C)成分が3官能以上の反応性希釈剤を含む。
磁性ペーストは、(A)成分として(A)磁性粉体を含有する。(A)磁性粉体を磁性ペーストに含有させることでその硬化物の比透磁率を向上させることが可能となる。(A)磁性粉体は1種単独で用いてもよく、又は2種以上を併用してもよい。
磁性ペーストは、(B)エポキシ樹脂を含有する。但し、(B)成分は(C)反応性希釈剤に該当するものは除く。(B)成分は1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
磁性ペーストは、(C)反応性希釈剤を含む。本発明では、(C)成分として3官能以上の反応性希釈剤を含む。一般に、磁性ペースト中の(A)磁性粉体の含有量が高くなるほど、本発明の課題である、デスミア耐性の低下、及び磁性層と導体層との密着性の低下が顕著になるが、本発明の磁性ペーストにおいては、3官能以上の反応性希釈剤を磁性ペーストに含有させることで、(A)磁性粉体の含有量が多くても、デスミア耐性及び磁性層と導体層との間の密着性が向上した硬化物を得ることが可能である。(C)成分は1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
磁性ペーストは、(D)硬化剤を含有する。(D)硬化剤には、(B)エポキシ樹脂を硬化する機能を有するエポキシ樹脂硬化剤と、(B)エポキシ樹脂の硬化速度を促進させる機能を有する硬化促進剤とがある。磁性ペーストは、(D)硬化剤として、エポキシ樹脂硬化剤及び硬化促進剤のいずれかを含むことが好ましく、硬化促進剤を含むことがより好ましい。
エポキシ樹脂硬化剤としては、例えば、酸無水物系エポキシ樹脂硬化剤、フェノール系エポキシ樹脂硬化剤、ナフトール系エポキシ樹脂硬化剤、活性エステル系エポキシ樹脂硬化剤、ベンゾオキサジン系エポキシ樹脂硬化剤、及びシアネートエステル系エポキシ樹脂硬化剤、アミン系エポキシ樹脂硬化剤が挙げられる。エポキシ樹脂硬化剤としては、磁性ペーストの粘度を低下させる観点から、酸無水物系エポキシ樹脂硬化剤が好ましい。エポキシ樹脂硬化剤は1種単独で用いてもよく、又は2種以上を併用してもよい。
硬化促進剤としては、例えば、アミン系硬化促進剤、イミダゾール系硬化促進剤、リン系硬化促進剤、グアニジン系硬化促進剤、金属系硬化促進剤等が挙げられる。硬化促進剤は1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
磁性ペーストは、任意の成分として、さらに(E)分散剤を含んでいてもよい。
磁性ペーストは、さらに必要に応じて、(F)その他の添加剤を含んでいてもよく、斯かる他の添加剤としては、例えば、熱可塑性樹脂、保存安定性向上のためのホウ酸トリエチル等の硬化遅延剤、無機充填材(但し、磁性粉体に該当するものは除く)、難燃剤、有機充填材、有機銅化合物、有機亜鉛化合物及び有機コバルト化合物等の有機金属化合物、並びに増粘剤、消泡剤、レベリング剤、密着性付与剤、及び着色剤等の樹脂添加剤等が挙げられる。
磁性ペーストは、例えば、配合成分を、3本ロール、回転ミキサーなどの撹拌装置を用いて撹拌する方法によって製造できる。(A)〜(F)成分の混合順等は任意である。
磁性ペーストの硬化物は、デスミア処理を行っても膨れが生じないため、めっき層との間のめっき密着性に優れるという特性を示す。よって、前記硬化物は、めっき層との間のピール強度に優れる磁性層をもたらす。めっき密着性の表すピール強度としては、好ましくは0.1kgf/cm以上、より好ましくは0.15kgf/cm以上、さらに好ましくは0.2kgf/cm以上である。上限は特に限定されないが、1.0kgf/cm以下等とし得る。ピール強度は、後述する実施例に記載の方法で測定できる。
回路基板は、本発明の磁性ペーストの硬化物によりスルーホールが充填されている基板を含む。回路基板は、本発明の磁性ペーストを用いるのでデスミア耐性に優れ、その結果、所望の形状の磁性層を得ることが可能となる。また、本発明の磁性ペーストは、適度な粘度を有することから、スルーホールへの充填性に優れる。
(1)スルーホールに磁性ペーストを充填し、該磁性ペーストを熱硬化させ、硬化物を得る工程。
(2)硬化物の表面を研磨する工程。
(3)硬化物を研磨した面をデスミア処理(粗化処理)する工程。
(4)硬化物を研磨した面に導体層を形成する工程。
