JP2021024950A - 粘着シート - Google Patents

粘着シート Download PDF

Info

Publication number
JP2021024950A
JP2021024950A JP2019143869A JP2019143869A JP2021024950A JP 2021024950 A JP2021024950 A JP 2021024950A JP 2019143869 A JP2019143869 A JP 2019143869A JP 2019143869 A JP2019143869 A JP 2019143869A JP 2021024950 A JP2021024950 A JP 2021024950A
Authority
JP
Japan
Prior art keywords
adhesive sheet
sensitive adhesive
pressure
meth
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019143869A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021024950A5 (enrdf_load_stackoverflow
Inventor
秋山　淳
Atsushi Akiyama
淳 秋山
浩二 水野
Koji Mizuno
浩二 水野
優樹 東別府
Yuki Higashibeppu
優樹 東別府
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2019143869A priority Critical patent/JP2021024950A/ja
Priority to KR1020200094279A priority patent/KR20210018078A/ko
Priority to TW109125549A priority patent/TW202113006A/zh
Priority to CN202010773237.9A priority patent/CN112322204A/zh
Publication of JP2021024950A publication Critical patent/JP2021024950A/ja
Publication of JP2021024950A5 publication Critical patent/JP2021024950A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C09J2423/106—Presence of homo or copolymers of propene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C09J2425/006—Presence of styrenic polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
JP2019143869A 2019-08-05 2019-08-05 粘着シート Pending JP2021024950A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019143869A JP2021024950A (ja) 2019-08-05 2019-08-05 粘着シート
KR1020200094279A KR20210018078A (ko) 2019-08-05 2020-07-29 점착 시트
TW109125549A TW202113006A (zh) 2019-08-05 2020-07-29 黏著片材
CN202010773237.9A CN112322204A (zh) 2019-08-05 2020-08-04 粘合片

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019143869A JP2021024950A (ja) 2019-08-05 2019-08-05 粘着シート

Publications (2)

Publication Number Publication Date
JP2021024950A true JP2021024950A (ja) 2021-02-22
JP2021024950A5 JP2021024950A5 (enrdf_load_stackoverflow) 2022-03-15

Family

ID=74304368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019143869A Pending JP2021024950A (ja) 2019-08-05 2019-08-05 粘着シート

Country Status (4)

Country Link
JP (1) JP2021024950A (enrdf_load_stackoverflow)
KR (1) KR20210018078A (enrdf_load_stackoverflow)
CN (1) CN112322204A (enrdf_load_stackoverflow)
TW (1) TW202113006A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7096417B1 (ja) 2021-12-06 2022-07-05 ニチバン株式会社 粘着テープ

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6269640A (ja) * 1985-09-24 1987-03-30 Nippon Carbide Ind Co Ltd ウエハダイシング用貼着フイルム
JPH03171627A (ja) * 1989-08-01 1991-07-25 Mitsui Toatsu Chem Inc ウエハ加工用フィルム
JP2004303999A (ja) * 2003-03-31 2004-10-28 Lonseal Corp ウエハダイシング用粘着テープ
JP2007314636A (ja) * 2006-05-24 2007-12-06 Nitto Denko Corp 粘着シート
WO2014003312A1 (ko) * 2012-06-27 2014-01-03 주식회사 트루윈 갭보정 인덕턴스방식 앵글센서 및 그 신호처리방법
WO2014103468A1 (ja) * 2012-12-28 2014-07-03 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
WO2016075753A1 (ja) * 2014-11-11 2016-05-19 株式会社寺岡製作所 発泡樹脂基材を有する粘着テープ及びその製造方法
JP2017171772A (ja) * 2016-03-23 2017-09-28 日東電工株式会社 粘着シート
WO2018003312A1 (ja) * 2016-06-30 2018-01-04 リンテック株式会社 半導体加工用シート

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001207140A (ja) 2000-01-26 2001-07-31 Sumitomo Bakelite Co Ltd 半導体ウエハ加工用粘着シート
JP2010260893A (ja) 2009-04-30 2010-11-18 Nitto Denko Corp 積層フィルム及び半導体装置の製造方法
JP6587811B2 (ja) * 2015-02-24 2019-10-09 日東電工株式会社 熱剥離型粘着シート

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6269640A (ja) * 1985-09-24 1987-03-30 Nippon Carbide Ind Co Ltd ウエハダイシング用貼着フイルム
JPH03171627A (ja) * 1989-08-01 1991-07-25 Mitsui Toatsu Chem Inc ウエハ加工用フィルム
JP2004303999A (ja) * 2003-03-31 2004-10-28 Lonseal Corp ウエハダイシング用粘着テープ
JP2007314636A (ja) * 2006-05-24 2007-12-06 Nitto Denko Corp 粘着シート
WO2014003312A1 (ko) * 2012-06-27 2014-01-03 주식회사 트루윈 갭보정 인덕턴스방식 앵글센서 및 그 신호처리방법
WO2014103468A1 (ja) * 2012-12-28 2014-07-03 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
WO2016075753A1 (ja) * 2014-11-11 2016-05-19 株式会社寺岡製作所 発泡樹脂基材を有する粘着テープ及びその製造方法
JP2017171772A (ja) * 2016-03-23 2017-09-28 日東電工株式会社 粘着シート
WO2018003312A1 (ja) * 2016-06-30 2018-01-04 リンテック株式会社 半導体加工用シート

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7096417B1 (ja) 2021-12-06 2022-07-05 ニチバン株式会社 粘着テープ
JP2023084028A (ja) * 2021-12-06 2023-06-16 ニチバン株式会社 粘着テープ

Also Published As

Publication number Publication date
CN112322204A (zh) 2021-02-05
TW202113006A (zh) 2021-04-01
KR20210018078A (ko) 2021-02-17

Similar Documents

Publication Publication Date Title
JP6807234B2 (ja) 粘着シート
KR101643793B1 (ko) 점착제 및 점착 시트
JP2008047558A (ja) 反り抑制ウエハ研削用粘着シート
TWI808170B (zh) 半導體晶片之製造方法
JP5406110B2 (ja) 半導体ウエハ加工用粘着シート
JP7017464B2 (ja) 感温性粘着シートおよび積層体
TWI754679B (zh) 半導體加工用黏著片
JP2010209158A (ja) 粘着シート及びそれを用いた半導体ウェハの加工方法
JP2021024950A (ja) 粘着シート
JP2020155689A (ja) ダイシングテープ
TWI702644B (zh) 半導體加工板片
CN119463719A (zh) 粘合片和切割－芯片接合膜
JP2021024949A (ja) 粘着シート
TWI713692B (zh) 半導體加工板片
CN113286860B (zh) 工件加工用粘着片及其制造方法
JP7296944B2 (ja) ワーク加工用シート
JP6006953B2 (ja) 電子部品加工用粘着シートおよび半導体装置の製造方法
WO2024185378A1 (ja) 粘着シートおよび粘着シートのリサイクル方法
JP2024107808A (ja) 粘着シート及び半導体装置の製造方法
JP2022151239A (ja) ワーク処理用シートおよび処理済みワーク製造方法
CN112521878A (zh) 粘合带
JP2022092836A (ja) 半導体加工用粘着シート及び半導体装置の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220307

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220307

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20221214

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230110

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230306

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230613

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20231205