JP2021054552A - 位置関係検出システム - Google Patents
位置関係検出システム Download PDFInfo
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- H—ELECTRICITY
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
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- B65G1/0457—Storage devices mechanical with suspended load carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/137—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0297—Wafer cassette
Abstract
Description
以下、その他の実施形態について説明する。尚、以下に説明する各実施形態の構成は、それぞれ単独で適用されるものに限られず、矛盾が生じない限り、他の実施形態の構成と組み合わせて適用することも可能である。
以下、上記において説明した位置関係検出システムの概要について簡単に説明する。
2 :第2ユニット
3 :センサユニット
4 :被検出ユニット
12 :挿抜口
13 :スリット
14 :蓋部
20 :物品搬送車
24 :物品保持部
28 :移載装置
40 :被検出面
41 :第1傾斜平面(傾斜平面)
42 :第2傾斜平面(傾斜平面)
43 :螺旋状面
50 :非傾斜平面(傾きを検出するための被検出面で基準面に平行な面)
51 :第1非傾斜平面(被傾斜平面)
52 :第2非傾斜平面(被傾斜平面)
53 :第3非傾斜平面(被傾斜平面)
100 :位置関係検出システム
200 :物品搬送設備
C :基準軸
D1 :第1方向
D2 :第2方向
K :距離
L :距離
P0 :基準面
Q :検出基準点
R :被検出点
W :物品
θ :回転角度
φ :傾き
Claims (6)
- 搬送元及び搬送先の移載箇所との間で物品を移載する移載装置を備えて前記搬送元と前記搬送先との間で物品を搬送する物品搬送車を備えた物品搬送設備において、前記移載装置が備える物品保持部の前記移載箇所に対する位置関係を検出する位置関係検出システムであって、
前記物品保持部に保持される第1ユニットと、
前記移載箇所に設置される第2ユニットと、を備え、
前記第1ユニット及び前記第2ユニットの一方はセンサユニットであり、他方は前記センサユニットによる検出対象を備えた被検出ユニットであり、
前記センサユニットは、当該センサユニットにおける検出基準点から前記被検出ユニットに設定された複数の被検出点までの距離を検出し、
前記被検出ユニットは、前記移載箇所において前記センサユニットに対向するように設定された基準面に沿った第1方向及び前記基準面に沿うと共に前記第1方向に直交する第2方向における、前記移載箇所に対する前記物品保持部の相対位置を示す平面相対位置、前記基準面に対する前記物品保持部の傾き、前記基準面に直交する基準軸周りの前記物品保持部の回転角度、の内の少なくとも2つを前記検出基準点からの距離に応じた値として検出可能な複数の被検出面を備えて立体的に形成されている、位置関係検出システム。 - 前記第1方向における前記平面相対位置を検出する前記被検出面は、前記第1方向の一方側へ向かうに従って前記検出基準点からの距離が一定の割合で増加するように配置された傾斜平面であり、
前記第2方向における前記平面相対位置を検出する前記被検出面は、前記第2方向の一方側へ向かうに従って前記検出基準点からの距離が一定の割合で増加するように配置された傾斜平面である、請求項1に記載の位置関係検出システム。 - 前記傾きを検出する前記被検出面は、少なくとも3箇所に設けられ、前記傾きが無い場合に前記検出基準点からの距離が同じとなるように配置された、前記基準面に平行な面である、請求項1又は2に記載の位置関係検出システム。
- 前記回転角度を検出する前記被検出面は、前記基準軸周りに一方側に旋回するに従って前記検出基準点からの距離が一定の割合で増加するように配置された螺旋状面である、請求項1から3の何れか一項に記載の位置関係検出システム。
- 前記基準面に沿う各方向における前記被検出面の幅は、前記移載箇所と前記物品保持部との理論上のずれの最大値より大きい、請求項1から4の何れか一項に記載の位置関係検出システム。
- 前記物品は、複数の基板を収容する収納容器であり、
前記収納容器は、複数の前記基板のそれぞれを保持する複数のスリットと、当該スリットに前記基板を出し入れするための挿抜口と、前記挿抜口を閉じる蓋部と、を備え、
前記センサユニットは、前記スリットによって支持されると共に、前記蓋部によって前記スリットに沿う方向の位置決めが行われている、請求項1から5の何れか一項に記載の位置関係検出システム。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019177157A JP7192732B2 (ja) | 2019-09-27 | 2019-09-27 | 位置関係検出システム |
TW109127243A TWI841772B (zh) | 2019-09-27 | 2020-08-11 | 位置關係檢測系統 |
KR1020200123591A KR20210038338A (ko) | 2019-09-27 | 2020-09-24 | 위치 관계 검출 시스템 |
CN202011022343.XA CN112577453A (zh) | 2019-09-27 | 2020-09-25 | 位置关系检测系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019177157A JP7192732B2 (ja) | 2019-09-27 | 2019-09-27 | 位置関係検出システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021054552A true JP2021054552A (ja) | 2021-04-08 |
