JP2021073325A - 熱硬化性樹脂組成物及びこれを用いたプリプレグ、積層シート、並びに印刷回路基板 - Google Patents
熱硬化性樹脂組成物及びこれを用いたプリプレグ、積層シート、並びに印刷回路基板 Download PDFInfo
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- JP2021073325A JP2021073325A JP2020207650A JP2020207650A JP2021073325A JP 2021073325 A JP2021073325 A JP 2021073325A JP 2020207650 A JP2020207650 A JP 2020207650A JP 2020207650 A JP2020207650 A JP 2020207650A JP 2021073325 A JP2021073325 A JP 2021073325A
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- 239000006096 absorbing agent Substances 0.000 description 1
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- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
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- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 1
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- VNZQQAVATKSIBR-UHFFFAOYSA-L copper;octanoate Chemical compound [Cu+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O VNZQQAVATKSIBR-UHFFFAOYSA-L 0.000 description 1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
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- 230000001771 impaired effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
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- FRCAGVUKJQCWBD-UHFFFAOYSA-L iodine green Chemical compound [Cl-].[Cl-].C1=CC(N(C)C)=CC=C1C(\C=1C=CC(=CC=1)[N+](C)(C)C)=C/1C=C(C)C(=[N+](C)C)C=C\1 FRCAGVUKJQCWBD-UHFFFAOYSA-L 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
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- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 1
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- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- UIEKYBOPAVTZKW-UHFFFAOYSA-L naphthalene-2-carboxylate;nickel(2+) Chemical compound [Ni+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 UIEKYBOPAVTZKW-UHFFFAOYSA-L 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-M octanoate Chemical compound CCCCCCCC([O-])=O WWZKQHOCKIZLMA-UHFFFAOYSA-M 0.000 description 1
- XZZXKVYTWCYOQX-UHFFFAOYSA-J octanoate;tin(4+) Chemical compound [Sn+4].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O XZZXKVYTWCYOQX-UHFFFAOYSA-J 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
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- 229920002492 poly(sulfone) Polymers 0.000 description 1
