JP2021086992A - 支持構造、及び支持具のセット - Google Patents
支持構造、及び支持具のセット Download PDFInfo
- Publication number
- JP2021086992A JP2021086992A JP2019217177A JP2019217177A JP2021086992A JP 2021086992 A JP2021086992 A JP 2021086992A JP 2019217177 A JP2019217177 A JP 2019217177A JP 2019217177 A JP2019217177 A JP 2019217177A JP 2021086992 A JP2021086992 A JP 2021086992A
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- JP
- Japan
- Prior art keywords
- support
- pressing
- axis direction
- parts
- portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000149 penetrating effect Effects 0.000 claims description 25
- 230000003014 reinforcing effect Effects 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 21
- 238000010276 construction Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 13
- 238000003780 insertion Methods 0.000 description 12
- 230000037431 insertion Effects 0.000 description 12
- 239000002184 metal Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M13/00—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles
- F16M13/02—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B2/00—Friction-grip releasable fastenings
- F16B2/20—Clips, i.e. with gripping action effected solely by the inherent resistance to deformation of the material of the fastening
- F16B2/22—Clips, i.e. with gripping action effected solely by the inherent resistance to deformation of the material of the fastening of resilient material, e.g. rubbery material
- F16B2/24—Clips, i.e. with gripping action effected solely by the inherent resistance to deformation of the material of the fastening of resilient material, e.g. rubbery material of metal
- F16B2/241—Clips, i.e. with gripping action effected solely by the inherent resistance to deformation of the material of the fastening of resilient material, e.g. rubbery material of metal of sheet metal
- F16B2/245—Clips, i.e. with gripping action effected solely by the inherent resistance to deformation of the material of the fastening of resilient material, e.g. rubbery material of metal of sheet metal external, i.e. with contracting action
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
Abstract
Description
Claims (8)
- 構造体の実装面に実装された部品を前記実装面側に押圧して支持する支持構造であって、
前記部品を前記実装面側に押圧して支持するために用いられる第1の支持具及び第2の支持具と、
前記構造体に設けられ、前記第1の支持具及び前記第2の支持具を固定する固定部と、を備え、
前記第1の支持具及び前記第2の支持具は、同一の前記固定部に固定される、支持構造。 - 前記第1の支持具及び前記第2の支持具のセットは、複数の前記部品を押圧する複数の押圧部を有する、請求項1に記載の支持構造。
- 前記第1の支持具及び前記第2の支持具の少なくとも一方は、
前記部品を押圧する押圧部と、
前記押圧部とは別方向に延びて、支持具としての強度を高める補強部と、を有する、請求項1又は2に記載の支持構造。 - 前記構造体に設けられ、前記第1の支持具及び前記第2の支持具の位置決めを行う位置決め突起を更に備え、
前記第1の支持具及び前記第2の支持具は、同一の前記位置決め突起を挿入させる位置決め孔をそれぞれ有する、請求項1〜3の何れか一項に記載の支持構造。 - 前記第1の支持具及び前記第2の支持具の少なくとも一方には、押圧した状態の前記部品を確認可能な貫通部が形成される、請求項1〜4の何れか一項に記載の支持構造。
- 前記第1の支持具及び前記第2の支持具は、互いに重ね合わせることによって、前記部品を押圧する際の強度を補強する、請求項1〜5の何れか一項に記載の支持構造。
- 前記第1の支持具と前記第2の支持具とは、互いに異なる素材によって形成される、請求項1〜6の何れか一項に記載の支持構造。
- 構造体の実装面に実装された部品を前記実装面側に押圧して支持する支持具のセットであって、
前記部品を前記実装面側に押圧して支持するために用いられる第1の支持具及び第2の支持具を備え、
前記第1の支持具及び前記第2の支持具は、互いに重ね合わせた状態で、前記構造体に設けられた同一の固定部に固定される固定構造を有する、支持具のセット。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019217177A JP7392430B2 (ja) | 2019-11-29 | 2019-11-29 | 支持構造、及び支持具のセット |
US17/101,233 US11499669B2 (en) | 2019-11-29 | 2020-11-23 | Support structure and support tool set |
EP20209781.2A EP3829283A1 (en) | 2019-11-29 | 2020-11-25 | Support structure and support tool set |
CN202011346311.5A CN112888234B (zh) | 2019-11-29 | 2020-11-26 | 支撑结构以及支撑件组 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019217177A JP7392430B2 (ja) | 2019-11-29 | 2019-11-29 | 支持構造、及び支持具のセット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021086992A true JP2021086992A (ja) | 2021-06-03 |