JP7192732B2 JP7192732B2 (ja) | 2022-12-20 |
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Application Number | Title | Priority Date | Filing Date |
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JP2019177157A Active JP7192732B2 (ja) | 2019-09-27 | 2019-09-27 | 位置関係検出システム |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7192732B2 (ja) |
KR (1) | KR20210038338A (ja) |
CN (1) | CN112577453A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113899328A (zh) * | 2021-09-26 | 2022-01-07 | 大连理工大学 | 一种连轴装配式大齿轮渐开线样板 |
FR3128525A1 (fr) * | 2021-10-27 | 2023-04-28 | Safran Aircraft Engines | Mesure angulaire sur hélice |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113830664B (zh) * | 2021-09-18 | 2023-06-20 | 上海应用技术大学 | 一种双工位智能化悬挂式自动搬运小车 |
CN115123775B (zh) * | 2022-07-12 | 2023-07-11 | 浙江衣拿智能科技股份有限公司 | 一种重型衣物的运输路线选择方法、装置及电子设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049407A (ja) * | 1983-08-29 | 1985-03-18 | Daifuku Co Ltd | 無人車 |
JP3056346B2 (ja) * | 1993-03-11 | 2000-06-26 | 三菱電機株式会社 | 光学式回転角度検出装置 |
JP2016047747A (ja) * | 2014-08-27 | 2016-04-07 | 村田機械株式会社 | 移載位置決定方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049407B2 (ja) * | 1979-04-19 | 1985-11-01 | 三井東圧化学株式会社 | 木目状模様付ポリスチレンシ−トの製造方法 |
JPS6024336A (ja) | 1983-07-20 | 1985-02-07 | Agency Of Ind Science & Technol | 水素貯蔵用合金 |
JP5491435B2 (ja) * | 2011-02-25 | 2014-05-14 | キヤノン株式会社 | 計測装置 |
JP6531638B2 (ja) * | 2015-12-09 | 2019-06-19 | 株式会社ダイフク | 物品搬送設備 |
JP6471702B2 (ja) * | 2016-01-12 | 2019-02-20 | 株式会社ダイフク | 物品搬送装置 |
JP6690497B2 (ja) * | 2016-10-28 | 2020-04-28 | 株式会社ダイフク | 物品搬送設備 |
-
2019
- 2019-09-27 JP JP2019177157A patent/JP7192732B2/ja active Active
-
2020
- 2020-09-24 KR KR1020200123591A patent/KR20210038338A/ko unknown
- 2020-09-25 CN CN202011022343.XA patent/CN112577453A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049407A (ja) * | 1983-08-29 | 1985-03-18 | Daifuku Co Ltd | 無人車 |
JP3056346B2 (ja) * | 1993-03-11 | 2000-06-26 | 三菱電機株式会社 | 光学式回転角度検出装置 |
JP2016047747A (ja) * | 2014-08-27 | 2016-04-07 | 村田機械株式会社 | 移載位置決定方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113899328A (zh) * | 2021-09-26 | 2022-01-07 | 大连理工大学 | 一种连轴装配式大齿轮渐开线样板 |
CN113899328B (zh) * | 2021-09-26 | 2022-06-14 | 大连理工大学 | 一种连轴装配式大齿轮渐开线样板 |
FR3128525A1 (fr) * | 2021-10-27 | 2023-04-28 | Safran Aircraft Engines | Mesure angulaire sur hélice |
Also Published As
Publication number | Publication date |
---|---|
KR20210038338A (ko) | 2021-04-07 |
CN112577453A (zh) | 2021-03-30 |
TW202114034A (zh) | 2021-04-01 |
JP7192732B2 (ja) | 2022-12-20 |
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