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- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
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- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical class S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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- 238000010998 test method Methods 0.000 description 1
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- 230000001131 transforming effect Effects 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
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- 239000002759 woven fabric Substances 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
- C08G65/485—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
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Abstract
Description
従って、高周波数印刷回路基板の絶縁層に使用するためには、誘電率と誘電損失因子(誘電損失)が低い物質を使用することが求められている。このような要求に応えて低誘電性高分子材料を実現するため、エポキシ樹脂の水酸基の低減、熱可塑性樹脂の架橋化方案、液晶高分子やポリイミドの使用などを適用した高周波用基板材料の開発が行われているが、それだけでは、高周波特性を満たす誘電特性が得られておらず、又は、基板の成形に難しさがある。
本発明に係る熱硬化性樹脂組成物は、非エポキシ系の熱硬化性樹脂組成物であって、(a)分子鎖の両末端にビニル基及びアリル基からなる群から選択される不飽和置換基を2つ以上有するポリフェニレンエーテル又はそのオリゴマー;(b)3種以上の架橋結合性硬化剤;及び(c)難燃剤を含む。また、前記熱硬化性樹脂組成物は、ビニル基含有シランカップリング剤で表面処理が施された無機フィラーをさらに含むことができる。なお、必要に応じて、硬化促進剤、開始剤(例えば、ラジカル開始剤)などをさらに含むこともできる。
本発明に係る熱硬化性樹脂組成物は、ポリフェニレンエーテル(PPE)又はそのオリゴマーを含む。前記PPE又はそのオリゴマーは、分子鎖の両末端に2つ以上のビニル基、アリル基又はその両方を有するものであり、その構造は、特に限定されない。
本発明に係る熱硬化性樹脂組成物は、3種以上の互いに異なる架橋結合性硬化剤を含む。
一例としては、前記架橋結合性硬化剤として、炭化水素系架橋剤(b1)、3つ以上の官能基を含有する架橋剤(b2)及びブロック構造のゴム(b3)を混用して使用することができる。
本発明に係る熱硬化性樹脂組成物は、難燃剤(c)を含む。
本発明に係る熱硬化性樹脂組成物は、ビニル基含有シランカップリング剤で表面処理が施された無機フィラーを含むことができる。
その中で、低い熱膨張係数を示す溶融シリカが好ましく使用される。
使用可能な反応開始剤としては、例えば、α,α’−ビス(t−ブチルペルオキシ−m−イソプロピル)ベンゼン、2,5−ジメチルー2,5−ジ(t−ブチルペルオキシ)−3−ヘキシン、ベンゾイルペルオキシド、3,3’,5,5’−テトラメチル−1,4−ジフェノキシキノン、クロラニル、2,4,6−トリ−t−ブチルフェノキシル、t−ブチルペルオキシイソプロピルモノカーボネート、アゾビスイソブチロニトリル(azobisisobutylonitrile)などが挙げられるが、これらに制限されない。さらに、金属カルボキシレート塩を使用することもできる。
本発明のプリプレグは、ビニル基含有シランカップリング剤で表面処理が施された繊維基材;及び繊維基材に含浸された上述の熱硬化性樹脂組成物を含む。なお、前記熱硬化性樹脂組成物は、溶媒に溶解又は分散された樹脂ワニスの形態であることもできる。
本発明に係る積層シートは、金属箔又は高分子フィルム基材;及び前記基材の片面又は両面上に形成され、前記熱硬化性樹脂組成物が硬化された樹脂層を含む。
本発明は、上述のプリプレグ(prepreg)2つ以上を重ね合わせた後、通常の条件で加熱及び加圧して形成される積層板を含む。
1−1.熱硬化性樹脂組成物の製造
下記の表1に示される組成によって前記ポリフェニレンエーテルをトルエンに溶解した後、2種以上の架橋結合性硬化剤、難燃剤及び無機フィラーを混合し、3時間攪拌した後、開始剤を添加し、さらに1時間攪拌して熱硬化性樹脂組成物を製造した。表1中、各組成物の使用量単位は、重量部である。
上記で製造された樹脂組成物を、ビニル基含有シランカップリング剤で表面処理されたガラス繊維に含浸させた後、165℃で約3〜10分間乾燥してプリプレグを製造した。
その後、プリプレグを1ply積層した後、プレスして0.1mm厚さの積層薄板を製造した。