JP7392430B2 JP7392430B2 (ja) | 2023-12-06 |
Family
ID=73597923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019217177A Active JP7392430B2 (ja) | 2019-11-29 | 2019-11-29 | 支持構造、及び支持具のセット |
Country Status (4)
Country | Link |
---|---|
US (1) | US11499669B2 (ja) |
EP (1) | EP3829283A1 (ja) |
JP (1) | JP7392430B2 (ja) |
CN (1) | CN112888234B (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001060778A (ja) * | 1999-06-11 | 2001-03-06 | Thomas & Betts Corp <T&B> | Lgaクランプ機構 |
JP2013074138A (ja) * | 2011-09-28 | 2013-04-22 | Keihin Corp | 半導体制御装置 |
JP2014049586A (ja) * | 2012-08-31 | 2014-03-17 | Toyota Industries Corp | 半導体モジュールを固定するために用いられる板バネ押圧部材および半導体装置 |
JP2016063200A (ja) * | 2014-09-22 | 2016-04-25 | Tdk株式会社 | 基板実装構造及び電源装置 |
WO2019215805A1 (ja) * | 2018-05-08 | 2019-11-14 | 三菱電機株式会社 | 締結構造体および締結構造体を用いた電力変換装置 |
Family Cites Families (15)
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FR2740188B1 (fr) * | 1995-10-24 | 1997-11-28 | Valeo | Module d'embrayage comportant des moyens perfectionnes pour sa fixation |
US6478622B1 (en) * | 2001-11-27 | 2002-11-12 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
US7686250B2 (en) * | 2006-01-20 | 2010-03-30 | Fortes Hugo L | Electronic display mount |
WO2007108184A1 (ja) * | 2006-03-20 | 2007-09-27 | Mitsubishi Electric Corporation | 仮止め装置 |
CN200990038Y (zh) * | 2006-12-22 | 2007-12-12 | 鸿富锦精密工业(深圳)有限公司 | 电脑机箱 |
CN101728686A (zh) * | 2008-10-21 | 2010-06-09 | 鸿富锦精密工业(深圳)有限公司 | 连接器 |
US8188829B2 (en) * | 2008-12-26 | 2012-05-29 | Tdk Corporation | Coil substrate structure, substrate holding structure, and switching power supply |
JP5120245B2 (ja) | 2008-12-26 | 2013-01-16 | Tdk株式会社 | 基板保持構造及びスイッチング電源装置 |
CN102918450B (zh) * | 2010-05-31 | 2015-07-29 | Nec显示器解决方案株式会社 | 显示面板的固定构造及固定方法 |
SG177017A1 (en) * | 2010-06-09 | 2012-01-30 | 3M Innovative Properties Co | Emi gasket |
CN102684011B (zh) * | 2011-03-15 | 2017-03-01 | 湖南城市学院 | Usb接头固定装置 |
CN103199394A (zh) * | 2012-01-06 | 2013-07-10 | 鸿富锦精密工业(武汉)有限公司 | 连接器安装装置 |
CN103687400A (zh) * | 2012-08-31 | 2014-03-26 | 深圳市海洋王照明工程有限公司 | 用于固定电子元件的构件 |
JP6182474B2 (ja) * | 2014-02-13 | 2017-08-16 | オムロンオートモーティブエレクトロニクス株式会社 | 電子部品の固定構造および固定方法 |
JP7333309B2 (ja) * | 2017-04-27 | 2023-08-24 | マグスウィッチ テクノロジー ワールドワイド プロプライエタリー リミテッド | センサ構成及び消磁機能のうちの少なくとも一方を備えた磁気結合デバイス |
-
2019
- 2019-11-29 JP JP2019217177A patent/JP7392430B2/ja active Active
-
2020
- 2020-11-23 US US17/101,233 patent/US11499669B2/en active Active
- 2020-11-25 EP EP20209781.2A patent/EP3829283A1/en active Pending
- 2020-11-26 CN CN202011346311.5A patent/CN112888234B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001060778A (ja) * | 1999-06-11 | 2001-03-06 | Thomas & Betts Corp <T&B> | Lgaクランプ機構 |
JP2013074138A (ja) * | 2011-09-28 | 2013-04-22 | Keihin Corp | 半導体制御装置 |
JP2014049586A (ja) * | 2012-08-31 | 2014-03-17 | Toyota Industries Corp | 半導体モジュールを固定するために用いられる板バネ押圧部材および半導体装置 |
JP2016063200A (ja) * | 2014-09-22 | 2016-04-25 | Tdk株式会社 | 基板実装構造及び電源装置 |
WO2019215805A1 (ja) * | 2018-05-08 | 2019-11-14 | 三菱電機株式会社 | 締結構造体および締結構造体を用いた電力変換装置 |
Also Published As
Publication number | Publication date |
---|---|
EP3829283A1 (en) | 2021-06-02 |
JP7392430B2 (ja) | 2023-12-06 |
CN112888234B (zh) | 2022-07-15 |
CN112888234A (zh) | 2021-06-01 |
US11499669B2 (en) | 2022-11-15 |
US20210164608A1 (en) | 2021-06-03 |
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