インダクタ基板は、本発明の回路基板を含む。このようなインダクタ基板は、前記の磁性ペーストの硬化物の周囲の少なくとも一部に導体によって形成されたインダクタパターンを有する。このようなインダクタ基板は、例えば特開2016−197624号公報に記載のものを適用できる。
エポキシ樹脂(「ZX−1059」、ビスフェノールA型エポキシ樹脂とビスフェノールF型エポキシ樹脂の混合品、日鉄ケミカル&マテリアル社製)12質量部、コアシェル分散エポキシ樹脂(「MX−153」、コアシェル構造を有する有機フィラーを含むビスフェノールA型エポキシ樹脂、有機フィラーの含有量33質量%、平均粒径0.2μm、カネカ社製)5質量部、3官能以上の反応性希釈剤(「EX−321L」、脂肪族トリグリシジルエ−テル、ナガセケムテックス社製)5質量部、分散剤(「RS−710」、リン酸エステル系分散剤、東邦化学社製)1質量部、硬化剤(「2MZA−PW」、イミダゾール系硬化促進剤、四国化成社製)1質量部、磁性粉体(「M05S」、Fe−Mn系フェライト、平均粒径3μm、パウダーテック社製)120質量部を混合し、3本ロールで均一に分散して、磁性ペースト1を調製した。
実施例1において、
3官能以上の反応性希釈剤(「EX−321L」、脂肪族トリグリシジルエ−テル、ナガセケムテックス社製)の量を5質量部から4質量に変え、
2官能以下の反応性希釈剤(「ZX−1658GS」、環状脂肪族ジグリシジルエ−テル、日鉄ケミカル&マテリアル社製)1質量部をさらに用いた。
以上の事項以外は実施例1と同様にして磁性ペースト2を調製した。
実施例2において、
2官能以下の反応性希釈剤(「ZX−1658GS」、環状脂肪族ジグリシジルエ−テル、日鉄ケミカル&マテリアル社製)の量を1質量部から2質量部に変え、
3官能以上の反応性希釈剤(「EX−321L」、脂肪族トリグリシジルエ−テル、ナガセケムテックス社製)の量を4質量部から3質量に変えた。
以上の事項以外は実施例2と同様にして磁性ペースト3を調製した。
実施例2において、
2官能以下の反応性希釈剤(「ZX−1658GS」、環状脂肪族ジグリシジルエ−テル、日鉄ケミカル&マテリアル社製)の量を1質量部から3質量部に変え、
3官能以上の反応性希釈剤(「EX−321L」、脂肪族トリグリシジルエ−テル、ナガセケムテックス社製)の量を4質量部から2質量に変えた。
以上の事項以外は実施例2と同様にして磁性ペースト4を調製した。
実施例2において、
2官能以下の反応性希釈剤(「ZX−1658GS」、環状脂肪族ジグリシジルエ−テル、日鉄ケミカル&マテリアル社製)の量を1質量部から4質量部に変え、
3官能以上の反応性希釈剤(「EX−321L」、脂肪族トリグリシジルエ−テル、ナガセケムテックス社製)の量を4質量部から1質量に変えた。
以上の事項以外は実施例2と同様にして磁性ペースト5を調製した。
実施例1において、
3官能以上の反応性希釈剤(「EX−321L」、脂肪族トリグリシジルエ−テル、ナガセケムテックス社製)5質量部を、3官能以上の反応性希釈剤(「PETG」、環状脂肪族テトラグリシジルエ−テル、昭和電工社製)5質量部に変えた。以上の事項以外は実施例1と同様にして磁性ペースト6を調製した。
実施例1において、
エポキシ樹脂(「ZX−1059」、ビスフェノールA型エポキシ樹脂とビスフェノールF型エポキシ樹脂の混合品、日鉄ケミカル&マテリアル社製)の量を12質量部から10質量部に変え、
3官能以上の反応性希釈剤(「EX−321L」、脂肪族トリグリシジルエ−テル、ナガセケムテックス社製)の量を5質量部から7質量に変えた。
以上の事項以外は実施例1と同様にして磁性ペースト7を調製した。
実施例1において、
エポキシ樹脂(「ZX−1059」、ビスフェノールA型エポキシ樹脂とビスフェノールF型エポキシ樹脂の混合品、日鉄ケミカル&マテリアル社製)の量を12質量部から3質量部に変え、
3官能以上の反応性希釈剤(「EX−321L」、脂肪族トリグリシジルエ−テル、ナガセケムテックス社製)の量を5質量部から14質量に変えた。
以上の事項以外は実施例1と同様にして磁性ペースト8を調製した。
実施例2において、
2官能以下の反応性希釈剤(「ZX−1658GS」、環状脂肪族ジグリシジルエ−テル、日鉄ケミカル&マテリアル社製)の量を1質量部から5質量部に変え、