下記の表2に示される組成で製造する以外は、上述の実施例と同様にして樹脂組成物、プリプレグ及び印刷回路基板を製造した。表2中、各組成物の使用量単位は、重量部である。
実施例1〜3及び比較例1〜6で得られた印刷回路基板について、下記の実験を行い、その結果を表3に示す。
TA Instruments社のDSC 2010及びDSC 2910で測定した。DSC測定で約5mg程度のサンプルを10/minの速度で300℃まで加熱した後、10/minの速度で30℃まで冷却した。このような最初の加熱・冷却の過程を2回にわたって同様に行った。
TMAガラス転移温度測定:銅箔積層板を銅エッチング液に含浸して銅箔を除去した評価基板として各辺5mmの評価基板を製造し、TMA試験装置(TA Instruments、Q400)を用いて評価基板の熱膨張特性を観察することで評価した。
IPC TM−650 2.4.13評価規格に従ってSolder 288で印刷回路基板をフローティングし、絶縁層と銅箔、絶縁層と金属コア、或いは絶縁層間の分離現象が生じる時点までの時間を測定して評価した。
銅箔積層板を銅エッチング液に含浸して銅箔を除去した評価基板を製造し、圧力釜実験装置(ESPEC、EHS−411MD)を用いて、121℃、0.2MPaの条件まで4時間放置後、Solder 288で印刷回路基板を10秒間隔でディッピング(dipping)し、絶縁層と銅箔、絶縁層と金属コア、或いは絶縁層間の分離現象が生じる時点までの時間を測定して評価した。
銅箔積層板を銅エッチング液に含浸して銅箔を除去した基板を用いて、比誘電率測定装置(RF Impedence/Material Analyzer;Agilent)で、周波数1GHzでの比誘電率及び誘電正接を測定した。
銅箔積層板を銅エッチング液に含浸して銅箔を除去した評価基板から、長さ127mm、幅12.7mmの評価基板を製作し、UL94の試験法(V法)に基づいて評価した。
IPC−TM−650 2.4.8の評価規則に従って印刷回路基板に形成されたパターンを、90’方向から引き上げて回路パターン(銅箔)の剥離時点を測定して評価した。
Claims (26)
- (a)分子鎖の両末端にビニル基、アリル基、又はメタクリロイルオキシ基からなる群から選択される不飽和置換基を2つ以上有するポリフェニレンエーテル又はそのオリゴマー;および
(b)3種以上の互いに異なる架橋結合性硬化剤;を含み、前記3種以上の異なる架橋結合性硬化剤は、炭化水素系架橋結合性硬化剤(但し、スチレン−ブタジエンブロック構造であるものを除く)、3つ以上の官能基を含有する架橋結合性硬化剤(但し、炭化水素系架橋結合性硬化剤、及びスチレン−ブタジエンブロック構造であるものを除く)及びスチレン−ブタジエンブロック構造の架橋結合性硬化剤を含み;更に、
(c)難燃剤を含み、
周波数1GHzでの誘電率(Dk)が3.63以下である、高周波用熱硬化性樹脂組成物。 - ビニル基含有シランカップリング剤で表面処理が施された無機フィラーをさらに含むことを特徴とする請求項1に記載の高周波用熱硬化性樹脂組成物。
- 前記3つ以上の官能基を含有する架橋結合性硬化剤及び前記スチレン−ブタジエンブロック構造の架橋結合性硬化剤の含量は、それぞれ、樹脂組成物の全重量を基準にして、1.65〜15重量%の範囲であることを特徴とする請求項1に記載の高周波用熱硬化性樹脂組成物。
- 前記3つ以上の官能基を含有する架橋結合性硬化剤及び前記スチレン−ブタジエンブロック構造の架橋結合性硬化剤の使用比率は、1〜20:1重量比であることを特徴とする請求項1に記載の高周波用熱硬化性樹脂組成物。
- 前記ポリフェニレンエーテル樹脂(a)は、数平均分子量が1,000〜10,000の範囲であることを特徴とする請求項1に記載の高周波用熱硬化性樹脂組成物。
- 前記ポリフェニレンエーテル樹脂(a)の分子量分布は、3以下(Mw/Mn≦3)であることを特徴とする請求項1に記載の高周波用熱硬化性樹脂組成物。
- 前記3つ以上の官能基を含有する架橋結合性硬化剤は、トリアリルイソシアヌレート(triallyl isocyanurate、TAIC)及び1,2,4−トリビニルシクロヘキサン(1,2,4−trivinyl cyclohexane、TVCH)からなる群から選択されるものであることを特徴とする請求項1に高周波用記載の熱硬化性樹脂組成物。
- 前記スチレン−ブタジエンブロック構造の架橋結合性硬化剤は、スチレン−ブタジエン、及びアクリロニトリル−ブタジエン−スチレンブロック共重合体からなる群から選択されるものであることを特徴とする請求項1に記載の高周波用熱硬化性樹脂組成物。
- 前記架橋結合性硬化剤(b)の含量は、樹脂組成物の全重量を基準にして、5〜40重量%の範囲であることを特徴とする請求項1に記載の高周波用熱硬化性樹脂組成物。
- 前記架橋結合性硬化剤は、二重結合又は三重結合を有している炭化水素系架橋結合性硬化剤(但し、スチレン−ブタジエンブロック構造であるものを除く)を含むことを特徴とする請求項1に記載の高周波用熱硬化性樹脂組成物。
- 前記炭化水素系架橋結合性硬化剤は、ジエン系架橋結合性硬化剤であることを特徴とする請求項12に記載の高周波用熱硬化性樹脂組成物。
- 前記炭化水素系架橋結合性硬化剤は、ブタジエン又はそのポリマー、デカジエン又はそのポリマー、及びオクタジエン又はそのポリマーからなる群から選択されるものであることを特徴とする請求項12に記載の高周波用熱硬化性樹脂組成物。
- 前記架橋結合性硬化剤は、前記炭化水素系架橋結合性硬化剤(b1)、3つ以上の官能基を含有する架橋結合性硬化剤(b2)及びスチレン−ブタジエンブロック構造の架橋結合性硬化剤(b3)をb1:b2:b3=1〜20:1〜20:1重量比で含むことを特徴とする請求項12に記載の高周波用熱硬化性樹脂組成物。
- 前記炭化水素系架橋結合性硬化剤の含量は、樹脂組成物の全重量を基準にして、1.65〜15重量%の範囲であることを特徴とする請求項12に記載の高周波用熱硬化性樹脂組成物。
- 前記熱硬化性樹脂組成物は、反応開始剤、及び開始遅延架橋結合性硬化剤であるジ−4−ビニルベンジルエーテルからなる群から選択される1種以上をさらに含むことを特徴とする請求項1に記載の高周波用熱硬化性樹脂組成物。
- 前記難燃剤は、ハロゲン含有難燃剤、リン系難燃剤、アンチモン系難燃剤、及び金属水酸化物からなる群から選択される1種以上であることを特徴とする請求項17に記載の高周波用熱硬化性樹脂組成物。
- 前記開始遅延架橋結合性硬化剤の含量は、樹脂組成物の全重量を基準にして、1〜10重量%の範囲であることを特徴とする請求項17に記載の高周波用熱硬化性樹脂組成物。
- 前記反応開始剤は、α,α’−ビス(t−ブチルペルオキシ−m−イソプロピル)ベンゼン、2,5−ジメチルー2,5−ジ(t−ブチルペルオキシ)−3−ヘキシン、ベンゾイルペルオキシド、3,3’,5,5’−テトラメチル−1,4−ジフェノキシキノン、クロラニル、2,4,6−トリ−t−ブチルフェノキシル、t−ブチルペルオキシイソプロピルモノカーボネート、アゾビスイソブチロニトリル(azobisisobutylonitrile)、及び金属カルボキシレート塩からなる群から選択される1種以上であることを特徴とする請求項17に記載の高周波用熱硬化性樹脂組成物。
- 前記反応開始剤の含量は、ポリフェニレンエーテル100重量部に対して2〜5重量部の範囲であることを特徴とする請求項17に記載の高周波用熱硬化性樹脂組成物。
- ビニル基含有シランカップリング剤で表面処理が施された繊維基材;及び前記繊維基材に含浸された請求項1〜21のいずれか1項に記載の熱硬化性樹脂組成物を含むプリプレグ。
- 前記高周波用熱硬化性樹脂組成物は、1GHzでの誘電率(Dk)が3.6〜3.63であり、1GHzでの誘電正接(Df)が0.0017〜0.0020であり、熱膨張係数(CTE)が1.9〜2.1%の範囲であることを特徴とする請求項23に記載のプリプレグ。
- 前記繊維基材は、ガラスペーパー、ガラス繊維不織布(glass web)、ガラスクロス(glass cloth)及びアラミドペーパー(aramid paper)からなる群から選択された1種以上の材料を含む基材であるものであることを特徴とする請求項22に記載のプリプレグ。
- 金属箔又は高分子フィルム基材;及び前記基材の片面又は両面上に形成され、請求項1〜21のいずれか1項に記載の熱硬化性樹脂組成物が硬化された樹脂層;を含む機能性積層シート。
- 請求項22に記載のプリプレグを1層以上含んで積層成形されるものであることを特徴とする印刷回路基板。
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Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101865649B1 (ko) | 2014-12-22 | 2018-07-04 | 주식회사 두산 | 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판 |
KR102337574B1 (ko) * | 2016-07-12 | 2021-12-13 | 주식회사 두산 | 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판 |
WO2018012775A1 (ko) * | 2016-07-12 | 2018-01-18 | 주식회사 두산 | 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판 |
WO2019112920A1 (en) * | 2017-12-06 | 2019-06-13 | Icl-Ip America Inc. | Additive phosphorus-containing polysiloxane compound for thermosetting resins, flame retardant composition comprising same, and articles made therefrom |
WO2019167391A1 (ja) * | 2018-02-27 | 2019-09-06 | 京セラ株式会社 | プリプレグおよび回路基板用積層板 |
JP7008561B2 (ja) * | 2018-03-29 | 2022-01-25 | 旭化成株式会社 | 特定のフェノールユニットを含む変性ポリフェニレンエーテル及びその製造方法。 |
JP6993922B2 (ja) * | 2018-03-29 | 2022-01-14 | 旭化成株式会社 | 特定のフェノールユニットを含むポリフェニレンエーテルおよびその製造方法。 |