3官能以上の反応性希釈剤(「EX−321L」、脂肪族トリグリシジルエ−テル、ナガセケムテックス社製)4質量部を用いなかった。
以上の事項以外は実施例2と同様にして磁性ペースト9を調製した。
実施例6において、3官能以上の反応性希釈剤(「PETG」、環状脂肪族テトラグリシジルエ−テル、昭和電工社製)5質量部を、2官能以下の反応性希釈剤(「EX−201L」、環状脂肪族ジグリシジルエ−テル、ナガセケムテックス社製)5質量部に変えた。以上の事項以外は実施例6と同様にして磁性ペースト10を調製した。
支持体として、シリコーン系離型剤処理を施したポリエチレンテレフタレート(PET)フィルム(リンテック社製「PET501010」、厚さ50μm)を用意した。各実施例及び各比較例で作製した磁性ペースト1〜8を上記PETフィルムの離型面上に、乾燥後のペースト層の厚みが100μmとなるよう、ドクターブレードにて均一に塗布し、樹脂シートを得た。得られた樹脂シートを190℃で90分間加熱することによりペースト層を熱硬化し、支持体を剥離することによりシート状の硬化物を得た。得られた硬化物を、幅5mm、長さ18mmの試験片に切断し、評価サンプルとした。この評価サンプルを、アジレントテクノロジーズ(Agilent Technologies社製、「HP8362B」)を用いて、3ターンコイル法にて測定周波数を100MHzとし、室温23℃にて比透磁率(μ’)及び磁性損失(μ’’)を測定した。
内層基板として、ガラス布基材エポキシ樹脂両面銅張積層板(銅箔の厚さ18μm、基板厚み0.3mm、パナソニック社製R5715ES)の両面をマイクロエッチング剤(メック社製CZ8100)にて1μmエッチングして銅表面の粗化処理を行ったものを用意した。
積層板Aを、非接触型表面粗さ計(ビーコインスツルメンツ社製WYKO NT3300)を用いて、VSIモード、50倍レンズにより測定範囲を121μm×92μmとして得られる数値によりRa値を求めた。Ra値は、無作為に選んだ3点の平均値を求めることにより測定し、以下の基準で評価した。
○:Ra値が700nm以下
△:Ra値が700nmを超え1000nm未満
×:Ra値が1000nm以上
11 支持基板
12 第1金属層
13 第2金属層
14 スルーホール
20 磁性ペースト
20A 磁性層
Claims (12)
- (A)磁性粉体、
(B)エポキシ樹脂、
(C)反応性希釈剤、及び
(D)硬化剤、を含み、
(C)成分が、3官能以上の反応性希釈剤を含む、磁性ペースト。 - 3官能以上の反応性希釈剤の含有量が、磁性ペースト中の不揮発成分を100質量%としたとき、0.5質量%以上10質量%以下である、請求項1に記載の磁性ペースト。
- 3官能以上の反応性希釈剤の含有量が、(C)成分全体を100質量%としたとき、20質量%以上である、請求項1又は2に記載の磁性ペースト。
- (A)成分が、軟磁性粉体である、請求項1〜3のいずれか1項に記載の磁性ペースト。
- (A)成分が、酸化鉄粉である、請求項1〜4のいずれか1項に記載の磁性ペースト。
- 酸化鉄粉が、Ni、Cu、Mn、及びZnから選ばれる少なくとも1種を含むフェライトである、請求項5に記載の磁性ペースト。
- (A)成分が、Fe−Mn系フェライト、及びFe−Mn−Zn系フェライトから選ばれる少なくとも1種である、請求項1〜6のいずれか1項に記載の磁性ペースト。
- (A)成分の含有量が、磁性ペースト中の不揮発成分を100質量%としたとき、60質量%以上である、請求項1〜7のいずれか1項に記載の磁性ペースト。
- スルーホール充填用である、請求項1〜8のいずれか1項に記載の磁性ペースト。
- 請求項1〜9のいずれか1項に記載の磁性ペーストの硬化物によりスルーホールが充填されている基板を含む、回路基板。
- 請求項10に記載の回路基板を含むインダクタ基板。
- (1)スルーホールに磁性ペーストを充填し、該磁性ペーストを熱硬化させ、硬化物を得る工程、
(2)硬化物の表面を研磨する工程、
(3)硬化物を研磨した面をデスミア処理する工程、及び
(4)硬化物を研磨した面に導体層を形成する工程、を含み、
磁性ペーストが、請求項1〜9のいずれか1項に記載の磁性ペーストである、回路基板の製造方法。
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