JP7117498B2 (ja) * | 2018-06-26 | 2022-08-15 | パナソニックIpマネジメント株式会社 | 熱硬化性樹脂組成物、樹脂シート、樹脂付き金属箔、金属張積層板、及びプリント配線板 |
JP7289074B2 (ja) * | 2018-08-03 | 2023-06-09 | パナソニックIpマネジメント株式会社 | 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板 |
CN109318116B (zh) * | 2018-09-30 | 2020-10-13 | 赣州龙邦材料科技有限公司 | 基于对位芳纶纸的复合材料晶圆载板及其制造方法 |
CN109836631A (zh) * | 2019-02-02 | 2019-06-04 | 广东生益科技股份有限公司 | 乙烯基热固性树脂组合物、预浸料、层压板和印制电路板 |
CN109852031B (zh) * | 2019-02-02 | 2021-07-30 | 广东生益科技股份有限公司 | 热固性树脂组合物、预浸料、层压板和印制电路板 |
CN114423816A (zh) * | 2019-09-23 | 2022-04-29 | 阿莫绿色技术有限公司 | 射频散热塑料、其制备方法及利用其的中继器盒体 |
CN111605267B (zh) * | 2020-05-28 | 2022-07-05 | 珠海国能新材料股份有限公司 | 一种阻燃烯烃基板及其制备方法 |
CN116490555A (zh) | 2020-12-09 | 2023-07-25 | 三菱瓦斯化学株式会社 | 覆铜箔层叠板及印刷电路板 |
CN116490350A (zh) | 2020-12-09 | 2023-07-25 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、树脂片、覆金属箔层叠板以及印刷电路板 |
CN112592554B (zh) * | 2020-12-15 | 2022-11-29 | 广东生益科技股份有限公司 | 一种电路材料和印刷电路板 |
WO2022130574A1 (ja) | 2020-12-17 | 2022-06-23 | 積水化成品工業株式会社 | ソルダーレジスト用樹脂組成物、ソルダーレジスト膜、及び回路基板 |
KR20230107331A (ko) | 2020-12-17 | 2023-07-14 | 세키스이가세이힝코교가부시키가이샤 | 적층판, 빌드업층이 형성된 적층판, 금속박이 형성된 적층판, 및 회로 기판 |
US20240055308A1 (en) | 2020-12-17 | 2024-02-15 | Sekisui Kasei Co., Ltd. | Resin composition for semiconductor sealing, underfill material, mold resin, and semiconductor package |
TWI795856B (zh) * | 2021-08-02 | 2023-03-11 | 南亞塑膠工業股份有限公司 | 高導熱橡膠樹脂材料及高導熱金屬基板 |
CN118019800A (zh) * | 2021-09-27 | 2024-05-10 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0488054A (ja) * | 1990-08-01 | 1992-03-19 | Asahi Chem Ind Co Ltd | 硬化性ポリフェニレンエーテル系樹脂組成物 |
US20040146692A1 (en) * | 2003-01-28 | 2004-07-29 | Matsushita Electric Works, Ltd. | Poly (phenylene ether) resin composition, prepreg, and laminated sheet |
JP2010195970A (ja) * | 2009-02-26 | 2010-09-09 | Asahi Kasei E-Materials Corp | 変性ポリフェニレンエーテル、それを用いた硬化性樹脂組成物及び硬化性材料、並びに硬化材料及びその積層体 |
JP2013231132A (ja) * | 2012-04-27 | 2013-11-14 | Mitsui Mining & Smelting Co Ltd | 樹脂組成物、樹脂層付金属箔、金属張積層板及びプリント配線板 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0776629A (ja) * | 1993-09-08 | 1995-03-20 | Asahi Chem Ind Co Ltd | 難燃化積層板用プリプレグの製造方法 |
JPH08259797A (ja) * | 1995-03-28 | 1996-10-08 | Asahi Chem Ind Co Ltd | 硬化性ポリフェニレンエーテル系樹脂組成物 |
JPH1112456A (ja) * | 1997-06-24 | 1999-01-19 | Matsushita Electric Works Ltd | 樹脂組成物、プリプレグ及び積層板 |
US6352782B2 (en) * | 1999-12-01 | 2002-03-05 | General Electric Company | Poly(phenylene ether)-polyvinyl thermosetting resin |
US6812276B2 (en) * | 1999-12-01 | 2004-11-02 | General Electric Company | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom |
AU2001243463A1 (en) * | 2000-03-10 | 2001-09-24 | Arc International Plc | Memory interface and method of interfacing between functional entities |
TWI254054B (en) | 2000-12-19 | 2006-05-01 | Ind Tech Res Inst | Curable polyphenylene ether resin, composition made therefrom, and process for preparing the resin |
JP2003311880A (ja) * | 2002-04-23 | 2003-11-06 | Matsushita Electric Works Ltd | 高周波用金属箔張り積層板及びプリント配線板及び多層プリント配線板 |
JP4325337B2 (ja) | 2003-09-19 | 2009-09-02 | 日立化成工業株式会社 | 樹脂組成物、それを用いたプリプレグ、積層板及び多層プリント配線板 |
JP4189003B2 (ja) * | 2003-10-03 | 2008-12-03 | サビック・イノベーティブ・プラスチックス・アイピー・ベスローテン・フェンノートシャップ | 難燃性熱硬化性組成物、方法並びに製品 |
US7595362B2 (en) * | 2004-01-30 | 2009-09-29 | Nippon Steel Chemical Co., Ltd. | Curable resin composition |
US7329708B2 (en) * | 2004-08-18 | 2008-02-12 | General Electric Company | Functionalized poly(arylene ether) composition and method |
TWI404744B (zh) * | 2006-08-08 | 2013-08-11 | Namics Corp | 熱硬化性樹脂組成物及由該樹脂組成物構成之未硬化膜片 |
JP5104507B2 (ja) | 2007-04-26 | 2012-12-19 | 日立化成工業株式会社 | セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
JP2009027423A (ja) * | 2007-07-19 | 2009-02-05 | Sony Computer Entertainment Inc | 通信システム、通信装置、通信プログラム、通信プログラムを記憶したコンピュータ読み取り可能な記憶媒体 |
JP5112827B2 (ja) * | 2007-11-21 | 2013-01-09 | ナミックス株式会社 | 繊維強化未硬化フィルムの製造方法および繊維強化未硬化フィルム |
DE602009000326D1 (de) * | 2008-04-01 | 2010-12-23 | Mitsubishi Gas Chemical Co | Harzzusammensetzung, Prepreg und mit einer Metallfolie kaschiertes Laminat |
US8025926B2 (en) * | 2008-04-23 | 2011-09-27 | Sabic Innovative Plastics Ip B.V. | Varnish compositions for electrical insulation and method of using the same |
US8092722B2 (en) * | 2008-09-30 | 2012-01-10 | Sabic Innovative Plastics Ip B.V. | Varnish compositions for electrical insulation and method of using the same |
US8058359B2 (en) * | 2008-11-10 | 2011-11-15 | Sabic Innovative Plastics Ip B.V. | Varnish compositions for electrical insulation and method of using the same |
JP2011001473A (ja) * | 2009-06-19 | 2011-01-06 | Hitachi Chem Co Ltd | 電子部品用絶縁材料 |
NO2595460T3 (ja) | 2010-07-14 | 2018-03-10 | ||
TWI513747B (zh) * | 2011-06-13 | 2015-12-21 | Nanya Plastics Corp | A high frequency copper foil substrate and the composite material used |
JP6062667B2 (ja) | 2012-06-15 | 2017-01-18 | 旭化成株式会社 | 硬化性樹脂組成物 |
CN102807658B (zh) | 2012-08-09 | 2014-06-11 | 广东生益科技股份有限公司 | 聚苯醚树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
JP6455728B2 (ja) | 2013-06-18 | 2019-01-23 | パナソニックIpマネジメント株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板及びプリント配線板 |
CN103467967A (zh) * | 2013-09-16 | 2013-12-25 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及其用途 |
KR101556658B1 (ko) * | 2013-11-26 | 2015-10-01 | 주식회사 두산 | 내열성 및 저유전 손실 특성을 가진 열경화성 수지 조성물, 이를 이용한 프리프레그, 및 동박적층판 |
CN103709717B (zh) * | 2013-12-17 | 2017-10-20 | 中山台光电子材料有限公司 | 乙烯苄基醚化‑dopo化合物树脂组合物及制备和应用 |
KR101865649B1 (ko) | 2014-12-22 | 2018-07-04 | 주식회사 두산 | 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판 |
JP6847645B2 (ja) | 2016-11-30 | 2021-03-24 | ミネベアミツミ株式会社 | 樹脂潤滑用グリース組成物、樹脂歯車装置及び車載用空調処理システムのアクチュエータ |
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2015
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- 2015-12-21 JP JP2017551981A patent/JP6684822B2/ja active Active
- 2015-12-21 CN CN201910249515.8A patent/CN109912958B/zh active Active
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0488054A (ja) * | 1990-08-01 | 1992-03-19 | Asahi Chem Ind Co Ltd | 硬化性ポリフェニレンエーテル系樹脂組成物 |
US20040146692A1 (en) * | 2003-01-28 | 2004-07-29 | Matsushita Electric Works, Ltd. | Poly (phenylene ether) resin composition, prepreg, and laminated sheet |
JP2006516297A (ja) * | 2003-01-28 | 2006-06-29 | 松下電工株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、積層板 |
JP2010195970A (ja) * | 2009-02-26 | 2010-09-09 | Asahi Kasei E-Materials Corp | 変性ポリフェニレンエーテル、それを用いた硬化性樹脂組成物及び硬化性材料、並びに硬化材料及びその積層体 |
JP2013231132A (ja) * | 2012-04-27 | 2013-11-14 | Mitsui Mining & Smelting Co Ltd | 樹脂組成物、樹脂層付金属箔、金属張積層板及びプリント配線板 |
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CN107109049A (zh) | 2017-08-29 |
JP7370310B2 (ja) | 2023-10-27 |
CN109912958B (zh) | 2022-01-21 |
JP6684822B2 (ja) | 2020-04-22 |
KR101865649B1 (ko) | 2018-07-04 |
US20170342264A1 (en) | 2017-11-30 |
US10584239B2 (en) | 2020-03-10 |
JP2019090037A (ja) | 2019-06-13 |
JP2018504511A (ja) | 2018-02-15 |
US20190284393A1 (en) | 2019-09-19 |
KR20160076447A (ko) | 2016-06-30 |
US10590272B2 (en) | 2020-03-17 |
CN107109049B (zh) | 2020-10-13 |
CN109912958A (zh) | 2019-06-21 |
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